CJ78M05(TO-251) datasheet, PDF

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CJ78M05(TO-251): DescriptionRegulator; CategoryPower/power management The power supply circuit; File Size393KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

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CJ78M05(TO-251) Overview

Regulator

CJ78M05(TO-251) Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknown
Base Number Matches	1

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JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-251/TO-252-2L Plastic-Encapsulate Regulators

CJ78M05

Three-terminal positive voltage regulator

FEATURES

Maximum

output

current

: 0.5 A

Output voltage

: 5V

Continuous total dissipation

: 1.25 W

TO-251

TO-252-2L

123

1.IN

2.GND

3.OUT

ABSOLUTE MAXIMUM RATINGS (Operating temperature range applies unless otherwise specified)

Parameter

Input Voltage

Operating Junction Temperature Range

torage Temperature Range

Parameter

Output

Voltage

Symbol

OPR

STG

Test conditions

25℃

7V≤V

≤20V,

Io=5mA-350mA

Po≤ 15W

Load

Regulation

Line

Regulation

Quiescent Current

Quiescent Current Change

Output Noise Voltage

Ripple Rejection

Dropout Voltage

Short Circuit Current

Peak Current

TYPICAL APPLICATION

ΔVo

ΔIq

Isc

Ipk

CJ78M05

UTC

0.33μF

0.1μF

0.5A

8V≤V

≤25V,

Io=200mA

5mA≤I

≤350mA

10Hz≤ f

≤100KHz

8V≤V

≤18V,f=120Hz,Io=300mA

Io=350mA

Vi=10V

Io=5mA-0.5A

Io=5mA-200mA

7V≤V

≤25V,

Io=200mA

8V≤V

≤25V,

Io=200mA

25℃

0-125℃

25℃

0-125℃

25℃

300

0.5

2.5

0-125℃

Value

0-+125

-65-+150

Min

4.8

4.75

Typ

4.2

Unit

℃

Max

5.2

5.25

100

0.8

0.5

200

Unit

μV

ELECTRICAL CHARACTERISTICS

AT SPECIFIED VIRTUAL JINCTION TEMPERATURE

(Vi=10V,Io=350mA, Ci=0.33μF,Co=0.1μF,unless otherwise specified)

A,May,2011

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