QG-2864TMBEG01 datasheet, PDF - EEWORLD Datasheet

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QG-2864TMBEG01: CategoryModule/solution OLED display module; File Size3MB，40 Pages; ManufacturerShenzhen Allvision Technology Co. Ltd.; Websitehttp://www.szallvision.com/; Founded in 2003, the company is a national high-tech enterprise and one of the first companies engaged in the research and development, production and sales of OLED (Organic Light Emitting Diode) displays. With its world-class R&D capabilities, advanced manufacturing technology and equipment, our company can provide tailor-made solutions according to various requirements. After decades of hard work, we have won a good reputation and won the favor of domestic and foreign customers, and finally occupied an important position in the OLED industry.

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Product Specification

Part Name:

OEL Display Module

Customer Part ID:

Allvision Part ID: QG-2864TMBEG01

Ver: E

Customer:

Approved by

From: Allvision technology Inc.

Approved by

Allvision technology Inc.

Http://www.szallvision.com

Notes:

1. Please contact Allvision technology Inc. before assigning your product based on this module specification

2. The information contained herein is presented merely to indicate the characteristics and performance of

our products. No responsibility is assumed by Allvision technology Inc. for any intellectual property claims

or other problems that may result from application based on the module described herein.

Allvision technology Inc.

Contents

Ver:E

Revision History ................................................................................................................................i

Contents ..................................................................................................................................... ii~iii

1. Basic Specifications................................................................................................................ 1~6

1.1

1.2

1.3

1.4

1.5

1.6

Display Specifications ................................................................................................................. 1

Mechanical Specifications............................................................................................................ 1

Active Area / Memory Mapping & Pixel Construction ...................................................................... 1

Mechanical Drawing.................................................................................................................... 2

Pin Definition ............................................................................................................................. 3

Block Diagram............................................................................................................................ 5

1.6.1 V

Supplied Externally...................................................................................................... 5

1.6.2 V

Generated by Internal DC/DC Circuit............................................................................. 6

2. Absolute Maximum Ratings ........................................................................................................7

3. Optics & Electrical Characteristics ....................................................................................... 8~18

3.1 Optics Characteristics.................................................................................................................. 8

3.2 DC Characteristics ...................................................................................................................... 8

3.3 AC Characteristics................................................................................................................. 9~18

3.3.1 68XX-Series MPU Parallel Interface Characteristics......................................................... 9~10

3.3.2 80XX-Series MPU Parallel Interface Characteristics........................................................11~12

3.3.3 Serial Interface Characteristics (4-wire SPI) .................................................................13~14

3.3.4 Serial Interface Characteristics (3-wire SPI) .................................................................15~16

3.3.5 I

C Interface Characteristics .......................................................................................17~18

4. Functional Specification ...................................................................................................... 19~27

4.1 Commands ...............................................................................................................................19

4.2 Power down and Power up Sequence..........................................................................................19

4.2.1 Power up Sequence .........................................................................................................19

4.2.2 Power down Sequence .....................................................................................................19

4.3 Reset Circuit .............................................................................................................................19

4.4 Actual Application Example...................................................................................................20

4.4.1 VCC Supplied Externally .............................................................................................20~23

4.4.2 VCC Generated by Internal DC/DC Circuit ....................................................................24~27

5. Reliability ..................................................................................................................................

5.1 Contents of Reliability Tests .......................................................................................................28

5.2 Failure Check Standard ..............................................................................................................28

6. Outgoing Quality Control Specifications ............................................................................29~32

6.1 Environment Required .............................................................................................................. 29

6.2 Sampling Plan .......................................................................................................................... 29

6.3 Criteria & Acceptable Quality Level........................................................................................29~32

6.3.1 Cosmetic Check (Display Off) in Non-Active Area..........................................................29~30

6.3.2 Cosmetic Check (Display Off) in Active Area...................................................................... 31

6.3.3 Pattern Check (Display On) in Active Area......................................................................... 32

7. Package Specifications..............................................................................................................33

8. Precautions When Using These OEL Display Modules .......................................................34~36

8.1

8.2

8.3

8.4

Handling Precautions ................................................................................................................ 34

Storage Precautions.................................................................................................................. 35

Designing Precautions............................................................................................................... 35

Precautions when disposing of the OEL display modules .........................................................35~36

http://www.szallvision.com

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