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TLV2382IDGK

Part NumberTLV2382IDGK
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size6418.5,20 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Download Datasheet Parametric

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TLV2382IDGKR Texas Instruments Basic information of TLV2382IDGKR amplifier:TLV2382IDGKR is an OPERATIONAL AMPLIFIER. Commonly used ...

TLV2382IDGK Overview

Basic information of TLV2382IDGK amplifier:

TLV2382IDGK is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are ULTRA SMALL, PLASTIC, VSSOP-8

TLV2382IDGK amplifier core information:

The minimum operating temperature of the TLV2382IDGK is -40 °C and the maximum operating temperature is 125 °C. Maximum bias current at 25°C is: 0.00006 µA Its maximum average bias current is 0.00006 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TLV2382IDGK is 0.06 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2382IDGK gain becomes 0.707 times the low-frequency gain is 160 kHz. The power of TLV2382IDGK is NO. Its programmable power is NO.

The nominal supply voltage of the TLV2382IDGK is 5 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the TLV2382IDGK is 6500 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of TLV2382IDGK:

The width of TLV2382IDGK is: 3 mm, and the length is 3 mm. TLV2382IDGK has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.65 mm. Total pins: 8

TLV2382IDGK amplifier additional information:

TLV2382IDGK adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2382IDGK is: YES. Its temperature grade is: AUTOMOTIVE.

It is a micropower amplifier. The corresponding JESD-30 code is: S-PDSO-G8. The packaging code of TLV2382IDGK is: TSSOP. The materials used in the TLV2382IDGK package are mostly PLASTIC/EPOXY. The package shape is SQUARE.

The TLV2382IDGK package pin forms are: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH. Its terminal forms are: GULL WING. The maximum seat height is 1.1 mm.

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