Nomenclature of TMS320 series DSP chips

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Nomenclature of TMS320 series DSP chips [Copy link]

TMS 320 (B) VC 5402 PGE (L) 1 2 3 4 5 6 7 2. Prefix: TMX = Experimental device TMP = Prototype device TMS = Qualified device 3. Series number: 320 = TMS320 series 4. Bootloader option: (B) 5. Process: C = CMOS E = CMOS EPROM F = Flash EEPROM LC = Low voltage CMOS (3.3V) LF=Flash EPROM（3.3V） VC=低电压CMOS（3V） UC=超低电压CMOS（1.8-3.6V，内核1.8V） 5.器件类型： C1X: 10,14,15,46,17 C2X: 25,26 C20X: 203,206 C40X: 40,44 C5X: 50,51,52,53,56,57 C2000 C24x: 240,241,243 2401,2402,2403,2404,2406,2407 C28X: 2801,2802,2806,2808,2809,2810,2811,2812,28015,28016, 28044 C5000 C54X: 541-549 5401,5402,5404,5405,5407,5409,5410,5416,5420,5421,5470,5471 C55X: 5502,5503,5506,5507,5509,5510 C6000 C62X: 6201-6205,6211 C64X: 6410-6416,6418,6 4210,6424,6454,6455 C67X: 6701,6711,6712,6713,6720,6722,6726,6727 6. Package type: PAG=64 -Pin plastic TQFP PGE=144 -lead Plastic TQFP PZ=100 -lead Plastic TQFP 、 7. Temperature Range: (Default 0°C-70°C) L=0°C~70°C A=-40°C~85°C S=-40°C~125°C M=-11°C~125°C Q=-40°C~85°C,Q100 Fault Grading 8. Additional Notes: PLCC=Plastic Chip Carrier with J-Leads QFP = Quad Flat Pack TQFP = Thin Quad Flat Pack