Tj Junction Temperature ................................................................................................................................ +150
°C
•
Maximum Power Dissipation
Total Power Dissipation (T
A
=25°C) ................................................................................................................. 1.25 W
•
Maximum Voltages and Currents
BV
CBO
Collector to Base Breakdown Voltage ...................................................................................................... 80 V
BV
CEO
Collector to Emitter Breakdown Voltage................................................................................................... 80 V
BV
EBO
Emitter to Base Emitter Breakdown Voltage .............................................................................................. 5 V
I
C
Collector Current (DC) ....................................................................................................................................... 2 A
Electrical Characteristics
(T
A
=25°C)
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
I
EBO
*V
CE(sat)
*V
BE(sat)
*h
FE
f
T
Cob
T
on
T
stg
T
f
Min.
80
80
5
-
-
-
-
300
-
-
-
-
-
Typ.
-
-
-
-
-
0.15
0.9
-
100
30
0.2
1.0
0.2
Max.
-
-
-
1000
1000
0.5
1.2
-
-
-
-
-
-
MHz
pF
uS
uS
uS
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Unit
V
V
V
nA
nA
V
V
I
C
=100uA
I
C
=10mA
I
E
=100uA
V
CB
=80V
V
EB
=5V
Test Conditions
I
C
=1A, I
B
=50mA
I
C
=1A, I
B
=50mA
V
CE
=2V, I
C
=500mA
V
CE
=2V, I
C
=500mA
V
CB
=10V, f=1MHz
I
B1
=-I
B2
=50mA
Duty Cycle≤1%
HJ3669
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
10000
100000
Spec. No. : HE6029
Issued Date : 1997.10.24
Revised Date : 2005.07.14
Page No. : 2/4
Saturation Voltage & Collector Current
V
CE
=10V
Saturation Voltage (mV)
1000
10000
hFE
100
1000
10
100
V
CE(sat)
@ I
C
=20I
B
1
0.1
1
10
100
1000
10000
10
0.1
1
10
100
1000
10000
Collector Current (mA)
Collector Current (mA)
Saturation Voltage & Collector Current
10000
Capacitance & Reverse-Biased Voltage
100.0
Saturation Voltage (mV)
Capacitance (pF)
1000
10.0
Cob
V
BE(sat)
@ I
C
=20I
B
100
0
1
10
100
1000
10000
1.0
0.1
Collector Current (mA)
1.0
10.0
Reverse Based Voltage (V)
100.0
Safe Operation Area
100000
10000
Collector Current (mA)
1000
100
P
T
=1ms
P
T
=100ms
P
T
=1s
10
1
1
10
100
1000
Forward Voltage (V)
HJ3669
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
M
A
F
C
G
1
2
3
Date Code
Spec. No. : HE6029
Issued Date : 1997.10.24
Revised Date : 2005.07.14
Page No. : 3/4
Marking:
a1
Pb Free Mark
Pb-Free: "
.
"
(Note)
H
Normal: None
J
3 6 6 9
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
N
H
a5
L
a2
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
C
F
G
H
L
M
N
a1
a2
a5
Min.
6.35
4.80
1.30
5.40
2.20
0.40
2.20
0.90
0.40
-
0.65
Max.
6.80
5.50
1.70
6.25
3.00
0.90
2.40
1.50
0.65
*2.30
1.05
*: Typical, Unit: mm
a1
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
A
B
C
D
a1
E
Marking:
M
F
y1
a1
Pb-Free: "
.
"
(Note)
H
Normal: None
Pb Free Mark
J
3 6 6 9
Date Code
Control Code
GI
y1
y1
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
J
K
a2
y2
H
N
L
a2
y2
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
a1
O
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
a1
a2
y1
y2
Min.
6.40
-
5.04
-
0.40
0.50
5.90
2.50
9.20
0.60
-
0.66
2.20
0.70
0.82
0.40
2.10
-
-
Max.
6.80
6.00
5.64
*4.34
0.80
0.90
6.30
2.90
9.80
1.00
0.96
0.86
2.40
1.10
1.22
0.60
2.50
5
o
3
o
*: Typical, Unit: mm
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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