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UF1004_T0_10001

Description
Rectifier Diode, 1 Phase, 1 Element, 10A, 400V V(RRM), Silicon, TO-220AC,
CategoryDiscrete semiconductor    diode   
File Size90KB,4 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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UF1004_T0_10001 Overview

Rectifier Diode, 1 Phase, 1 Element, 10A, 400V V(RRM), Silicon, TO-220AC,

UF1004_T0_10001 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
package instructionR-PSFM-T2
Reach Compliance Codenot_compliant
ECCN codeEAR99
Other featuresLOW POWER LOSS
applicationEFFICIENCY
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1.3 V
JEDEC-95 codeTO-220AC
JESD-30 codeR-PSFM-T2
Maximum non-repetitive peak forward current150 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current10 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum repetitive peak reverse voltage400 V
Maximum reverse current1 µA
Maximum reverse recovery time0.05 µs
surface mountNO
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED

UF1004_T0_10001 Preview

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UF1000~UF1006
ULTRAFAST RECOVERY RECTIFIERS
CURRENT
VOLTAGE
50 to 600 Volts
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of MIL-S-19500/228
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• Ultra fast recovery time, high voltage.
• Lead free in comply with EU RoHS 2011/65/EU directives
10 Amperes
MECHANCAL DATA
• Case: TO-220AC molded plastic
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Standard packaging: Any
• Weight: 0.0655 ounces, 1.859 grams.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA M E TE R
Ma xi m um Re c ur r e nt P e a k Re ve r s e Vo lt a g e
Ma xi m um RM S Vo lt a g e
Ma xi m um D C B lo c k i ng Vo lt a g e
Ma xi m um A ve r a g e F o r wa r d C ur r e nt a t T
C
= 1 0 0
O
C
P e a k F o r wa r d S ur g e C ur r e nt : 8 .3 m s s i ng le ha lf s i ne -
wa ve s up e r i mp o s e d o n r a t e d lo a d ( J E D E C m e tho d )
Ma xi m um F o r wa r d Vo lta g e a t 1 0 A
Ma xi m um D C Re ve r s e C ur r e nt a t Ra te d D C T
J
= 2 5
O
C
T
J
= 1 2 5
O
C
B lo c k i ng Vo lta g e
Typ i c a l J unc ti o n C a p a c i t a nc e ( No t e 1 )
Ma xi m um Re ve r s e Re c o ve r y Ti m e ( No te 2 )
Typ i c a l The r ma l Re s i s t a nc e ( No te 3 )
Op e r a ti ng J unc t i o n a nd S to r a g e Te m p e r a tur e Ra ng e
S YM B O L UF 1 0 0 0
V
R RM
V
R MS
V
DC
I
F (AV )
I
F S M
V
F
I
R
C
J
t
rr
R
JC
T
J
, T
S TG
50
35
50
UF 1 0 0 1
100
70
100
UF 1 0 0 2 UF 1 0 0 3 UF 1 0 0 4 UF 1 0 0 6 UNITS
200
140
200
10
150
300
210
300
400
280
400
600
420
600
V
V
V
A
A
1 .3
1
500
80
50
2
- 5 5 t o +1 5 0
50
100
O
1
1.7
V
A
pF
ns
C /
W
C
O
NOTES:
1. Measured at 1 MHz and applied reverse voltage of 4.0 VDC.
2. Reverse Recovery Test Conditions: I
F
=.5A, I
R
=1A, Irr=.25A.
3. Thermal resistance from Junction to case.
4. Both Bonding and Chip structure are available.
January 25,2013-REV.03
PAGE . 1
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