MITSUBISHI Nch POWER MOSFET
FS16VS-6
HIGH-SPEED SWITCHING USE
FS16VS-6
OUTLINE DRAWING
r
1.5MAX.
Dimensions in mm
4.5
1.3
10.5MAX.
1.5MAX.
8.6 ± 0.3
9.8 ± 0.5
3.0
–0.5
+0.3
0
+0.3
–0
1
5
0.8
0.5
q w e
wr
2.6 ± 0.4
q
¡V
DSS ................................................................................
300V
¡r
DS (ON) (MAX) ..............................................................
0.33Ω
¡I
D ..........................................................................................
16A
q
GATE
w
DRAIN
e
SOURCE
r
DRAIN
e
TO-220S
APPLICATION
SMPS, DC-DC Converter, battery charger, power
supply of printer, copier, HDD, FDD, TV, VCR, per-
sonal computer etc.
MAXIMUM RATINGS
Symbol
V
DSS
V
GSS
I
D
I
DM
P
D
T
ch
T
stg
—
(Tc = 25°C)
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Drain current (Pulsed)
Maximum power dissipation
Channel temperature
Storage temperature
Weight
V
GS
= 0V
V
DS
= 0V
Conditions
Ratings
300
±30
16
48
125
–55 ~ +150
–55 ~ +150
1.2
4.5
Unit
V
V
A
A
W
°C
°C
g
Feb.1999
Typical value
(1.5)
MITSUBISHI Nch POWER MOSFET
FS16VS-6
HIGH-SPEED SWITCHING USE
ELECTRICAL CHARACTERISTICS
Symbol
V
(BR) DSS
V
(BR) GSS
I
GSS
I
DSS
V
GS (th)
r
DS (ON)
V
DS (ON)
y
fs
C
iss
C
oss
C
rss
t
d (on)
t
r
t
d (off)
t
f
V
SD
R
th (ch-c)
Parameter
(Tch = 25°C)
Test conditions
I
D
= 1mA, V
GS
= 0V
I
G
=
±100µA,
V
DS
= 0V
V
GS
=
±25V,
V
DS
= 0V
V
DS
= 300V, V
GS
= 0V
I
D
= 1mA, V
DS
= 10V
I
D
= 8A, V
GS
= 10V
I
D
= 8A, V
GS
= 10V
I
D
= 8A, V
DS
= 10V
V
DS
= 25V, V
GS
= 0V, f = 1MHz
Limits
Min.
300
±30
—
—
2
—
—
6.5
—
—
—
—
—
—
—
—
—
Typ.
—
—
—
—
3
0.25
2.0
10.0
1050
220
45
20
40
110
50
1.5
—
Max.
—
—
±10
1
4
0.33
2.64
—
—
—
—
—
—
—
—
2.0
1.00
Unit
V
V
µA
mA
V
Ω
V
S
pF
pF
pF
ns
ns
ns
ns
V
°C/W
Drain-source breakdown voltage
Gate-source breakdown voltage
Gate-source leakage current
Drain-source leakage current
Gate-source threshold voltage
Drain-source on-state resistance
Drain-source on-state voltage
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Source-drain voltage
Thermal resistance
V
DD
= 150V, I
D
= 8A, V
GS
= 10V, R
GEN
= R
GS
= 50Ω
I
S
= 8A, V
GS
= 0V
Channel to case
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE
200
POWER DISSIPATION P
D
(W)
DRAIN CURRENT I
D
(A)
MAXIMUM SAFE OPERATING AREA
10
2
7
5
3
2
tw=10µs
100µs
1ms
10ms
T
C
= 25°C
Single Pulse
DC
160
120
80
10
1
7
5
3
2
10
0
7
5
3
2
10
–1
40
0
0
50
100
150
200
2 3 5 7 10
1
2 3 5 7 10
2
2 3 5 7 10
3
2
DRAIN-SOURCE VOLTAGE V
DS
(V)
CASE TEMPERATURE T
C
(°C)
OUTPUT CHARACTERISTICS
(TYPICAL)
50
P
D
=
125W V
GS
= 20V
10V
8V
T
C
= 25°C
Pulse Test
DRAIN CURRENT I
D
(A)
OUTPUT CHARACTERISTICS
(TYPICAL)
V
GS
=20V
10V
20
P
D
= 125W
7V
6V
16
T
C
= 25°C
Pulse Test
5.5V
12
DRAIN CURRENT I
D
(A)
40
7V
30
6V
20
8
5V
4.5V
4V
10
5V
4
0
0
10
20
30
40
50
0
0
4
8
12
16
20
DRAIN-SOURCE VOLTAGE V
DS
(V)
DRAIN-SOURCE VOLTAGE V
DS
(V)
Feb.1999
MITSUBISHI Nch POWER MOSFET
FS16VS-6
HIGH-SPEED SWITCHING USE
ON-STATE VOLTAGE VS.
GATE-SOURCE VOLTAGE
(TYPICAL)
20
0.5
T
C
= 25°C
Pulse Test
16
ON-STATE RESISTANCE VS.
DRAIN CURRENT
(TYPICAL)
T
C
= 25°C
Pulse Test
0.4
20V
0.3
V
GS
= 10V
DRAIN-SOURCE ON-STATE
VOLTAGE V
DS (ON)
(V)
12
I
D
= 30A
8
16A
8A
0
0
4
8
12
16
20
DRAIN-SOURCE ON-STATE
RESISTANCE r
DS (ON)
(Ω)
0.2
4
0.1
0
10
–1
2 3 5 7 10
0
2 3 5 7 10
1
2 3 5 7 10
2
DRAIN CURRENT I
D
(A)
GATE-SOURCE VOLTAGE V
GS
(V)
TRANSFER CHARACTERISTICS
(TYPICAL)
40
T
C
= 25°C
V
DS
= 50V
Pulse Test
10
1
7
5
FORWARD TRANSFER ADMITTANCE
VS.DRAIN CURRENT
(TYPICAL)
T
C
= 25°C
75°C
125°C
3
2
10
0
7
5
3
2
10
–1 0
10
2 3
5 7 10
1
DRAIN CURRENT I
D
(A)
24
16
8
FORWARD TRANSFER
ADMITTANCE
y
fs
(S)
32
0
V
DS
= 10V
Pulse Test
2 3
5 7 10
2
0
4
8
12
16
20
GATE-SOURCE VOLTAGE V
GS
(V)
DRAIN CURRENT I
D
(A)
CAPACITANCE VS.
DRAIN-SOURCE VOLTAGE
(TYPICAL)
5
3
2
10
3
7
5
Ciss
SWITCHING CHARACTERISTICS
(TYPICAL)
Tch = 25°C
V
DD
= 150V
V
GS
= 10V
R
GEN
= R
GS
= 50Ω
10
3
7
5
3
2
10
2
7
5
SWITCHING TIME (ns)
CAPACITANCE
Ciss, Coss, Crss (pF)
3
2
t
d(off)
10
2
7
5
3
2
10
1
10
0
2 3
Coss
t
f
t
r
t
d(on)
5 7 10
1
2 3
5 7 10
2
3 Tch = 25°C
2 f = 1MHz
V
GS
= 0V
10
1
2 3 5 7 10
0
2 3 5 7 10
1
2 3 5 7 10
2
2 3
DRAIN-SOURCE VOLTAGE V
DS
(V)
Crss
DRAIN CURRENT I
D
(A)
Feb.1999
MITSUBISHI Nch POWER MOSFET
FS16VS-6
HIGH-SPEED SWITCHING USE
GATE-SOURCE VOLTAGE
VS.GATE CHARGE
(TYPICAL)
20
40
SOURCE-DRAIN DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
V
GS
= 0V
Pulse Test
25°C
24
75°C
GATE-SOURCE VOLTAGE V
GS
(V)
16
SOURCE CURRENT I
S
(A)
Tch = 25°C
I
D
= 16A
V
DS
= 50V
100V
200V
8
T
C
= 125°C
32
12
16
4
8
0
0
20
40
60
80
100
0
0
0.8
1.6
2.4
3.2
4.0
GATE CHARGE Q
g
(nC)
SOURCE-DRAIN VOLTAGE V
SD
(V)
DRAIN-SOURCE ON-STATE RESISTANCE r
DS (ON)
(25°C)
DRAIN-SOURCE ON-STATE RESISTANCE r
DS (ON)
(t°C)
ON-STATE RESISTANCE VS.
CHANNEL TEMPERATURE
(TYPICAL)
10
1
7
5
3
2
10
0
7
5
3
2
10
–1
–50
0
50
100
150
5.0
V
GS
= 10V
I
D
= 1/2I
D
Pulse Test
THRESHOLD VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
V
DS
= 10V
I
D
= 1mA
4.0
GATE-SOURCE THRESHOLD
VOLTAGE V
GS (th)
(V)
3.0
2.0
1.0
0
–50
0
50
100
150
CHANNEL TEMPERATURE Tch (°C)
CHANNEL TEMPERATURE Tch (°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V
(BR) DSS
(25°C)
TRANSIENT THERMAL IMPEDANCE Z
th (ch–c)
(°C/W)
DRAIN-SOURCE BREAKDOWN VOLTAGE V
(BR) DSS
(t°C)
BREAKDOWN VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
1.4
V
GS
= 0V
I
D
= 1mA
1.2
TRANSIENT THERMAL IMPEDANCE
CHARACTERISTICS
10
1
7
5
3
2
10
0
7
5
3
2
10
–1
7
5
3
2
10
–2
D=1
0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
P
DM
tw
T
D= tw
T
1.0
0.8
0.6
0.4
–50
0
50
100
150
10
–4
2 3 5710
–3
2 3 5710
–2
2 3 5710
–1
2 3 5710
0
2 3 5710
1
2 3 5710
2
PULSE WIDTH t
w
(s)
Feb.1999
CHANNEL TEMPERATURE Tch (°C)
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