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Recently, at the KeyBanc Investor Conference, ON Semiconductor CEO Hassane S. El-Khoury talked about silicon carbide and the key to the automotive market.
Hassane said that the automotive ...[Details]
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On August 5, the National Enterprise Credit Information Publicity System website showed that the registration status of Zhejiang Hongzhen Intelligent Chip Co., Ltd. was changed from existing to can...[Details]
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On November 7, SanDisk executives stated in a conference call following the release of the company's fiscal 2026 Q1 earnings report (ending October 3, 2025) that demand for its NAND flash memory pr...[Details]
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On December 11, Nikkei Asia reported earlier that KIOXIA plans to start mass production of its next-generation BiCS10 3D NAND flash memory in 2026 to support the demand for high-capacity enterprise...[Details]
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On November 12, it was reported that SanDisk, a leading flash memory manufacturer, announced a significant price increase of up to 50% for NAND flash memory contracts in November.
It's worth n...[Details]
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Indian fabless semiconductor startup Aheesa Digital Innovations has completed tape-out of a locally designed, RISC-V-based broadband network system-on-a-chip (SoC), named VIHAAN-I, designed for tel...[Details]
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January 30th news: This afternoon, according to Bloomberg, flash memory manufacturer Kioxia believes that while its competitors are busy in other areas, it is facing a key opportunity to seize grow...[Details]
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Murata Manufacturing's 2025 patent lawsuit against Maxscend Microelectronics is not a typical infringement dispute confined to a single jurisdiction or isolated technical point.
It can be see...[Details]
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The newly launched PE2O8 SiC epitaxy tool is a further enhancement to the industry-leading ASM single-wafer SiC epitaxy tool portfolio (including PE1O6 for 6-inch wafers and PE1O8 for 8-inch wafers...[Details]
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On October 16, Samsung Electronics' Indian branch said on Tuesday that workers at the company's factory in Tamil Nadu in southern India have decided to end their strike, but did not disclose the te...[Details]
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At this year's Siemens EDA annual technology summit "Siemens EDA Forum 2024", Mike Ellow, CEO of Siemens EDA Silicon Systems, delivered a keynote speech in China for the first time as CEO. During h...[Details]
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In early July, foreign media reported that wafer foundry TSMC's 2nm process technology will begin risk trial production at the Baoshan wafer fab in Hsinchu Science Park in the middle of that month,...[Details]
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In the latest issue of Science, a team from the Pritzker School of Molecular Engineering at the University of Chicago demonstrated a new breakthrough in the field of interfacial bioelectronics: the...[Details]
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The 2020 Annual Report on the Transformation of Scientific and Technological Achievements in China (Universities and Research Institutes) (hereinafter referred to as the "Report") was released on the...[Details]
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Siemens has launched PCBflow, a cloud-based software solution designed to bridge the gap between the electronics design and manufacturing ecosystems.
PCBflow expands the Siemens Xceler...[Details]
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