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BZT52C2V4

Description
Accuracy: - Regulated voltage value (typ.): 2.4V Reverse leakage current: 50uA @ 1V Maximum power: 350mW
CategoryDiscrete semiconductor    Zener diode   
File Size421KB,5 Pages
ManufacturerShenzhen Heketai Electronics Co., Ltd.
Websitehttp://www.heketai.com
Founded in 1992, Hekotech is a high-tech innovative enterprise specializing in the R&D, design, packaging, testing, production and sales of semiconductor analog chips and discrete devices. The product line includes lithium battery protection IC, charging management IC, LDO, MOSFET, diode, TVS, bridge stack, triode and other discrete devices and integrated circuits, providing customers with application solutions and on-site technical support services. The company has ISO9001, ISO14001, IATF16949 quality system certification. The products include semiconductors and passive components, which are widely used in power supply, lighting, medical electronics, small appliances, communications, security, instruments, industrial control, automotive electronics and other fields.
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BZT52C2V4 Overview

Accuracy: - Regulated voltage value (typ.): 2.4V Reverse leakage current: 50uA @ 1V Maximum power: 350mW

BZT52C2V4 Parametric

Parameter NameAttribute value
Accuracy-
Stable voltage value (typical value)2.4V
Reverse leakage current50uA @ 1V
Maximum power350mW

BZT52C2V4 Preview

Download Datasheet
BZT52C2V4 - 43
ZENER DIODES
FEATURES
Planar Die Construction
350mW Power Dissipation on Ceramic PCB
eneral Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
MECHANICAL DATA
Case: SOD-123 Molded Plastic
Terminals: Solderable per MIL-STD-202,Method 208
Polarity: Cathode Band
Weight: 0.01 grams (approx.)
SOD-123
10
Cathode
MAXIMUM RATINGS (T
A
= 25°C unless otherwise noted)
Characteristic
Forward Voltage (Note 2) @ IF = 10mA
Power Dissipation(Note 1)
Thermal Resistance, Junction to Ambient Air
Junction Temperature
Operating and Storage T
emperature Range
Symbol
V
F
P
D
R
θJ
TJ
Value
0.9
350
357
1 50
-65~ +150
Unit
V
mW
°C /W
°C
°C
T
j ,T S T
Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm
2
2. Short duration test pulse used to minimize self-heating effect
3. f=1K
HZ
©GUANGDONG HOTTECH INDUSTRIAL CO.,LTD
E-mail:hkt@heketai.com
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