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GD32F130F6P6

Description
ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 48; Memory (Bytes) Flash: 32K; Memory (Bytes) SRAM: 4K; I/O: up to 15; Timer GPTM (32bit): 1; Timer GPTM (16bit): 4; Timer Advanced TM (16bit): 1; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity USART: 2; Connectivity I2C: 1; Connectivity SPI: 1; Analog Interface 12bit ADC Units (CHs): 1(9); Package: TSSOP20
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,55 Pages
ManufacturerGigaDevice
Websitehttp://www.gigadevice.com

Founded in Silicon Valley in 2005, GigaDevice is a leading fabless semiconductor company dedicated to providing advanced storage technologies and IC solutions. The company successfully completed its IPO on the Shanghai Stock Exchange in 2016. GigaDevice offers a wide range of high-performance flash memory and 32-bit general-purpose MCU products. It is one of the pioneers of SPI NOR flash memory and currently ranks third in the world in this market segment, with more than 1 billion units shipped annually.

Since 2007, GigaDevice has filed more than 600 patent applications and obtained more than 200 patents. More than 55% of employees are engaged in research and development, which is the basis for continuously differentiating its products from competitors in the market. The GigaDevice management team has absorbed the leading semiconductor industry experience of well-known storage companies in Silicon Valley, South Korea and Taiwan. GigaDevice has passed ISO9001 and ISO14001 certifications from DQS.

GigaDevice currently produces SPI NOR Flash, SPI NAND Flash, and MCUs for embedded, consumer, and mobile communications applications. Its manufacturing model is based on strong relationships with foundry, assembly, and test subcontractor partners. GigaDevice believes that this clearly defined fabless manufacturing model offers a competitive advantage over traditional manufacturing-based integrated device manufacturers because capital equipment expenditures to maintain advanced memory process technologies exceed market returns in many IC memory market sectors. GigaDevice's foundry partners' continued investment in advanced equipment and their rapid growth in 12" wafer capacity are key factors in its success over competitors.

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GD32F130F6P6 Overview

ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 48; Memory (Bytes) Flash: 32K; Memory (Bytes) SRAM: 4K; I/O: up to 15; Timer GPTM (32bit): 1; Timer GPTM (16bit): 4; Timer Advanced TM (16bit): 1; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity USART: 2; Connectivity I2C: 1; Connectivity SPI: 1; Analog Interface 12bit ADC Units (CHs): 1(9); Package: TSSOP20

GD32F130F6P6 Parametric

Parameter NameAttribute value
Parts packaging codeTSSOP20
Reach Compliance Codeunknown
Is SamacsysN
Base Number Matches1
Max Speed (MHz)48
Memory (Bytes) Flash32K
Memory (Bytes) SRAM4K
I/Oup to 15
Timer GPTM (32bit)1
Timer GPTM (16bit)4
Timer Advanced TM (16bit)1
Timer Basic TM (16bit)
Timer SysTick (24bit)1
Timer WDG2
Timer RTC1
Connectivity USART2
Connectivity I2C1
Connectivity SPI1
Connectivity USB 2 FS
Connectivity I2S
Connectivity Comp
Connectivity OP-AMP
Analog Interface 12bit ADC Units (CHs)1(9)
Analog Interface 12bit DAC Units
PackageTSSOP20
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