HSDL-3200
IrDA
®
Data 1.4 Compliant
115.2 Kb/s Infrared Transceiver
Data Sheet
Description
The HSDL-3200 is a new generation of low-cost
Infrared (IR) transceiver module from
Lite-On
Technology.
It features the smallest footprint in
the industry at 2.5 H x 8.0 W x 3.0 D mm. The
supply voltage can range from 2.7 V to 3.6 V.
The LED drive current of 25 mA assures that link
distances meet the IrDA Data 1.4 (low power)
physical layer specification.
The HSDL-3200 meets the link distance of 20 cm to
other low power devices, and 30 cm to standard 1
meter IrDA devices.
Features
• Fully compliant to IrDA data 1.4 low power
specifications
• Ultra small package
• Minimal height: 2.5 mm
• 2.7 to 3.6 V
CC
• Low shutdown current
– 10 nA Typical
• Complete shutdown
– TXD, RXD, PIN diode
• Three external components
• Temperature performance guaranteed, –25°C to +85°C
• 25 mA LED drive current
• Integrated EMI shield
• IEC825-1 Class 1 eye safe
• Edge detection input
– Prevents the LED from long turn-on time
• Lead-free and RoHS compliant
V
CC
R1
47
Ω
8 LEDA
LED
DRIVER
TXD
7 TXD
Applications
6 RXD
5 SD
SHIELD
RXD
SHUT DOWN
4 AGND
V
CC
C1
6.8 µF
3
2
C2
100 nF
V
CC
CX
RIX PULSE
SHAPER
1 GND
• Mobile telecom
– Cellular phones
– Pagers
– Smart phones
• Data communication
– PDAs
– Portable printers
• Digital imaging
– Digital cameras
– Photo-imaging printers
• Electronic wallet
HSDL-3200#021 Pinout
8
7
6
5
4
3
2
1
HSDL-3200-028 Pinout
8
7
6
5
4
3
2
1
I/O Pins Configuration Table
Pin
1
2
3
4
5
6
7
8
Description
Ground
Pin Bypass Capacitor
Supply Voltage
Analog Ground
Shut Down
Receiver Data Output
Transmitter Data Input
LED Anode
Symbol
GND
CX
V
CC
AGND
SD
RXD
TXD
LEDA
Active
Note
High
Low
High
1
Note:
1. The shutdown pin (SD) must be driven either high or low. Do NOT float the pin.
Transceiver I/O Truth Table
TXD
High
Low
Low
Don’t Care
Inputs
Light Input to Receiver
Don’t Care
High
Low
Don’t Care
Outputs
SD
Low
Low
Low
High
LED
On
Off
Off
Off
RXD
Not Valid
Low
High
High
Notes
2, 3
Notes:
2. In-Band IrDA signals and data rates
≤115.2
Kb/s.
3. RXD Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity.
Ordering Information
The ordering information is as shown
in the table below. There are two
options available.
Front Option
#021
Taped and 13” Reel
packaging, 2500 per reel
Top Option
–028
Taped and 13” Reel
Packaging, 2500 per reel
Recommended Application Circuit Components
Component
R1
C1
C2
Recommended Value
47
Ω, ±
1%, 0.125 Watt
6.8
µF, ±
20%, Tantalum
100 nF,
±
20%, X7R Ceramic
Note
4
Note:
4. C1 must be placed within 0.7 cm of the HSDL-3200 to obtain optimum noise immunity.
Caution:
The BiCMOS inherent to this design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
2
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance
≤
50°C/W.
Parameter
Symbol
Min.
Max.
Storage Temperature
T
S
–40
100
Operating Temperature
T
A
–25
85
DC LED Current
I
LED
(DC)
20
Peak LED Current
I
LED
(PK)
80
LED Anode Voltage
Supply Voltage
Input Voltage TXD, SD
Output Voltage RXD
V
LEDA
V
CC
V
I
V
O
–0.5
0
0
–0.5
7
7
V
CC
+0.5
V
CC
+0.5
Units
°C
°C
mA
mA
V
V
V
V
Conditions
≤
90
µs
Pulse Width,
≤25%
Duty Cycle
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Logic High Voltage
TXD, SD
Logic Low Voltage
TXD, SD
Logic High Receiver
Input Irradiance
Logic Low Receiver
Input Irradiance
LED Current Pulse
Amplitude
Receiver Signal Rate
Ambient Light
Symbol
T
A
V
CC
V
IH
V
IL
EI
H
EI
L
I
LEDA
25
2.4
Min.
–25
2.7
2/3 V
CC
0
0.0081
Max.
85
3.6
V
CC
1/3 V
CC
500
0.3
80
115.2
Units
°C
V
V
V
mW/cm
2
µW/cm
2
mA
Kb/s
See “Test Methods”
on page 12 for details
For in-band signals.
For in-band signals.
Guaranteed at 25°C
5
5
Conditions
Notes
Note:
5. An in-band optical signal is a pulse/sequence where the peak wavelength,
lp,
is defined as 850 nm
≤
lp
≤
900 nm, and the pulse characteristics
are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
3
Electrical and Optical Specifications
Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test
conditions can be anywhere in their operating range. All typical values are at 25°C and 3.0 V unless
otherwise noted.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Receiver
RXD
Logic Low
V
OL
0
0.4
V
I
OL
= 200
µA,
For in-band EI
Output Voltage Logic High
V
OH
V
CC
V
CC
V
I
OH
= –200
µA,
For in-band
–0.2
EI
≤0.3 µW/cm
2
Viewing Angle
2f
1/2
30
°
Peak Sensitivity Wavelength
lp
880
nm
RXD Pulse Width
tpw
1.5
2.5
4.0
µs
RXD Rise and Fall Times
tr, tf
25
100
ns
tpw (EI) = 1.6
µs,
C
L
= 10 pF
Receiver Latency Time
t
L
25
50
µs
Receiver Wake Up Time
t
W
50
100
µs
Transmitter
Radiant Intensity
EI
H
4
8
28.8
mW/Sr I
LEDA
= 25 mA, T
A
= 25°C,
q
1/2
≤15°
Peak Wavelength
lp
875
nm
Spectral Line Half Width
Dl
1/2
35
nm
Viewing Angle
2q
1/2
30
60
°
Optical Pulse Width
tpw
1.5
1.6
2
µs
tpw (TXD) = 1.6
µs
Optical Rise and Fall Times
tr (EI)
600
ns
tpw (TXD) = 1.6
µs
tf (EI)
Maximum Optical
tpw
20
50
µs
TXD pin stuck high
Pulse Width
(max)
LED Anode On State
V
ON
1.6
V
I
LEDA
= 25 mA,
Voltage
(LEDA)
V
IH
(TXD) = 2.7 V
LED Anode Off State
I
LK
0.01
1.0
µA
V
LEDA
= V
CC
= 3.6 V,
Leakage
(LEDA)
V
I
(TXD)
≤
1/3 V
CC
Transceiver
TXD and SD
Logic Low
I
L
–1
–0.01 1
µA
0
≤
V
I
≤
1/3 V
CC
Input Current
Logic High
I
H
0.01
1
µA
V
I
≥
2/3 V
CC
Supply Current Shutdown
I
CC1
10
200
nA
V
CC
= 3.6 V, V
SD
≥
V
CC
–0.5
Idle
I
CC2
2.5
4
mA
V
CC
= 3.6 V,
V
I
(TXD)
≤
1/3 V
CC
, EI = 0
Active
I
CC3
2.6
5
mA
V
CC
= 3.6 V,
Receiver
V
I
(TXD)
≤
1/3 V
CC
Notes:
6. For in-band signals
≤
115.2 Kb/s where 8.1
µW/cm
2
≤
EI
≤
500 mW/cm
2
.
7. Wake up time is measured from SD pin high to low transition or V
CC
power on to valid RXD output.
8. Typical value is at EI = 10 mW/cm
2
.
9. Maximum value is at EI = 500 mW/cm
2
.
Note
6
6
6
7
8, 9
4
HDSL-3200#021 Package Dimensions
SOLDERING PATTERN
MOUNTING
CENTER
4
1.025
1.425
0.775
1.25
MOUNTING
CENTER
1.35
C
L
EXTERNAL
GROUND
1.75
0.6
RECEIVER
2.05
C
L
EMITTER
0.475
1.425
2.375
3.325
2.2
2.5
1.175
;;;;
;;;;
;;
;;;
2.85
1.05
1.25
2.55
4
8
3
2.9
1.85
UNIT: mm
TOLERANCE: ± 0.2mm
0.35
0.65
0.80
C
L
8
7
6
5
4
3
2
1
0.6
3.325
P0.95X7 = 6.65
1
GND
2
CX
3
V
CC
4
AGND
5
SD
6
RXD
7
TXD
8
LEDA
HSDL-3200#021 Tape and Reel Dimensions
UNIT: mm
2.0 ± 0.5
∅13.0
± 0.5
R1.0
A
21 ± 0.8
;
;
B
2 ± 0.5
TAPE DIMENSIONS
4 ± 0.1
+ 0.1
∅1.5
0
POLARITY
PIN 8: LEDA
8.4 ± 0.1
PIN 1: GND
3.4 ± 0.1
0.4 ± 0.05
2.8 ± 0.1
8 ± 0.1
PROGRESSIVE DIRECTION
1.75 ± 0.1
1.5 ± 0.1
7.5 ± 0.1
16.0 ± 0.2
EMPTY
PARTS MOUNTED
LABEL
(40 mm MIN.)
LEADER
(400 mm MIN.)
EMPTY
(40 mm MIN.)
2
16.4 + 0
OPTION #
0S1
0L1
DIMENSION A
(± 1 mm)
178
330
DIMENSION B
(± 2 mm)
60
80
QUANTITY
(POS/REEL)
500
2500
5
MCU
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