3.0SMCJ SERIES
SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR PEAK PULSE POWER 3000Watts
STAND-OFF VOL
TAGE
5.0 to 220 Volts
Recongnized File # E210467
FEATURES
• For surface mounted applications in order to optimize board space.
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Low inductance
• Typical I
D
less than 1.0µA above 10V
• Plastic package has Underwriters Laboratory Flammability Classifica-
tion 94V-O
• High temperature soldering : 260°C /10 seconds at terminals
• In compliance with EU RoHS 2002/95/EC directives
MECHANICALDATA
• Case: JEDEC DO-214AB,Molded plastic over passivated junction.
• Terminals: Solder plated,solderable per MIL-STD-750, Method 2026
• Polarity: Color band denotes positive end (cathode)
• Standard Packaging:16mm tape (EIA-481)
• Weight: 0.008 ounce, 0.232 gram
DEVICES FOR BIPOLAR APPLICATIONS
For Bidirectional use C or CA Suffix for types 3.0SMCJ5.0 thru types 3.0SMCJ220.
Electrical characteristics apply in both directions.
MAXIMUM RATINGS AND CHARACTERISTICS
Rating at 25°Cambient temperature unless otherwise specified. Resistive or inductive load, 60Hz.
For Capacitive load derate current by 20%.
Rating
Peak Pulse Power Dissipation on 10/1000u
µ
waveform (Notes 1,2, Fig.1)
Peak Forward Surge Current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method) (Notes 2,3)
Peak Pulse Current on 10/1000
µ
s waveform(Note 1)Fig.3
Typical Thermal Resistance Junction to Air
Operating Junction and Storage Temperature Range
Symbol
P
PPM
I
FSM
I
PPM
R
θ
JA
T
J
,T
STG
Value
3000
200
see Table 1
25
-55 to +150
Units
Watts
Amps
Amps
O
C/W
O
C
NOTES:
1.Non-repetitive current pulse, per Fig. 3 and derated above T
A
=25°Cper
Fig. 2.
2.Mounted on 8.0mm
2
( .013mm thick) land areas.
3.Measured on 8.3ms , single half sine-wave or equivalent square wave , duty cycle= 4 pulses per minutes maximum.
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PAGE . 1
3.0SMCJ SERIES
P
PPM
,PEAK PULSE FORWARD,KW
100
Non-Repetitve
Pulse Wavefom
Shown in Figure.3
T
A
= 25
O
C
100
PEAK PULSE FORWARD (P
PP
) OR CURRENT (I
PP
)
DERATING IN PERCENTAGE %
75
10
50
1.0
25
0.1
0.1
1.0
10
100
1000
10000
0
0
25
50
75
100
125
150
175
200
td,PULSE WIDTH, micro sec
T
A
,AMBIENT TEMPERATURE,
O
C
Fig.1 PEAK PULSE POWER RATING CURVE
Fig.2 DERATING CURVE
10000
I
PPM
,PEAK PULSE CURRENT,%
150
tf = 10usec
T
A
= 25
O
C
Pulse Width (td) is Defined
as the Point where the Peak
Current Decayst to 50% of Ipp
Unidirectional
Bidirectional
100
Peak Value
Ippm
CJ,CAPACIT
ANCE,p F
V
R
= 0
1000
Ha lf Va lue-Ip p
2
V
R
= Rated
Stand-off Voltage
100
50
10/1000u se c Wa ve fo rm
a s Defined b ye R.E.A.
e-kt
f = 1MHz
Vsig = 50mVp-p
T
J =
25°C
10
5
td
0
0
1.0
2.0
3.0
4.0
10
10
100
500
T,TIME,ms
VRWM, Reverse Stand-off Voltage (V)
Fig.3 PULSE WAVEFORM
Fig.4 TYPICAL JUNCTION CAPACITANCE
I
FSM
,PEAK FORWARD SURGE CURRENT,
AMPERES
200
T
J
= T
J
ma x
8.3m s Sing le Ha lf S in e-Wa ve
JEDEC Metho d
100
50
10
1
5
10
50
100
NUMBER OF CYCLES AT 60Hz
Fig.5 MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
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PAGE . 4
3.0SMCJ SERIES
MOUNTING PAD LAYOUT
ORDER INFORMATION
• Packing information
T/R - 3K per 13" plastic Reel
T/R - 0.5Kper 7” plastic Reel
LEGAL STATEMENT
Copyright PanJit International, Inc 2011
The information presented in this document is believed to be accurate and reliable. The specifications and information herein
are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit
does not convey any license under its patent rights or rights of others.
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PAGE .
5
Microchip MCU
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