WL807F6-B02-7F datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> The connector> WL807F6-B02-7F

WL807F6-B02-7F: DescriptionPCB Connector, LEAD FREE; CategoryThe connector The connector; File Size68KB，1 Pages; ManufacturerFOXCONN; Websitehttp://www.fit-foxconn.com/; Environmental Compliance

Download Datasheet Parametric View All

WL807F6-B02-7F Overview

PCB Connector, LEAD FREE

WL807F6-B02-7F Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	FOXCONN
package instruction	LEAD FREE
Reach Compliance Code	unknown
Connector type	PCB CONNECTOR
Contact to complete cooperation	GOLD (10)
Contact completed and terminated	GOLD (10)
Contact material	COPPER ALLOY
DIN compliance	NO
IEC compliance	NO
JESD-609 code	e4
MIL compliance	NO
Manufacturer's serial number	WL
Options	GENERAL PURPOSE

WL807F6-B02-7F Preview

Download Datasheet

View All

SPECIFICATIONS

SIM card Conn.

WL Series

SIM Card, SMT Type

1.50mm [.059”] Height

6 Pos.

Mechanical

Normal Force:

0.3N min

Durability:

5000 Cycles

Electrical

Voltage Rating:

15 V max

Current Rating:

0.5 A

Contact Resistance:

100 m

Ω

max at 10mA.

Dielectric Withstanding Voltage:

540V AC/1 min.

Insulation Resistance:

1000 M

Ω

min (initial), 100 M

Ω

min (final),

Physical

Insert molding:

THERMOPLASTIC UL 94V-0, Color Black

Contact:

Copper Alloy

Plating:

See “ORDERING INFORMATION”

Operating Temperature:

-30

℃

to +85

℃

DRAWING

ORDERING

I N FO R M ATIO N

3- B02 -TR

Package And Solder Tail Type

T = Tray

TR= Tape & Reel

1F= Tray (Lead Free)

7F= Tape & Reel (Lead Free)

PRODUCT NO.: WL 6 15 A

SIM Card Conn.

No. Contact

6= 6 Pin

8= 8 Pin

Modification Code

Code No.: 2 or 3 Code(A~Z or 0~9)

Body Height

05= 2.5mm

06=2.6mm

07=0.7mm

08=2.8mm

10=1.0mm

11=1.1mm

90=9.0mm

Upper Cover Type

Contact Area Plating Thickness

1= Gold Flash

2= 20u" Gold Plating

3= 30u" Gold Plating

6= 10u" Gold Plating

7= 15u" Gold Plating

A= 10u" Pd/Ni +Gold Plating

B= 20u" Pd/Ni +Gold Plating

C= 30u" Pd/Ni +Gold Plating

D= 40u" Pd/Ni +Gold Plating

L= 25u" Pd/Ni +Gold Plating

A= Upper Cover B= Slider In Type

C= Hinge Type

D= Metal Hook or Cover Type

E= Metal Cover with Push-Push F= Pogo Pin Type

G= Metal Cover with Inject&Door H= Compression Type

All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.

Recommended Resources

One control and one fan frequency conversion speed control circuit b

Sonic remote control circuit

Chinese learning machine system board circuit diagram circuit 02

Optical coupling amplifier circuit

Thermocouple A/D conversion circuit

Voltage-frequency (inverse proportional) conversion circuit

Does EVC need to be object-oriented?: I have seen some applications written in evc. Many of them do not have classes. They just add a header file and a cpp file and start writing functions. I would like to ask, will using classes in evc a...; qyan332713590 Embedded System

Data of the previous color TV ROM: RT...; huchuan987 Appliance Repair Collection

Regarding the PN junction, is this correct?: If the electrons entering the hole-type semiconductor are supplemented by electrons, the newly recombined electrons can continue to move forward and can enter the conductor from the hole-type semicond...; chaosrm Integrated technical exchanges

If you install the driver dynamically: How to dynamically load a driver. I mean, in a CE system, the CE kernel file nk.bin does not contain the stream interface driver usb.dll. After running the CE system, copy this usb.dll to the CE hard ...; testttest Embedded System

The growth path of a DSP expert: The growth path of a DSP master I have been engaged in DSP development for several years. I have seen many friends are very interested in DSP development. I will write about my feelings about DSP deve...; maker DSP and ARM Processors

TI TMS320F2812 SVPWM Program: TI TMS320F2812 SVPWM Program...; Aguilera Microcontroller MCU

Popular Components