Suzhou Gotech is a complete and comprehensive manufacturer of design, manufacturing, packaging and sales in the domestic semiconductor discrete device diode industry. From the independent development of front-end chips to various packaging technologies of back-end finished products, it has formed a complete industrial chain. The main products include leadless integrated circuit products and discrete device products with the latest packaging technology, automotive rectifier diodes, power modules, rectifier diode chips, silicon rectifier diodes, switching diodes, Zener diodes, micro bridge piles, military fuses, photovoltaic bypass modules, etc., with a total of more than 50 series and more than 1,500 varieties. The products are widely used in many fields such as aerospace, automobiles, green lighting, IT, household appliances and power supply devices for large equipment. Design and develop silver paste for solar cells and various electronic pastes, and develop and mass produce various new sensors in the field of the Internet of Things.
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According to the latest financial report data, thanks to its leading position in advanced technology, TSMC's profit performance in the second quarter of 2025 was extremely impressive, with net prof...[Details]
August 19, 2025 – Mouser Electronics, a leading New Product Introduction (NPI) distributor offering an extensive portfolio of semiconductors and electronic components, announced that
it will be...[Details]
On August 4, at the 22nd China International Digital Interactive Entertainment Expo (ChinaJoy 2025) which opened last week, Perfect World Esports held the "2025 Perfect World Esports Strategic Coop...[Details]
On November 7, SanDisk executives stated in a conference call following the release of the company's fiscal 2026 Q1 earnings report (ending October 3, 2025) that demand for its NAND flash memory pr...[Details]
In the third quarter, the company's overall product portfolio added more than 585,000 products and nearly 100 suppliers.
DigiKey, a leading global distributor of electronic component...[Details]
Recently, the team led by Researcher Sun Zhong from the Institute of Artificial Intelligence of Peking University, in collaboration with the research team from the School of Integrated Circuits, su...[Details]
On October 16, TSMC announced its third-quarter 2025 financial report. The company's consolidated revenue in the third quarter was approximately NT$989.92 billion (IT Home Note: the current exchang...[Details]
On the 15th, a reporter learned from Tsinghua University that Professor Fang Lu's team in the Department of Electronic Engineering has achieved a major breakthrough in the field of intelligent phot...[Details]
China, October 14, 2025 – STMicroelectronics (ST), a world-leading semiconductor company serving a wide range of electronics applications,
will announce its third-quarter 2025 financial results...[Details]
World of Electronic Engineering, Ji Kai
At ICCAD-Expo 2025, Dr. Zhu Yunshan, CEO of Banxin Technology, officially launched DVcrew and PDcrew, AI agents for the chip design field. These t...[Details]
According to the American Association for the Advancement of Science on the 10th, scientists from the U.S. Department of Energy's Brookhaven National Laboratory designed and tested the world's high...[Details]
On October 10, Jinghe Integrated Circuit announced that the company's 28nm logic chip has passed functional verification and successfully lit up the TV.
This means that Jinghe Integrated has t...[Details]
On September 23, the Wall Street Journal reported yesterday that both TSMC and Samsung Electronics have explored the possibility of building large-scale wafer factories in the United Arab Emirates....[Details]
On December 6, Taiwan's Economic Daily reported that the industry once again reported that TSMC's 2nm trial production yield was better than expected. According to TSMC's official plan, its 2nm pro...[Details]
On November 14, according to Korean media ETNews, Samsung Electronics, SK Hynix, and Micron are all interested in using fluxless bonding technology in the next-generation HBM4 memory and are making...[Details]