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Community Focus
The automotive thermal management chip market is changing.
- [robot]Tesla's Optimus robot hand patent was abandoned; Musk admitted the design wouldn't work.
- [Mobile phone portable]Tim Cook officially "hands over the reins": After 15 years at the helm of Apple, he steps down as CEO. What did he say in his internal letter?
- [Automotive Electronics]The automotive thermal management chip market is changing.
- [semiconductor]India’s first 3D advanced packaging facility, valued at 19.4 billion rupees, has broken ground in Odisha.
- [Automotive Electronics]Samsung SDI enters Mercedes-Benz's supply chain for the first time, providing power batteries for the next generation of electric vehicles.
- [Embedded]Gods besiege C2000
- [Embedded]Linux 7.1 officially removed support for Intel 486, marking the end of the classic architecture.
- [Mobile phone portable]Reports indicate that Apple will absorb the DRAM memory cost burden, and the price of the iPhone 18 Pro/Max will not increase.
- [Automotive Electronics]How does Nanochip Microelectronics lead the centralized thermal management market by seizing a market opportunity worth hundreds of millions of yuan?
- [semiconductor]Samsung Electronics labor dispute escalates: Employees plan an 18-day strike, demanding a share of approximately $30 billion.
- [Network Communication]Meta announces multi-billion dollar deep chip collaboration with Broadcom
- [Embedded]On the eve of a breakthrough in optical computing: Will it replace GPUs?
- [Automotive Electronics]In China, for China 2.0: Infineon Embraces a New Cycle of Automotive Intelligence
- [Embedded]From the cloud to the edge, and then to the physical world: Microchip is reshaping the path to AI deployment.
- [Semiconductor design/manufacturing]Data centers enter the "megawatt era," with China's infrastructure supporting a new future for computing power.
- [Automotive Electronics]Starting from system complexity, ADI Automotive Electronics' dual-platform approach
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Each intelligent agent PC is a new gateway to the AI era.
AI's transformation of personal computing is moving from "tool enhancement" to a new stage of "intelligent partner." This is driven by the powerful performance of Intel® Core™ Ultra and Intel® Core™ processors. ...[details]
The "Pocket Hasselblad" OPPO Find X9 Ultra debuts, powered by the fifth-generation Snapdragon 8 Ultra for professional mobile photography creation.
On April 21, 2026, OPPO officially launched its annual flagship imaging phone, the OPPO Find X9 Ultra, as well as two flagship tablet products: the OPPO Pad 5 Pro and the OPPO Pad Mini. Among them, the OPPO... ...[details]
CATL's "second-generation sodium-ion battery" is here! Are you looking forward to it?
What about sodium-ion batteries? It seems the first-generation technology hasn't even been widely adopted in new energy vehicles yet, and the second-generation sodium-ion battery technology is already on its way. Are you optimistic about it? (New Energy Vehicle Talk, April 21) ...[details]
Mass production countdown begins; solid-state batteries for electric vehicles achieve major breakthrough.
When a steel needle pierces the battery, the monitoring screen shows no flames or smoke, only a steady data curve—this scene, which took place in the Giant Bay R&D Laboratory, may become a landmark event in the global power battery industry. ...[details]
The next five years for intelligent connected vehicles: Key priorities begin.
The Ministry of Industry and Information Technology (MIIT) has released a signal regarding the launch of the next five-year plan. On April 21, MIIT spokesperson Tao Qing clarified one thing: the "15th Five-Year Plan" for intelligent connected new energy vehicles will be accelerated. ...[details]
Nissan's all-solid-state battery achieves performance targets; mass production expected in fiscal year 2028.
Nissan Motor Co. announced at a recent technology briefing that it has completed performance testing on its prototype all-solid-state battery pack for pure electric vehicles, bringing it one step closer to its mass production plan for fiscal year 2028. ...[details]
Does adding more LiDAR sensors to autonomous driving systems make fusion more difficult?
In autonomous driving, LiDAR (Light Detection and Ranging) has always been considered the eyes of the vehicle. With increasing technological competition, many solutions now incorporate three or even four LiDAR sensors instead of just one. ...[details]
Building Network-Resilient Embedded Systems: Insights from Industry Leaders
As connected devices become ubiquitous in our lives, the demand for robust embedded security has reached unprecedented levels. This was discussed in a recent meeting with a leading embedded systems and microcontroller supplier. ...[details]
EDFAS Asia Premiere! NVIDIA, TSMC, Qualcomm, and iST, among others, overcome the challenges of CPO and advanced packaging failure analysis in the AI era.
EDFAS Asia Premiere! NVIDIA, TSMC, Qualcomm, and iST, among others, overcome the challenges of CPO and advanced packaging failure analysis (FA) in the AI era. [Image caption: iST Chairman Yu Weibin and the first EDFAS event in Asia] ...[details]
STMicroelectronics Introduces Power Management Chip for STM32 Industrial Microprocessors
STPMIC1L and STPMIC2L Enable Monolithic Power Supply, Voltage Monitoring, and Circuit Protection Functions. April 21, 2026, China — STMicroelectronics' STPMIC1L and STPMIC2L power management chips (PM... ...[details]
ROHM has developed a 5th generation SiC MOSFET that reduces on-resistance by approximately 30% at high temperatures!
Shanghai, China, April 21, 2026 – ROHM, a leading global semiconductor manufacturer headquartered in Kyoto, Japan, today announced the development of its next-generation EcoSiC™ – the “5th Generation SiC MOSFET”. ...[details]
Nidec (Suzhou) was invited to participate in the 14th China International Automotive Powertrain Summit (IAPS2026).
From March 31st to April 1st, 2026, the 14th China International Automotive Powertrain Summit (IAPS2026), themed "Zero-Carbon Powertrain Revolution: From Technological Breakthroughs to System Restructuring," was held in Shanghai. ...[details]
NSI6911F series, the first domestically produced ASIL D-level isolated gate driver from Naxin Microelectronics, has been certified by TÜV Rheinland.
Nanochip today announced the launch of the NSI6911F series, China's first domestically produced isolated gate driver based on a fully domestic supply chain, certified by TÜV Rheinland, and meeting ISO 26262 ASIL D level. This series of products... ...[details]
SABIC showcases its enhanced high-performance material solutions at CHINAPLAS 2026, the international exhibition for rubber and plastics.
SABIC, a world-renowned diversified chemical company, showcased its products and services at CHINAPLAS 2026 in Shanghai under the theme "Gathering Momentum to Reach New Heights and Shape a New Future." ...[details]
Littelfuse/C&K Introduces TDB Series of Ultra-Miniature Half-Pitch Surface Mount DIP Switches
New gold-plated, washable DIP switches enable high-density PCB layouts in space-constrained designs. Rosemount, Illinois, USA; Shanghai, China — April 21, 2026 — For safety ...[details]
Mouser has launched the ams OSRAM VEGALED KRTTB CRLML1.33 full-color RGB LED for smart and machine vision applications.
April 21, 2026 – Mouser Electronics, a global authorized distributor of electronic components and industrial automation products focused on introducing new products, is now selling ams OSRAM products. ...[details]
Advantech unveils a groundbreaking full-stack solution for the robotics industry – leading the large-scale deployment of robots with AI technology.
Driven by the global wave of smart manufacturing and intelligent automation, robotics technology is ushering in a golden age of large-scale application. Recently, Advantech officially released its full-stack robotics solution centered on AI technology. ...[details]
The thermal management sector has become popular following the "robotics half marathon".
In the electronics industry, thermal management has always been a crucial issue, and the same applies to robots. At the inaugural humanoid robot half marathon in 2025, instances of "alcohol spraying for cooling" and "fanning for heat dissipation" were frequently observed. ...[details]
Digital linear regulator
Abstract: A new product type has emerged in the industry: digital low-dropout (LDO) linear regulators. These solutions are extremely small in size, provide telemetry and adjustability of linear power supplies, and are commonly used in [various applications]. ...[details]
QNX and NVIDIA are deepening their collaboration to jointly promote the development of safety-critical edge AI for robotics, healthcare, and industrial applications.
QNX OS for Safety 8.0 and NVIDIA IGX Thor: Providing a unified solution for the industrial edge that integrates real-time control, functional safety, and AI capabilities. Shanghai, China – April 21, 2026 ...[details]
Chiplink Integrated's revenue increased by 25.67% in 2025, and its gross profit margin improved further in Q1 2026, with AI and new energy driving its strong performance.
On April 21, Chiplink Integrated Circuits officially released its 2025 annual report and 2026 first-quarter report. The financial reports show that the company's performance steadily improved in 2025, with continued expansion of revenue and significant profitability. ...[details]
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GXMMW.BF0EPA2More Latest Articles
- The thermal management sector has become popular following the "robotics half marathon".[机器人]
- Tesla's Optimus robot hand patent was abandoned; Musk admitted the design wouldn't work.[机器人]
- Tim Cook officially "hands over the reins": After 15 years at the helm of Apple, he steps down as CEO. What did he say in his internal letter?[综合资讯]
- India’s first 3D advanced packaging facility, valued at 19.4 billion rupees, has broken ground in Odisha.[市场动态]
- Samsung SDI enters Mercedes-Benz's supply chain for the first time, providing power batteries for the next generation of electric vehicles.[行业动态]
- Reports indicate that Google is in talks with Marvell to collaborate on developing two AI chips, aiming to challenge Nvidia's dominant position.[综合资讯]
- Linux 7.1 officially removed support for Intel 486, marking the end of the classic architecture.[嵌入式操作系统]
- Reports indicate that Apple will absorb the DRAM memory cost burden, and the price of the iPhone 18 Pro/Max will not increase.[综合资讯]
- Intelligent driving, robotics, and intelligent industrial sensing upgrades: Sensor Shenzhen's multi-sensor solutions cover all aspects.[综合资讯]
- Samsung Electronics labor dispute escalates: Employees plan an 18-day strike, demanding a share of approximately $30 billion.[市场动态]
- Meta announces multi-billion dollar deep chip collaboration with Broadcom[综合资讯]
- In China, for China 2.0: Infineon Embraces a New Cycle of Automotive Intelligence[行业动态]
- From the cloud to the edge, and then to the physical world: Microchip is reshaping the path to AI deployment.[综合资讯]
- Starting from system complexity, ADI Automotive Electronics' dual-platform approach[行业动态]
- Intel's "Nova Lake S" processors have been confirmed to belong to the fourth-generation Core Ultra series, with mass production expected in Q4 2026.[嵌入式处理器]
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