WL811BC-T01-7F datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> The connector> WL811BC-T01-7F

WL811BC-T01-7F: DescriptionPCB Connector, LEAD FREE; CategoryThe connector The connector; File Size71KB，1 Pages; ManufacturerFOXCONN; Websitehttp://www.fit-foxconn.com/; Environmental Compliance

Download Datasheet Parametric View All

WL811BC-T01-7F Overview

PCB Connector, LEAD FREE

WL811BC-T01-7F Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	FOXCONN
package instruction	LEAD FREE
Reach Compliance Code	unknown
Connector type	PCB CONNECTOR
Contact to complete cooperation	GOLD (30) OVER PALLADIUM NICKEL
Contact completed and terminated	GOLD (30) OVER PALLADIUM NICKEL
Contact material	COPPER ALLOY
DIN compliance	NO
IEC compliance	NO
JESD-609 code	e4
MIL compliance	NO
Manufacturer's serial number	WL
Options	GENERAL PURPOSE
Base Number Matches	1

WL811BC-T01-7F Preview

Download Datasheet

View All

SPECIFICATIONS

SIM card Conn.

WL Series

SIM Card, SMT Type

2.90mm [.114”] Height

6 Pos.

Mechanical

Normal Force:

0.3N min

Durability:

5000 Cycles

Electrical

Voltage Rating:

15 V max

Current Rating:

0.5 A max

Contact Resistance:

100 m

Ω

max at 10mA.

Dielectric Withstanding Voltage:

540V AC/1 min.

Insulation Resistance:

1000 M

Ω

min (initial), 100 M

Ω

min (final),

Physical

Insert molding:

THERMOPLASTIC UL 94V-0, Color Black

Contact:

Copper Alloy

Hook:

Stainless Steel

Plating:

See “ORDERING INFORMATION”

Operating Temperature:

-30

℃

to +85

℃

DRAWING

ORDERING

I N FO R M ATIO N

PRODUCT NO.: WL 6 29 D 3- T01 - TR

SIM Card Conn.

No. Contact

6= 6 Pin

8= 8 Pin

Package And Solder Tail Type

T = Tray

TR= Tape & Reel

1F= Tray (Lead Free)

7F= Tape & Reel (Lead Free)

Modification Code

Code No.: 2 or 3 Code(A~Z or 0~9)

Body Height

05= 2.5mm

06=2.6mm

07=0.7mm

08=2.8mm

10=1.0mm

11=1.1mm

90=9.0mm

Upper Cover Type

Contact Area Plating Thickness

1= Gold Flash

2= 20u" Gold Plating

3= 30u" Gold Plating

6= 10u" Gold Plating

7= 15u" Gold Plating

A= 10u" Pd/Ni +Gold Plating

B= 20u" Pd/Ni +Gold Plating

C= 30u" Pd/Ni +Gold Plating

D= 40u" Pd/Ni +Gold Plating

L= 25u" Pd/Ni +Gold Plating

A= Upper Cover B= Slider In Type

C= Hinge Type

D= Metal Hook or Cover Type

E= Metal Cover with Push-Push F= Pogo Pin Type

G= Metal Cover with Inject&Door H= Compression Type

All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.

Recommended Resources

Ultra-low power consumption LCD liquid crystal display circuit module design circuit diagram

LAS6351 current expansion circuit diagram

High voltage DC power circuit

Electronic interlock switch for counting

Computer infrared remote control circuit 2

Telephone Repair Reference Circuit Diagram

Questions on using operational amplifiers: I am using an operational amplifier to adjust the sampling signal of a microcontroller. The amplifier model is LF412. The power supply connection method in the data sheet is dual power supply, such as...; chn369 Embedded System

Processing of program memory during program burning: 1. When burning the program, do all the memory of the chip need to be verified first?2. If the program does not use the internal flash, will the flash memory also need to be verified when burning the ...; l0700830216 Microcontroller MCU

Are you choosing the right power switch solution? Discrete MOSFET vs Integrated Load Switch: A power switch generally refers to connecting and disconnecting power to a load. A power switch sits between the system power supply and the load, and this switch controls when power is or is not supp...; arui1999 Power technology

06.23【Weekly Discussion】We are young and full of justice. How should we view the uncivilized phenomena in society?: 06.23 [Weekly Discussion] We are young, full of justice and passion. How should we view the uncivilized phenomena in society? We are young people, full of justice and passion, and we cannot tolerate e...; longxtianya Integrated technical exchanges

What should I do if the program keeps making judgments in one place when performing a scan?: Hello everyone, my program (not written by myself) always stays at one place when executing the judgment scan, what should I do? The program segment is as follows: main: nop nop nop mov wdt_contr,#001...; jgj Embedded System

Currently bidding: MindMotion SoC Solution September 5th 12:00-September 6th 11:59: [size=4][color=#ff0000][b]Bidding dynamics: RCSN 1500 core coins[/b][/color][/size] [hr][size=4] This event is supported by [url=https://bbs.eeworld.com.cn/thread-511067-1-1.html]EEWORLD Development B...; okhxyyo Talking

Popular Components