In July 1998, Fudan Microelectronics was jointly founded by Fudan University's "National Key Laboratory of ASICs and Systems", Shanghai Commercial Investment Company and a group of entrepreneurs who dreamed of creating the best integrated circuit design company (chip design) in China. Since its establishment, the company has successfully established a pivotal position in the domestic integrated circuit design industry. The company was listed in Hong Kong on August 4, 2000 (stock code: 1385), becoming the first listed company in the domestic integrated circuit design industry. Today, Fudan Microelectronics has grown from more than 10 entrepreneurs to a company with more than 600 employees, with users all over the world. The company has attracted the attention of domestic and foreign peers with its excellent management, good development potential and outstanding performance. In 2011, Fudan Microelectronics was selected as the "Best Small and Medium-sized Listed Company" by the editors of Forbes Asia magazine.
Security and identification chips, including identification and storage, intelligence and security, and identification device modules
Smart meter, MCU for smart meter, power line carrier
Non-volatile memory, EEPROM, SPI NOR Flash, SPI NAND Flash, NNVM
Special analog circuit, special circuit for leakage protector, special circuit for A-type leakage protector, special circuit for leakage protector with overvoltage and undervoltage, special circuit for S-type leakage protector, telephone call circuit, lighting automobile and motorcycle electronic circuit
We have previously introduced the graphical programming method using MakeCode. By using the graphical method, you can easily and quickly write programs. Through extensions (libraries), it is also very...
Thanks to Mir for giving me the opportunity to review this product again. Let’s start with the unboxing review.The packaging of this board is similar to that of the previous MP151 board, and comes wit...
SPI communication, only 10 instructions are needed to complete complex tasks.Single module with four-axis output, multiple modules with multiple slaves can work up to 120 axes.Supports four-axis, thre...
The inline assembly program of gcc is very different from the inline assembly language of iar. How can I modify it from the syntax of gcc to the syntax of iar? iar is for msp430. In gcc, __asm volatil...
/*
Based on the dual-channel AD acquisition program of msp430f169/149, internal 2.5V reference voltage, interrupt processing mode, sliding average filteringmode, the stable voltage acquisition is conc...
On August 19th, Intel and Japan's SoftBank Group announced on Monday that SoftBank would invest $2 billion (approximately 14.376 billion RMB at the current exchange rate) in Intel. Under the agreem...[Details]
On August 13, South Korean media the bell quoted industry sources on the 12th local time as saying that Samsung Electronics' "Tesla-exclusive" 2nm advanced process wafer foundry production line bui...[Details]
The 8th China International Import Expo recently opened in Shanghai.
Intel, together with its AI and computing ecosystem partners, showcased its collaborative innovations in AI PCs and intellig...[Details]
BERLIN (Reuters) - AI startup Anthropic said on Thursday it will use up to 1 million Google AI chips, valued at tens of billions of dollars, to train its Claude large-scale model, hoping to boost t...[Details]
Recently, the team led by Researcher Sun Zhong from the Institute of Artificial Intelligence of Peking University, in collaboration with the research team from the School of Integrated Circuits, su...[Details]
On October 16, TSMC announced its third-quarter 2025 financial report. The company's consolidated revenue in the third quarter was approximately NT$989.92 billion (IT Home Note: the current exchang...[Details]
ASML Releases Q3 2025 Financial Report | Net Sales of €7.5 Billion, Net Profit of €2.1 Billion; Net Sales for the Full Year of 2025 are Expected to Increase by Approximately 15%, with a Gross Mar...[Details]
China, October 14, 2025 – STMicroelectronics (ST), a world-leading semiconductor company serving a wide range of electronics applications,
will announce its third-quarter 2025 financial results...[Details]
This article was compiled from Semiengineering.
As chip design scales up and becomes increasingly complex, especially for chips designed for artificial intelligence (AI) and high-perform...[Details]
On December 22, local time, the U.S. Federal Communications Commission (FCC) announced that, based on the results of an interagency review by the White House, it had officially added Chinese compan...[Details]
On December 9th, according to the tech website TechCrunch, Nvidia's advanced AI chips are finally able to return to the Chinese market. Nvidia has issued an official response to this.
The U.S....[Details]
World of Electronic Engineering, Ji Kai
At ICCAD-Expo 2025, Dr. Zhu Yunshan, CEO of Banxin Technology, officially launched DVcrew and PDcrew, AI agents for the chip design field. These t...[Details]
According to The New York Times, as part of a trade agreement between the United States and Taiwan, TSMC will significantly increase its investment in the United States, including building more chi...[Details]
From December 11th to 12th, the Shanghai Integrated Circuit 2024 Industry Development Forum and China Integrated Circuit Design Industry Exhibition (ICCAD 2024), an annual event highly anticipate...[Details]
On October 21, according to a Samsung Semiconductor technology blog on the 17th of this month, local time in South Korea, Samsung Electronics and Lenovo completed the industry's first 128GB CMM-D C...[Details]
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