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VR4CU167228CTK

Description
DDR DRAM Module, 16MX72, 0.7ns, CMOS, ROHS COMPLIANT, DIMM-184
Categorystorage    storage   
File Size193KB,20 Pages
ManufacturerViking
Websitehttp://www.viking.com.tw/
Environmental Compliance  
Guangjie Technology was established in October 1997 in Hsinchu Science Park. It is the first professional manufacturer in Taiwan that combines thin film/thick film process technology with high-frequency passive component/module design and development capabilities. It has an excellent technical R&D team and is committed to the research and development of thin film process technology and the design and development of high-frequency component/module integration. It provides key components such as integrated passive components and high-frequency modules that meet the high-frequency and miniaturization needs of system products. It has successfully integrated passive components such as resistors/capacitors/inductors/diodes (Integrated Passive Devices, IPDs), which can be widely used in mobile personal electronic products. Anti-static and electromagnetic filtering (ESD & EMI Filter), etc.
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VR4CU167228CTK Overview

DDR DRAM Module, 16MX72, 0.7ns, CMOS, ROHS COMPLIANT, DIMM-184

VR4CU167228CTK Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerViking
Parts packaging codeDIMM
package instructionDIMM,
Contacts184
Reach Compliance Codeunknown
ECCN codeEAR99
access modeSINGLE BANK PAGE BURST
Maximum access time0.7 ns
Other featuresAUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX
JESD-30 codeR-XDMA-N184
length133.35 mm
memory density1207959552 bit
Memory IC TypeDDR DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals184
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX72
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height31.75 mm
self refreshYES
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.81 mm

VR4CU167228CTK Preview

Download Datasheet
DDRI UNBUFFERED DIMM
VR4CUxxxx28xxx
MODULE CONFIGURATIONS
Non-ECC
Module
Device
Configuration
Configuration
128MB
16M x 64
16M x 8 bit (8)
VR4CU166428C(*)H
128MB
16M x 64
16M x 8 bit (8)
VR4CU166428C(*)K
128MB
16M x 64
16M x 8 bit (8)
VR4CU166428C(*)P
256MB
32M x 64
16M x 8 bit (16)
VR4CU326428C(*)H
256MB
32M x 64
16M x 8 bit (16)
VR4CU326428C(*)K
256MB
32M x 64
16M x 8 bit (16)
VR4CU326428C(*)P
256MB
32M x 64
32M x 8 bit (8)
VR4CU326428D(*)H
256MB
32M x 64
32M x 8 bit (8)
VR4CU326428D(*)K
256MB
32M x 64
32M x 8 bit (8)
VR4CU326428D(*)P
512MB
64M x 64
32M x 8 bit (16)
VR4CU646428D(*)H
512MB
64M x 64
32M x 8 bit (16)
VR4CU646428D(*)K
VR4CU646428D(*)P
512MB
64M x 64
32M x 8 bit (16)
512MB
64M x 64
64M x 8 bit (8)
VR4CU646428E(*)H
512MB
64M x 64
64M x 8 bit (8)
VR4CU646428E(*)K
512MB
64M x 64
64M x 8 bit (8)
VR4CU646428E(*)P
1GB
128M x 64
64M x 8 bit (16)
VR4CU286428E(*)H
1GB
128M x 64
64M x 8 bit (16)
VR4CU286428E(*)K
1GB
128M x 64
64M x 8 bit (16)
VR4CU286428E(*)P
2GB
256M x 64
128M x 8 bit (16)
VR4CU566428F(*)H
2GB
256M x 64
128M x 8 bit (16)
VR4CU566428F(*)K
2GB
256M x 64
128M x 8 bit (16)
VR4CU566428F(*)P
Note:
1. (*) indicates device package: T= TSOP, B= FBGA.
2. Module height for FBGA versions is 1.0 inches (25.4mm).
V/I Part Number
Capacity
Module
Height (in.)
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
Module
Ranks
1
1
1
2
2
2
1
1
1
2
2
2
1
1
1
2
2
2
2
2
2
Performance
PC2100
PC2700
PC3200
PC2100
PC2700
PC3200
PC2100
PC2700
PC3200
PC2100
PC2700
PC3200
PC2100
PC2700
PC3200
PC2100
PC2700
PC3200
PC2100
PC2700
PC3200
CAS
Latency
CL2.5
CL2.5
CL3
CL2.5
CL2.5
CL3
CL2.5
CL2.5
CL3
CL2.5
CL2.5
CL3
CL2.5
CL2.5
CL3
CL2.5
CL2.5
CL3
CL2.5
CL2.5
CL3
ECC
V/I Part Number
VR4CU167228C(*)H
VR4CU167228C(*)K
VR4CU167228C(*)P
VR4CU327228C(*)H
VR4CU327228C(*)K
VR4CU327228C(*)P
VR4CU167228C(*)H
VR4CU167228C(*)K
VR4CU167228C(*)P
VR4CU327228C(*)H
VR4CU327228C(*)K
VR4CU327228C(*)P
Capacity
128MB
128MB
128MB
256MB
256MB
256MB
128MB
128MB
128MB
256MB
256MB
256MB
Module
Configuration
16M x 72
16M x 72
16M x 72
32M x 72
32M x 72
32M x 72
16M x 72
16M x 72
16M x 72
32M x 72
32M x 72
32M x 72
Device
Configuration
16M x 8 bit (9)
16M x 8 bit (9)
16M x 8 bit (9)
16M x 8 bit (18)
16M x 8 bit (18)
16M x 8 bit (18)
16M x 8 bit (9)
16M x 8 bit (9)
16M x 8 bit (9)
16M x 8 bit (18)
16M x 8 bit (18)
16M x 8 bit (18)
Module
Height (in.)
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
Module
Ranks
1
1
1
2
2
2
1
1
1
2
2
2
Performance
PC2100
PC2700
PC3200
PC2100
PC2700
PC3200
PC2100
PC2700
PC3200
PC2100
PC2700
PC3200
CAS
Latency
CL2.5
CL2.5
CL3
CL2.5
CL2.5
CL3
CL2.5
CL2.5
CL3
CL2.5
CL2.5
CL3
Viking Modular Solutions♦20091 Ellipse♦Foothill Ranch, CA 92610
Tel (800) 338-2361 Fax (949) 666-8159♦Website: http://www.vikingmodular.com
This Data Sheet is subject to change without notice.
Doc. # PS4CUxxxx28xxx-LF
Revision A3 Created By: Brian Ouellette
Page 1 of 20
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