Elite Semiconductor Memory Technology Inc. (ESMT) is a professional IC design company founded by Dr. Hu Zhao in June 1998. Its headquarters is located in Hsinchu Science Park, Taiwan. The company's main business includes research, development, manufacturing, sales and related technical services of IC products. It was listed on the Taiwan Stock Exchange in March 2002.
1. Types of fire-fighting facilities: There are 13 types of fire-fighting facilities in buildings: (i) Building fire prevention and safe evacuation facilities (ii) Fire-fighting water supply (iii) Smo...
I want to directly input the external signal into one channel of F427 through the follower without any external amplifier. I wonder if it is possible to measure 0.5mV DC voltage with 0.1% accuracy?...
The host can ping the target, but the target cannot ping the host. The target cannot ping itself either, and always says no answer from 192.168.XX.XX How much does it mean that the host can ping the t...
PC communicates with wince os. WinceOS sends messages to PC and the sending and receiving are successful. PC sends messages to WinceOS and the sending is successful but the receiving fails. It cannot ...
I exit a program, but the device I opened is not closed properly before exiting. Will the device be closed normally after exiting? If I want my program to be effective forever after opening it once, u...
Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]
Chip architecture licensing company ARM has hired Amazon's AI chip chief Rami Sinno to help advance its plan to develop its own complete chip, people familiar with the matter said, according to Reu...[Details]
On November 6, Fujitsu announced its traditional HPC and quantum chip development roadmap at the 34th meeting of the Industrial Structure Deliberation Council's Green Innovation Project Division's ...[Details]
November 3rd news: EUV process is an advanced process that cannot be bypassed after the 5nm node. Only ASML in the Netherlands can produce EUV lithography machines, but Japan has a great advantage ...[Details]
Eindhoven, Netherlands – October 29, 2025 –
NXP Semiconductors (NASDAQ: NXPI) announced the completion of its acquisition of Aviva Links and Kinara.
On October 24, 2025, NXP comple...[Details]
October 27, 2025, China – STMicroelectronics (ST), a leading global semiconductor company serving diverse electronics applications, announced that it
will hold an Extraordinary General Meeting ...[Details]
In today's era of explosive growth in data-intensive applications, from artificial intelligence and machine learning to high-performance computing (HPC) and gaming, the performance limits of tradit...[Details]
On December 17, The Elec reported that Samsung announced it has successfully developed a new type of transistor with Samsung Advanced Institute of Technology, enabling DRAM production at process no...[Details]
Coherent announced the successful development of a next-generation 300mm silicon carbide (SiC) solution, leveraging its expertise in 200mm SiC platforms. This solution is specifically designed to h...[Details]
From November 20th to 21st, 2025,
the "Chengdu-Chongqing Integrated Circuit Industry Development Forum 2025 and the 31st Integrated Circuit Design Industry Exhibition (ICCAD-Expo 2025)" success...[Details]
On November 25th, media reports indicated that amidst the continued shortage of advanced packaging capacity at TSMC's CoWoS, the semiconductor industry's demand for alternative solutions is increas...[Details]
Infineon introduces the new AURIX™ Configuration Studio software development integration tool to accelerate software development for its AURIX™ series devices.
Infineon Technolo...[Details]
Innovation leads the development of CMOS millimeter-wave radar technology, Calterah founder wins another award
From December 11 to 12, 2024,
the Shanghai Integrated Circuit 2024 ...[Details]
On January 12, storage giant Micron Technology announced that it will officially break ground on January 16 in New York State to build its planned mega-wafer fab.
The project is expected to ha...[Details]
On October 15, Kyodo News reported on the 10th local time of this month that the Japanese government plans to directly invest in the advanced chip manufacturer Rapidus through capital contribution ...[Details]