Click here to go back to socket part number overview
IC149 Series
(SMT)
Specifications
Insulation Resistance:
Withstanding Voltage:
Contact Resistance:
Operating Temp. Range:
Reflow-soldering Temp.:
Mating Cycles:
Solvent Durability:
Allowable Torque (max.):
QFP/TQFP - 176 Pins
(44x44)
0.5mm pitch
Part Number
(for IC-use)
176 - *66 -
B5
500MΩ at 150V DC
100V
eff
to 700V
eff
for 1 minute
30mΩ max. at 10mA and 20mV
-25°C to +85°C
220°C for 60 seconds
20 insertions maximum
Freon
- for 1-time screw connection
= max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
IC149
Series No.
-
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating:
Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
.
B5
=
Au over Ni
Compatible Emulation-Adapter
not available
Outline Socket Dimensions
(Reference Only)
39.00
Remarks
1.
Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
25.30 x 25.30
2.
This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3.
Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4.
If using the Socket with an Adapter, please use the gold-plated Socket
version.
12.60
12.30
39.00
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
Sockets and Connectors
Click here to go back to socket part number overview
IC149 Series
(SMT)
Specifications
Insulation Resistance:
Withstanding Voltage:
Contact Resistance:
Operating Temp. Range:
Reflow-soldering Temp.:
Mating Cycles:
Solvent Durability:
Allowable Torque (max.):
QFP/TQFP - 272 Pins
(68x68)
0.5mm pitch
Part Number
(for IC-use)
272 - *29 -
BB5
500MΩ at 150V DC
100V
eff
to 700V
eff
for 1 minute
30mΩ max. at 10mA and 20mV
-25°C to +85°C
220°C for 60 seconds
20 insertions maximum
Freon
- for 1-time screw connection
= max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
IC149
Series No.
-
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5
=
Au over Ni
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating:
Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
.
Compatible Emulation-Adapter
not available
Outline Socket Dimensions
(Reference Only)
51.00
Remarks
37.90 x 37.90
51.00
1.
Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2.
This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3.
Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4.
If using the Socket with an Adapter, please use the gold-plated Socket
version.
14.20
12.30
Socket PCB-Layout
Top View from Socket
IC - Dimensions
Detail A
(37.40)
0.15 ±0.05
N2
0.20 ±0.05
37.60 ±0.2
1.02
N3
N5
Detail A
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N2: These holes are only necessary when fixing the Socket with screws.
N3: These holes are only necessary for use with positioning pins.
N5: No conduits within this hatched area.
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
Sockets and Connectors
Click here to go back to socket part number overview
IC149 Series
(SMT)
Specifications
Insulation Resistance:
Withstanding Voltage:
Contact Resistance:
Operating Temp. Range:
Reflow-soldering Temp.:
Mating Cycles:
Solvent Durability:
Allowable Torque (max.):
QFP/TQFP - 208 Pins
(52x52)
0.5mm pitch
Part Number
(for IC-use)
208 - *61 -
B5
500MΩ at 150V DC
100V
eff
to 700V
eff
for 1 minute
30mΩ max. at 10mA and 20mV
-25°C to +85°C
220°C for 60 seconds
20 insertions maximum
Freon
- for 1-time screw connection
= max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
IC149
Series No.
-
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating:
Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
.
B5
=
Au over Ni
Compatible Emulation-Adapter
not available
Outline Socket Dimensions
(Reference Only)
43.60
Remarks
1.
Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
29.20 x 29.20
2.
This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3.
Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4.
If using the Socket with an Adapter, please use the gold-plated Socket
version.
IC - Dimensions
12.60
12.30
43.60
Socket PCB-Layout
Top View from Socket
N3
Notes:
N1:
Metal soldering Tab Clip.
Socket may be stabilized by soldering (Reflow) in these 4 areas.
N3:
These holes are only necessary for use with positioning pins.
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
Sockets and Connectors
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