Guangjie Technology was established in October 1997 in Hsinchu Science Park. It is the first professional manufacturer in Taiwan that combines thin film/thick film process technology with high-frequency passive component/module design and development capabilities. It has an excellent technical R&D team and is committed to the research and development of thin film process technology and the design and development of high-frequency component/module integration. It provides key components such as integrated passive components and high-frequency modules that meet the high-frequency and miniaturization needs of system products. It has successfully integrated passive components such as resistors/capacitors/inductors/diodes (Integrated Passive Devices, IPDs), which can be widely used in mobile personal electronic products. Anti-static and electromagnetic filtering (ESD & EMI Filter), etc.
void uart_irq(void *context,unsigned long id) {IOWR_ALTERA_AVALON_UART_STATUS(UART_232_BASE,0x0); //I wanted to clear the flag bit. Writing 0 to some bits of the status register can clear them, but wr...
A few days ago, a new development board was added to MicroPython: Limiprog.This is also a [url=https://www.kickstarter.com/projects/765344573/limifrog-ultra-compact-prototyping-for-iot-and-muc]develop...
Power Design Tip 37: Compromise between input capacitor ripple current and line voltage range : https://training.eeworld.com.cn/course/481?Power supply design tip 38: Compromise between input capacito...
Oh, sorry, I gained so much from the embedded seminar on Saturday. I can't wait to share it with you before the final materials are all out. If there are any mistakes, please give me your advice: At t...
How can I access the Internet under WINCE? The help says that I need to insert a network card. My network card is CS8900. How can I find the network card device? It was added when the kernel was compi...
August 19, 2025 – Mouser Electronics, a leading New Product Introduction (NPI) distributor offering an extensive portfolio of semiconductors and electronic components, announced that
it will be...[Details]
Efficient Power Conversion (EPC) today announced that the Beijing Intellectual Property Court has dismissed an appeal filed by Innoscience (Suzhou) Technology Co., Ltd. (Innoscience) and reaffirmed...[Details]
On August 7, Sandisk introduced the concept of HBF high-bandwidth flash memory earlier this year. This is a new type of storage similar to HBM memory but based on NAND. It is designed specifically ...[Details]
November 5, 2025 – Mouser Electronics, a global authorized distributor of semiconductors and electronics, is now stocking new products from Renesas Electronics, a leading supplier of security solut...[Details]
On October 27th,
Xinlian Integrated Circuits (2025 Q3 earnings call) released a significant signal: the company achieved revenue of 5.422 billion yuan in the first three quarters, a year-on-yea...[Details]
summary
This article provides a step-by-step guide for importing third-party SPICE models into LTspice
. It covers the import process for two different types of models: those i...[Details]
This article was compiled from Semiengineering.
As chip design scales up and becomes increasingly complex, especially for chips designed for artificial intelligence (AI) and high-perform...[Details]
Beijing, China, November 2025 – SmartDV Technologies™, a leading developer of flexible, highly configurable, and customizable semiconductor design intellectual property (IP) and verification IP (VI...[Details]
From December 11th to 12th, the Shanghai Integrated Circuit 2024 Industry Development Forum and China Integrated Circuit Design Industry Exhibition (ICCAD 2024), an annual event highly anticipate...[Details]
On October 18, TSMC CEO and Chairman Wei Zhejia was asked in the company's recent earnings conference call whether TSMC is interested in acquiring Intel's wafer fab. Wei Zhejia responded by saying ...[Details]
According to the American Association for the Advancement of Science on the 10th, scientists from the U.S. Department of Energy's Brookhaven National Laboratory designed and tested the world's high...[Details]
On September 26, according to the Wuxi Photonic Chip Research Institute of Shanghai Jiao Tong University, on September 25, at the 2024 Integrated Circuit (Wuxi) Innovation and Development Conferenc...[Details]
On September 26, SK Hynix announced today that the company has taken the lead in the world to start mass production of 12-layer HBM3E chips, achieving the largest 36GB capacity among existing HBM p...[Details]
DigiKey is a leading global stock distributor of electronic components and automation products, offering a full range of products for immediate shipment. DigiKey
is pleased to announce that i...[Details]
Revenue and earnings exceeded expectations, and free cash flow increased 41% month-on-month
October 29, 2024 – ON Semiconductor (ONSEMI) announced its third quarter 2024 results, w...[Details]
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