Form No:
XXXXXX-7-0000-TBM03-170300411
Specification for Approval
Date:
2017/03/24
Customer :
深圳臺慶
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
TMPC0402HP-Series(G)-Z02
pcs
REMARK:
Customer Approval Feedback
□ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
□
Office:
深圳辦公室
11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian
District Shenzhen
TEL: +86- 755-23972371
FAX: +86-755-23972340
APPROVED
CHECKED
□
臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
管哲頎
Eric Kuan
曾詩涵
Angela Tseng
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
R&D Center
APPROVED
CHECKED
DRAWN
■ 慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
Sihong development zone Suqian City, Jiangsu , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
楊祥忠
Mike Yang
詹偉特
Jack Chan
½秦芝
Sharon Ho
TAI-TECH
P1
SMD Power Inductor
TMPC0402HP-Series(G)-Z02
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
1.1
1.2
15/04/15
15/09/10
17/03/24
新發行
更改卷軸
A(mm)尺寸定義 :
12.0±0.5
改
12.4+2/-0
增加:電流
MAX
規格
楊祥忠
楊祥忠
楊祥忠
詹偉特
詹偉特
詹偉特
½秦芝
½秦芝
½秦芝
備
注
TAI-TECH
P2
SMD Power Inductor
1. Features
1. Carbonyl powder inductor.
2. Compact design.
3. High current，low DCR，high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
6. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
TMPC0402HP-Series(G)-Z02
Halogen
Halogen-free
Pb
Pb-free
2. Applications
Note PC power system，incl. IMVP-6
DC/DC converter .
3. Dimensions
Dr. MOS application
Recommend PC Board Pattern
L
A
C
D
B
1R0
E
G
Series
A(mm)
B(mm)
C(mm)
1.8±0.2
D(mm)
E(mm)
L(mm)
G(mm)
H
H(mm)
TMPC0402HP 4.45±0.25 4.06±0.25
0.76±0.30 2.0±0.20
5.2
2.2
2.4
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.12mm and above.
4. Part Numbering
TMPC
A
0402
B
HP
C
-
1R0
D
MG
E
-
Z02
F
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Control S/N
BxC
H: Carbonyl powder, P:PAD broaden.
1R0=1.00uH
M=±20%
印字:黑色.單向印字.
TAI-TECH
P3
5. Specification
Part Number
TMPC0402HP-R10YG-Z02
TMPC0402HP-R18YG-Z02
TMPC0402HP-R22YG-Z02
TMPC0402HP-R33MG-Z02
TMPC0402HP-R36MG-Z02
TMPC0402HP-R47MG-Z02
TMPC0402HP-R50MG-Z02
TMPC0402HP-R56MG-Z02
TMPC0402HP-R60MG-Z02
TMPC0402HP-R68MG-Z02
TMPC0402HP-R82MG-Z02
TMPC0402HP-1R0MG-Z02
TMPC0402HP-1R2MG-Z02
TMPC0402HP-1R5MG-Z02
TMPC0402HP-1R8MG-Z02
TMPC0402HP-2R2MG-Z02
TMPC0402HP-3R3MG-Z02
TMPC0402HP-3R6MG-Z02
TMPC0402HP-4R7MG-Z02
TMPC0402HP-5R6MG-Z02
TMPC0402HP-6R8MG-Z02
TMPC0402HP-8R2MG-Z02
TMPC0402HP-100MG-Z02
TMPC0402HP-120MG-Z02
TMPC0402HP-150MG-Z02
TMPC0402HP-200MG-Z02
TMPC0402HP-220MG-Z02
Note:
1. Test frequency :
L/Q : 100KHz /1.0V;
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
Δt
of 40℃.
5. Saturation Current (Isat) will cause L0
to drop approximately 20%;
Inductance
L0 (uH)±20%
@0A
0.10±30%
0.18±30%
0.22±30%
0.33
0.36
0.47
0.50
0.56
0.60
0.68
0.82
1.00
1.20
1.50
1.80
2.20
3.30
3.60
4.70
5.60
6.80
8.20
10.0
12.0
15.0
20.0
22.0
I rms (A)
Typ
12.0
13.5
13.0
10.0
9.00
8.00
7.80
7.30
7.30
7.00
6.00
5.00
4.80
4.50
4.30
4.00
3.50
3.10
2.60
2.20
2.10
2.00
1.80
1.65
1.50
1.30
1.20
I sat (A)
Typ
35.0
28.0
24.0
18.0
15.0
120
11.3
10.0
11.0
10.0
9.50
8.50
7.80
7.00
6.50
6.00
4.00
3.80
3.50
3.00
2.80
2.50
2.30
2.10
1.90
1.70
1.40
Max
10.0
11.0
11.0
9.00
8.00
7.00
6.80
6.50
6.50
6.30
5.30
4.40
4.20
4.00
3.80
3.50
3.00
2.70
2.20
2.00
1.80
1.60
1.40
1.30
1.20
1.10
1.00
Max
30.0
25.0
21.0
16.0
13.0
11.0
10.0
9.00
10.0
9.00
8.50
7.50
7.00
6.20
5.80
5.40
3.60
3.40
3.20
2.70
2.50
2.20
2.00
1.90
1.70
1.50
1.20
DCR(mΩ)
Typ.@25℃
3.2
4.6
6.6
7.8
8.7
11.2
13
13.5
15.5
16
19
22
25
34.8
43
51
69
75
95
112
150
158
215
275
325
435
470
DCR(mΩ)
Max.@25℃
4.0
5.4
7.3
8.6
12
14
15
16
18.5
19
23
27
30
42
52
61
76
90
105
125
172
180
243
330
374
480
500
6. The part temperature (ambient + temp rise) should not exceed 125
℃
under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P4
6. Material List
NO
1
2
3
4
5
Items
Core
Wire
Clip
paint
Ink
Carbonyl Powder.
Polyester Wire or equivalent.
100% Pb free solder(Ni+Sn---Plating)
Epoxy resin
Halogen-free ketone
Materials
7. Reliability and Test Condition
Item
Operating temperature
Storage temperature
Performance
-40~+125℃ (Including self - temperature rise)
1.-10~+40℃,50~60%RH (Product without taping)
2.-40~+125℃ (on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
Approximately
△L20%.
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop
△L(%)
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃).
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Heat Rated Current (Irms)
Approximately
△T40℃
Reliability Test
Preconditioning:
Run
through
IR
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature： 125±2℃(Inductor)
Applied current：rated current
Duration：1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning:
Run
through
IR
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity：85±2﹪ R.H,
Temperature：85℃±2℃
Duration：1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature
after placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning:
Run
through
IR
reflow
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1：-40±2℃ 30±5min
Step2：25±2℃
≦0.5min
Step3：125±2℃ 30±5min
Number of cycles： 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10½2K½10Hz for 20 minutes
Vibration
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
for
2
reflow
for
2
reflow
for
2
Life Test
Load Humidity
Appearance：No damage.
Moisture Resistance
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Thermal
shock
Embedded System
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