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TA1300L

Description
Silicon Surge Protector, 160V V(BO) Max, 25A, PLASTIC, SMA, 2 PIN
CategoryAnalog mixed-signal IC    Trigger device   
File Size46KB,4 Pages
ManufacturerLITEON
Websitehttp://optoelectronics.liteon.com/en-global/Home/index
Lite-On began producing LED lamps in 1975; the company has steadily grown to become one of the world's largest manufacturers of optoelectronics products by providing customers with visible and infrared product solutions. High-volume production of commercial and application-specific products, as well as strong R&D and vertical integration capabilities have proven to be key and differentiating factors in Lite-On's success.
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TA1300L Overview

Silicon Surge Protector, 160V V(BO) Max, 25A, PLASTIC, SMA, 2 PIN

TA1300L Parametric

Parameter NameAttribute value
MakerLITEON
package instructionSMALL OUTLINE, R-PDSO-C2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum breakover voltage160 V
ConfigurationSINGLE
Maximum off-state DC voltage120 V
Maximum holding current800 mA
JESD-30 codeR-PDSO-C2
On-state non-repetitive peak current25 A
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusNot Qualified
surface mountYES
Terminal formC BEND
Terminal locationDUAL
Trigger device typeSILICON SURGE PROTECTOR

TA1300L Preview

LITE-ON
SEMICONDUCTOR
TA0640L thru TA4000L
Bi-Directional
VDRM
IPP
-
58 to 360
Volts
-
50
Amperes
SURFACE MOUNT
THYRISTOR SURGE PROTECTIVE DEVICE
FEATURES
Oxide Glass Passivated Junction
Bidirectional protection in a single device
Surge capabilities up to 50A @ 10/1000us or 150A
@ 8/20us
High off state Impedance and low on state voltage
Plastic material has UL flammability classification
94V-0
B
SMA
SMA
A
C
DIM.
A
B
C
D
E
MIN.
4.06
2.29
1.27
0.15
4.83
0.05
2.01
0.76
MAX.
4.57
2.92
1.63
0.31
5.59
0.20
2.62
1.52
MECHANICAL DATA
Case : Molded plastic
Polarity : Denotes none cathode band
Weight : 0.064 grams
G
H
E
F
D
F
G
H
All Dimensions in millimeter
MAXIMUM RATINGS
CHARACTERISTICS
Non-repetitive peak impulse current @ 10/1000us
Non-repetitive peak On-state current @ 8.3ms (one half cycle)
Junction temperature range
storage temperature range
SYMBOL
VALUE
UNIT
A
A
I
PP
I
TSM
T
J
T
STG
50
25
-40 to +150
-55 to +150
THERMAL RESISTANCE
CHARACTERISTICS
Junction to leads
Junction to ambient on print circuit (on recommended pad layout)
Typical positive temperature coefficient for brekdown voltage
SYMBOL
VALUE
UNIT
/W
/W
%/
Rth
(J-L)
Rth
(J-A)
V
BR
/
T
J
20
100
0.1
MAXIMUM RATED SURGE WAVEFORM
WAVEFORM
2/10 us
8/20 us
10/160 us
10/560 us
10/700 us
10/1000 us
STANDARD
GR-1089-CORE
IEC 61000-4-5
FCC Part 68
FCC Part 68
ITU-T K20/K21
GR-1089-CORE
I
PP
(A)
150
150
90
60
55
50
I
PP
, PEAK PULSE CURRENT (%)
100
Peak value (Ipp)
tr= rise time to peak value
tp= Decay time to half value
50
Half value
0
tr
tp
TIME
REV.
2,
29-April-2003, KSWA02
ELECTRICAL CHARACTERISTICS
@ T
A=
25
unless otherwise specified
TA0640L thru TA4000L
PARAMETER
RATED
REPETITIVE
OFF-STATE
VOLTAGE
OFF-STATE
LEAKAGE
CURRENT
@ V
DRM
BREAKOVER
VOLTAGE
ON-STATE
VOLTAGE
@ I
T
=1.0A
BREAKOVER
CURRENT
HOLDING
CURRENT
OFF-STATE
CAPACITANCE
SYMBOL
UNITS
V
DRM
Volts
I
DRM
uA
V
BO
Volts
V
T
Volts
I
BO
-
mA
I
BO+
mA
I
H-
mA
I
H+
mA
Co
pF
LIMIT
TA0640L
TA0720L
TA0900L
TA1100L
TA1300L
TA1500L
TA1800L
TA2300L
TA2600L
TA3100L
TA3500L
TA4000L
Max
Max
Max
Max
Min
Max
Min
Max
Typ
58
65
75
90
120
140
160
190
220
275
320
360
5
5
5
5
5
5
5
5
5
5
5
5
77
88
98
130
160
180
220
265
300
350
400
450
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
50
50
50
50
50
50
50
50
50
50
50
50
800
800
800
800
800
800
800
800
800
800
800
800
150
150
150
150
150
150
150
150
150
150
150
150
800
800
800
800
800
800
800
800
800
800
800
800
100
100
100
60
60
60
60
40
40
40
40
40
SYMBOL
V
DRM
I
DRM
V
BR
I
BR
V
BO
I
BO
I
H
V
T
I
PP
C
O
PARAMETER
Stand-off Voltage
Leakage current at stand-off voltage
Breakdown voltage
Breakdown current
I
BR
Breakover voltage
Breakover current
I
BO
I
H
I
DRM
I
PP
I
V
V
T
V
BR
V
DRM
V
BO
Holding current
On state voltage
Peak pulse current
Off state capacitance
Note: 1
Note: 2
REV.
2,
29-April-2003, KSWA02
NOTES: 1. I
H
> (V
L
/R
L
) If this criterion is not obeyed, the T
SPD
Triggers but does not return correctly to high-resistance state.
The Surge recovery time does not exceed 30ms.
2. Off-state capacitance measured at f=1.0MHz; 1.0V
RMS
signal; VR=2V
DC
bias.
RATING AND CHARACTERISTICS CURVES
TA0640L thru TA4000L
FIG.1 - OFF STATE CURRENT vs JUNCTION TEMPERATURE FIG. 2 - RELATIVE VARIATION OF BREAKDOWN VOLTAGE
vs JUNCTION TEMPERATURE
100
1.20
NORMALIZED BREAKDOWN VOLTAGE
I(
DRM)
, OFF STATE CURRENT (uA)
1.15
10
1.10
V
BR
(T
J
)
V
BR
(T
J
=25
)
1.0
V
DRM
=50V
1.05
0.1
1.0
0.01
0.95
0.001
-25
0
25
50
75
100
125
150
0.90
-50
-25
0
25
50
75
100
125
150
175
T
J
, JUNCTION TEMPERATURE (
)
T
J
, JUNCTION TEMPERATURE (
)
FIG. 3 - RELATIVE VARIATION OF BREAKOVER VOLTAGE
vs JUNCTION TEMPERATURE
1.10
FIG. 4 - ON STATE CURRENT vs ON STATE VOLTAGE
100
NORMALIZED BREAKOVER VOLTAGE
1.05
V
BO
(T
J
)
V
BO
(T
J
=25
)
I
(T)
, ON STATE CURRENT
10
1.0
T
J
= 25
0.95
-50
1
-25
0
25
50
75
100
125
150
175
1
2
3
4
5
6
7
8
9
T
J
, JUNCTION TEMPERATURE (
)
V (T); ON STATE VOLTAGE
FIG. 5 - RELATIVE VARIATION OF HOLDING CURRENT
vs JUNCTION TEMPERATURE
2
1
FIG. 6 - RELATIVE VARIATION OF JUNCTION
CAPACITANCE vs REVERSE VOLTAGE BIAS
NORMALIZED HOLDING CURRENT
1.5
1
IH (T
J
)
IH (T
J
=25
)
0.5
NORMALIZE CAPACITANCE
C
O
(VR)
C
O
(VR = 1V)
Tj =25
f=1MHz
V
RMS
= 1V
0
-50
-25
0
25
50
75
100
125
0.1
1
10
100
T
J
, JUNCTION TEMPERATURE (
)
VR, REVERSE VOLTAGE
REV.
2,
29-Apil-2003, KSWA02
TYPICAL CIRCUIT APPLICATIONS
TA0640L thru TA4000L
FUSE
RING
TSPD 1
TELECOM
EQUIPMENT
E.G. MODEM
TIP
RING
PTC
TSPD 1
TELECOM
EQUIPMENT
E.G. ISDN
TSPD 2
TIP
PTC
RING
PTC
TSPD 2
TSPD 1
TSPD 3
TELECOM
EQUIPMENT
E.G. LINE
CARD
TIP
PTC
The PTC (Positive Temperature Coefficient) is an overcurrent protection device
REV.
2,
29-April-2003, KSWA02
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