UF1600CT thru UF1608CT
Glass Passivated High Efficient Rectifiers
Reverse Voltage 50 to 800 Volts Forward Current 16.0 Amperes
Features
Plastic package has Underwriters Laboratory Flammability
Classification 94V-O utilizing Flame Retardant Epoxy Molding
Compound.
Exceeds environmental standards of MIL-S-19500/228
Low power loss, high efficiency.
Low forwrd voltge, high current capability
High surge capacity.
Ultra fast recovery times, high voltage.
Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb
Pb free: 98.5% Sn above
TO-220AB
Mechanical Data
Case: TO-220AB full molded plastic package
Terminals: Lead solderable per MIL-STD-202, Method 208
Polarity: As marked
Standard packaging: Any
Weight: 0.08 ounces, 2.24 grams
Maximum Ratings and Electrical Characteristics
Ratings at 25
o
C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz,
resistive or inductive load. For capacitive load, derate current by 20%
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
C
=100
o
C
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 8.0A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time at
I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A (Note 1)
Typical junction capacitance at 4.0V, 1MHz (Note 2)
Typical thermal resistance (Note 3)
Operating junction and storage temperature range
Notes:
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
θ
JC
T
J
, T
STG
UF
1600C T
50
35
50
UF
1601C T
100
70
100
UF
1602C T
200
140
200
UF
1603C T
300
210
300
16.0
125.0
UF
1604C T
400
280
400
UF
1606C T
600
420
600
UF
1608C T
800
560
800
Unit
Volts
Volts
Volts
Amps
Amps
1.0
10.0
500
50
170.0
2.0
1.3
1.7
Volts
uA
@T
A
=25
o
C
@T
A
=125
o
C
100
130.0
o
nS
pF
C/W
o
-55 to +150
C
1. Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1A, I
rr
=0.25A.
2. Measured at 1 MHz and applied reverse voltage of 4.0 VDC.
3. Thermal resistance from Junction to ambient and from junction to lead 0.375" (9.5mm) P.C.B mounted.
197
FPGA/CPLD
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