EGP10A thru EGP10G
Glass Passivated Junction Fast Efficient Rectifiers
Reverse Voltage 50 to 400 Volts Forward Current 1.0 Ampere
Features
Cavity-free glass-passivated junction
Ultrafast reverse recovery time
Low forward voltage drop
Low leakage current
Low switching losses, high efficiency
High forward surge capability
Solder Dip 260 °C, 40 seconds
Mechanical Data
Case: DO-204AL, molded epoxy over glass body Epoxy meets
UL-94V-0 Flammability rating
Terminals: Matte tin plated leads, solderable per J-STD-002B
and JESD22-B102D
E3 suffix for commercial grade, HE3 suffix for high reliability
grade (AEC Q101 qualified)
Polarity: Color band denotes cathode end
Weight: 0.012 ounce, 0.34 gram
Maximum Ratings and Electrical Characteristics
Ratings at 25
o
C ambient temperature unless otherwise specified.
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55
o
C
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
@T
A
=25
o
C
@T
A
=125
o
C
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
θ
JA
T
J
, T
STG
EGP
10A
50
35
50
EGP
10B
100
70
100
EGP
10C
150
105
150
1.0
30.0
0.95
5.0
100
50
22.0
50.0
EGP
10D
200
140
200
EGP
10F
300
210
300
EGP
10G
400
280
400
Unit
Volts
Volts
Volts
Amp
Amps
1.25
Volts
uA
nS
Maximum reverse recovery time at I
F
= 0.5 A, I
R
= 1.0 A,
I
rr
= 0.25 A
Typical junction capacitance at 4.0 V, 1 MHz
Typical thermal resistance (Note 1)
Operating junction and storage temperature range
Notes:
15.0
o
pF
C/W
o
-55 to +150
C
1. Thermal resistance from junction to ambient at 0.375"(9.5mm) lead length
2. Pulse test: 300us pulse width, 1% duty cycle
159
Parametric
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FPGA/CPLD
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