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GBJ1002

Description
GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER Passivated glass single-phase bridge rectifier
CategoryDiscrete semiconductor   
File Size143KB,2 Pages
ManufacturerHORNBY
Websitehttp://www.hornby.com.cn/
Nantong Kangbi Electronics Co., Ltd. specializes in manufacturing power devices such as rectifier diodes, surface mounted diodes, silicon bridge rectifiers, MOS tubes, etc. After more than 20 years of development, the annual production of semiconductor device finished parts has reached 6 billion pieces. It has now become a semiconductor device supplier integrating R&D, production and service, providing semiconductor parts and related services to customers all over the world. The company has passed ISO9001, ISO14001, TS16949, OHSAS18001, UL and other international certifications. At the same time, it has also been recognized by many well-known international and domestic companies, such as Haier, Huawei, Foxconn, Omron, AOC, Skyworth, Samsung, Huntkey, AGASTYA, YUKITA, MERITEK, SUNPOWER, etc. The products are widely used in various consumer electronics, communication electronics, home appliances, energy-saving lighting, automotive electronics, wind energy, solar photovoltaic and other industries. The new generation of energy-saving and ultra-low power consumption devices have been widely used in the partners' 6-level energy-efficient power supply products; SMD patch products use automated equipment and appearance inspection systems to ensure product quality; the company has the core chip R&D and production capabilities and can customize products according to customer needs.
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GBJ1002 Overview

GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER Passivated glass single-phase bridge rectifier

Features

Product Name: GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER


Product model: GBJ1002


Product Description:


? Low forward voltage drop,high current capability


? Ideal for printed circuit board


? Plastic material has Underwriters Laboratory


Flammability Classification 94V-0


? Reliable low cost construction utilizing molded


plastic technique



parameter:


Vrrm (reverse repetitive peak voltage): 200V


I (AV) (average forward rectified current): 10A


(Forward surge current): 170A


IF (average forward current): 5A


VF (forward voltage): 1V


IR (reverse DC current): 5?A TA=25 C


500??A TA=125 C


Package:GBJ


GBJ1002 Preview

Download Datasheet
GBJ10005 THRU GBJ1010
GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER
REVERSE VOLTAGE:
FORWARD CURRENT:
FEATURES
· Low forward voltage drop,high current capability
· Ideal for printed circuit board
· Plastic material has Underwriters Laboratory
Flammability Classification 94V-0
· Reliable low cost construction utilizing molded
plastic technique
50 to 1000 VOLTS
10.0 AMPERE
GBJ
MECHANICAL DATA
Case: Molded plastic, GBJ
Epoxy: UL 94V-O rate flame retardant
Terminals: Leads solderable per MIL-STD-202,
method 208 guaranteed
Mounting position: Any
Weight: 0.23ounce, 6.6gram
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Ratings at 25
ambient temperature unless otherwise specified.
Single phase, half wave, 60H
Z
, resistive or inductive load.
For capacitive load, derate current by 20%.
Symbols
GBJ10005 GBJ1001
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
with Heatsink at T
C
=110℃
Peak Forward Surge Current,
8.3ms single half-sine-wave
superimposed on rated load (JEDEC method)
Maximum Forward Voltage Drop per Element
at 5.0A DC and 25℃
Maximum Reverse Current
at Rated DC Blocking Voltage
at T
A
=25℃
T
A
=125℃
I
R
C
J
R
θJC
T
J
,Tstg
V
F
I
FSM
V
RRM
V
RMS
V
DC
I
(AV)
GBJ1002
GBJ1004
GBJ1006
GBJ1008
GBJ1010
Units
Volts
Volts
Volts
Amp
50
35
50
100
70
100
200
140
200
400
280
400
10.0
600
420
600
800
560
800
1000
700
1000
170
Amp
1.05
5.0
500
55
1.4
-55 to +150
Volts
uAmp
pF
℃/W
Typical Junction Capacitance (Note 1)
Typical Thermal Resistance (Note 2)
Operating and Storage Temperature Range
NOTES:
1- Measured at 1 MH
Z
and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance fromn Junction to Case with Device Mounted on 150mm x 150mm x 1.6mmCu Plate Heatsink.
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