Yangzhou Yangjie Electronic Technology Co., Ltd. was established on August 2, 2006 with a registered capital of RMB 472 million. In January 2014, the company was listed on the Shenzhen Stock Exchange's Growth Enterprise Market with the stock code 300373. In 2017, the company's operating income was RMB 1.47 billion. The company integrates R&D, production and sales, and is professionally committed to the industrial development of power semiconductor chips and device manufacturing, integrated circuit packaging and testing, etc. The company's main products are various power electronic device chips, power diodes, rectifier bridges, high-power modules, DFN/QFN products, SGT MOS and silicon carbide SBD, silicon carbide JBS, etc. The products are widely used in many fields such as consumer electronics, security, industrial control, automotive electronics, and new energy.
Most of the company's projects require the use of FPGA and CPLD. Recently, a project requires a higher-end FPGA, so I want to apply for a trial first. The new project requirements will be carried out ...
3SPI work at the same time, it is best if they all support DMA, independent interrupts, and connect to AD. The fourth SPI is only used to connect to the memory. If there is no fourth one, the IO port ...
It is said that the biggest difference between the Von Hoffmann architecture and the Harvard architecture is that the Harvard architecture stores instructions and data in different memories and can be...
[size=3] [/size] [b][size=3]PADS PCB software is slow to import structure dimensions, and it is always calculating capture points. How can I synthesize the structure diagram into a whole? [/size][/b]...
Alex Chen, Heather McCormick, Daniel Tan and Matthew Kelly Celestica Inc.
Background
As the July 1, 2006 RoHS implementation deadline approaches, more and more electronics manufactu...[Details]
Question A: Waveform Generator
1. Task
Design and produce a waveform generator that can generate sine waves, square waves, triangle waves, and waveforms of specific shapes edited b...[Details]
Topic 1 Practical low-frequency power amplifier
1. Task
Design and manufacture a low-frequency power amplifier with weak signal amplification capability. The schematic diagram i...[Details]
October 20, 2010 is the first "World Statistics Day". There is no doubt that the importance of statistics has been recognized worldwide. Hal Varian, chief economist of Google, once said that statis...[Details]
Abstract: The requirements of the development of modern power supply technology on the special parameters of capacitors are analyzed, with emphasis on filter capacitors and absorption capacitors, p...[Details]
Abstract: LMC6062/6082 is a high-precision, high-input impedance CMOS operational amplifier. This paper introduces its features, electrical characteristics and some technical issues in use, and g...[Details]
Abstract:
The characteristics and working principle of the broadband operational transconductance amplifier OPA660 produced by Burr-Brown are introduced. Its three basic configurations a...[Details]
1 Basic features
AN7560Z is a power amplifier IC with 4-channel stereo audio output produced by Panasonic Electric Company of Japan. It has BTL output function, and its 4-channel output po...[Details]
Author Email: zlyadvocate@163.com With the rapid development of microelectronics technology, people's demand for digital systems is also increasing . Not only do they need to have perfect functions, b...[Details]
Abstract: This paper introduces the working principle, design concept, circuit structure and improvement and optimization methods of direct digital frequency synthesizer using Altera's FPGA device (AC...[Details]
Abstract: T=0 is a contact CPU card communication protocol specified in the international standard. Combined with development practice, the protocol is divided into four levels. Starting from the pers...[Details]
Farnell, the global development distributor of electronic components and services, has announced a new distribution agreement with KOA Europe GmbH, a leading global manufacturer of passive components...[Details]
Recently, according to relevant media reports, the advanced chip packaging and testing factory that Foxconn plans to build in Qingdao has broken ground recently, which has attracted widespread atte...[Details]
At Semico West, Applied Materials announced a new selective gap-fill technology to address the growing resistance problem in small-geometry interconnects.
As EUV enters the mass producti...[Details]
Entering the third quarter of 2020, TSMC's 5nm chips began large-scale mass production, and this production capacity has also become a target for many IC design giants. It is reported that customers ...[Details]
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