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Infineon's hot-swap technology enables 800V DC power architecture for future server motherboards
Infineon pioneers the combination of silicon carbide, gallium nitride, and silicon t...[Details]
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summary
Simplicity and efficiency are not mutually exclusive; excellent and successful designs often achieve both. This article introduces several traditional active balancing soluti...[Details]
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Bourns introduces a new series of TVS diodes that offer flexible ESD protection.
Utilizes a space-saving DO-214AB package.
The new series includes 21 unidirectional and bidi...[Details]
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The new series features advanced performance, provides effective ESD protection, and offers compact unidirectional and bidirectional packaging options.
November 27, 2025 - Bourns, a ...[Details]
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On November 13, 2025,
WPG Holdings, a leading international semiconductor component distributor focusing on the Asia-Pacific market, announced that its subsidiary, Power Integrations, launched ...[Details]
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Faced with the clear technical roadmap set by the EU Delegated Regulation (EU) 2025/656 and its mandatory implementation deadline of 2027, developing next-generation smart AC charging piles that co...[Details]
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Shanghai, China, January 29, 2026 –
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced that it has begun supplying the gate driver IC “TB9104FTG” for high-current aut...[Details]
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summary
This series of articles consists of two parts. The first part introduces Voltage Input to Output Control (VIOC) systems. These systems are typically configured as a combinati...[Details]
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January 9, 2026 – Mouser Electronics, a global authorized distributor of electronic components and industrial automation products focused on introducing new products, has launched Molex's PowerWize...[Details]
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As the basis of power batteries, new energy vehicle cells determine the performance of the entire battery system, whether in terms of structural form such as cylindrical, square shell, soft pack, o...[Details]
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The new low-voltage varistors provide superior transient energy absorption performance due to their enhanced energy volume distribution and power loss design.
October 21, 2024 -
...[Details]
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Recently, UGREEN
released the
65W GaN fast charging
head (X550) equipped with Nanxin Technology's POWERQUARK® series chips.
This USB-C GaN charging head supports a wide voltage range of ...[Details]
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Shanghai, China, September 25, 2024 -
Toshiba Electronic Devices & Storage Corporation ("Toshiba") today announced the addition of the "TRSxxx120Hx Series" 1200 V products to its latest 3rd-gen...[Details]
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【Abstract/Introduction】
I still remember that a few years ago, when wireless charging first appeared in large numbers at the civilian level, most of us were shocked by this "black te...[Details]
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New Bourns Riedon™ reliable, durable and accurate power resistors with low power dissipation,
It also provides higher stability in pulse processing and current sensing applications.
...[Details]
DSP and ARM Processors
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