Throughout the continuous evolution of power systems, power density has always been the core driving force. To achieve this goal, the industry has continuously introduced new topologies, third-generation semiconductor devices, and increased integration. ...[details]

1. Overall Market: Assembly volume increased by 8.8% year-on-year, and the concentration of leading brands increased. In January 2026, the standard assembly volume of cockpit domain controllers in domestic passenger vehicles reached 9.03 million units, an increase of 8.8% year-on-year; ...[details]

According to foreign media reports, SK Signet, a South Korean manufacturer of high-power electric vehicle charging solutions, has launched a new 400kW all-in-one ultra-fast electric vehicle charger. This next-generation product... ...[details]

Today, Logic Robotics announced that its 10,000th humanoid robot has rolled off the production line, marking rapid progress in the field. This 10,000th robot is the Expedition robot, launched in mid-February. ...[details]

On March 25, Renault and the French RMC BFM Group jointly launched RMC BFM Drive, an AI-powered personalized in-car radio service that can be customized to the driver's needs. ...[details]

On March 25, US semiconductor manufacturer Diodes Incorporated (Diodes) announced the expansion of its automotive-grade PowerDI8080-5 N-channel MOSFET portfolio, introducing ultra-low conduction... ...[details]

According to foreign media reports, German sports car manufacturer Porsche has applied for a patent in its home country for a shift-by-wire system that is expected to combine the advantages of both automatic and manual transmissions. The patent document... ...[details]

In the development of artificial intelligence technology, large-scale models, with their astonishing generalization capabilities and logical reasoning abilities, are changing the technological path of autonomous driving. In the past, autonomous driving systems primarily relied on manually generated rules. ...[details]

[Munich, Germany, March 18, 2026] Infineon Technologies AG, a global leader in power systems and IoT semiconductors, launched the EZ-PD™ PMG1-B2, the industry's first highly integrated... ...[details]

With the explosive growth of artificial intelligence (AI), high-performance computing (HPC), and hyperscale architectures, global data centers are facing unprecedented challenges in power density and energy efficiency. Recently, Tektronix... ...[details]

~A single device can achieve industry-leading high-speed detection and high-precision analysis, meeting the needs of the data center market~ Nidec Precision Testing Technology Co., Ltd. (hereinafter referred to as "the Company") recently partnered with ...[details]

[Shanghai, China, March 27, 2026] — The 2026 IPC Electronic Assembly Masters Competition China Regional Tournament concluded successfully today. This year's competition was the largest in its 16-year history, attracting participants from all over the world. ...[details]

As SEMICON China 2026, a premier semiconductor industry event, was being held, ULVAC Group, a globally renowned provider of comprehensive vacuum technology solutions, presented its "Unlocking Infinite Possibilities – Vacuum Technology Driving..." ...[details]

In January of this year, MYR released the MYD-YT153MX-MINI development board. This product precisely targets the mid-range market segment of domestic core boards, offering exceptional cost-effectiveness and receiving a positive market response since its launch. ...[details]

On March 27th, Samsung unveiled its latest roadmap for ultra-high-density solid-state drives (SSDs), planning to launch a 256TB sixth-generation E3 S-format SSD in 2027 using ultra-dense packaging technology. ...[details]

[Munich, Germany, March 27, 2026] Infineon Technologies AG, a global leader in power systems and the Internet of Things (IoT), has further expanded its XDP™ protection and monitoring portfolio with the launch of... ...[details]