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FRE9260D

Description
19 A, 200 V, 0.21 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-258AA
Categorysemiconductor    Discrete semiconductor   
File Size49KB,6 Pages
ManufacturerIntersil ( Renesas )
Websitehttp://www.intersil.com/cda/home/
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FRE9260D Overview

19 A, 200 V, 0.21 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-258AA

FRE9260D, FRE9260R,
FRE9260H
June 1998
19A, -200V, 0.210 Ohm, Rad Hard,
P-Channel Power MOSFETs
Package
TO-258AA
Features
• 19A, -200V, RDS(on) = 0.210Ω
• Second Generation Rad Hard MOSFET Results From New Design Concepts
• Gamma
-
-
-
-
-
-
-
-
Meets Pre-Rad Specifications to 100KRAD(SI)
Defined End Point Specs at 300KRAD(Si) and 1000KRAD(Si)
Performance Permits Limited Use to 3000KRAD(Si)
Survives 3E9RAD(Si)/sec at 80% BVDSS Typically
Survives 2E12 Typically If Current Limited to IDM
18.0nA Per-RAD(Si)/sec Typically
Pre-RAD Specifications for 1E13 Neutrons/cm
2
Usable to 1E14 Neutrons/cm
2
• Gamma Dot
• Photo Current
• Neutron
Description
The Intersil Corporation Sector has designed a series of SECOND GENERATION
hardened power MOSFETs of both N and P channel enhancement types with rat-
ings from 100V to 500V, 1A to 60A, and on resistance as low as 25mΩ. Total dose
hardness is offered at 100KRAD(Si) and 1000KRAD(Si) with neutron hardness
ranging from 1E13n/cm
2
for 500V product to 1E14n/cm
2
for 100V product. Dose
rate hardness (GAMMA DOT) exists for rates to 1E9 without current limiting and
2E12 with current limiting.
This MOSFET is an enhancement-mode silicon-gate power field effect transistor of
the vertical DMOS (VDMOS) structure. It is specially designed and processed to
exhibit minimal characteristic changes to total dose (GAMMA) and neutron (n
o
)
exposures. Design and processing efforts are also directed to enhance survival to
heavy ion (SEE) and/or dose rate (GAMMA DOT) exposure.
This part may be supplied as a die or in various packages other than shown
above. Reliability screening is available as either non TX (commercial), TX equiv-
alent of MIL-S-19500, TXV equivalent of MIL-S-19500, or space equivalent of
MIL-S-19500. Contact the Intersil Corporation High-Reliability Marketing group
for any desired deviations from the data sheet.
Symbol
Absolute Maximum Ratings
(TC = +25
o
C) Unless Otherwise Specified
FRE9260D, R, H
-200
-200
19
12
57
±20
150
60
1.20
57
19
57
-55 to +150
300
UNITS
V
V
A
A
A
V
W
W
W/
o
C
A
A
A
o
C
o
C
Drain-Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS
Drain-Gate Voltage (RGS = 20kΩ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Continuous Drain Current
TC = +25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
TC = +100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Gate-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS
Maximum Power Dissipation
TC = +25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT
TC = +100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT
Derated Above +25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Inductive Current, Clamped, L = 100µH, (See Test Figure). . . . . . . . . . . . . . . . . . . . . . . . . . ILM
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IS
Pulsed Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM
Operating And Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJC, TSTG
Lead Temperature (During Soldering)
Distance > 0.063 in. (1.6mm) From Case, 10s Max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
File Number
1
3269.2

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Description 19 A, 200 V, 0.21 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-258AA 0.21 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-258AA 19 A, 200 V, 0.21 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-258AA
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