177-710-2-37GP6J7-24MDN datasheet, PDF

Datasheet> All Categories > The connector> The connector> 177-710-2-37GP6J7-24MDN

177-710-2-37GP6J7-24MDN: DescriptionInterconnection Device; CategoryThe connector The connector; File Size436KB，4 Pages; ManufacturerGlenair; Websitehttp://www.glenair.com/; Environmental Compliance

Download Datasheet Parametric View All

177-710-2-37GP6J7-24MDN Overview

Interconnection Device

177-710-2-37GP6J7-24MDN Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Reach Compliance Code	compli
Connector type	INTERCONNECTION DEVICE
Base Number Matches	1

Preview

Download Datasheet

View All

MWDM Micro-D Shielded Cable Assemblies

Single-Ended or Double-Ended–These

easy-to-order cable

assemblies eliminate the need for expensive assembly

labor. 100% tested and ready for use.

Now With Twisted Pairs–No

need to create a procurement

speciﬁcation for Micro-D cables with twisted pairs. Glenair

177-740 cables are furnished with a full complement of

white/blue twisted pair wires.

Integral Shield Termination–The

connector shell has a

platform to accept Band-It shield termination bands. The

cable shield braid is attached directly to the connector.

Save Labor, Reduce Weight and Improve EMI Shielding with

Glenair’s Micro-D Shielded Cable Assemblies

Aerospace electronics systems require higher and higher levels of protection from radiated emissions. Glenair’s fully

shielded Micro-D cable assemblies meet this need. The cable shield is attached directly onto the one-piece connector

shell and secured with a stainless steel

BAND-IT

® clamp. These pre-wired, 100% tested assemblies meet the

requirements of MIL-DTL-83513. An optional ground spring on the pin connector assures low shell-to-shell resistance.

Available with a variety of wire types and shields, Micro-D shielded assemblies can be ordered in any length, either

single-ended or “back-to-back”.

Ground Spring and EMI Shielding Effectiveness

– A gold-plated

stainless steel ground spring on the pin connector mating face offers

substantial improvement in EMI protection. The graphs compare

identical connectors tested with and without ground springs.

EMI Performance with Ground Spring

SHIELDING EFFECTIVENESS (DB)

100

1.00E+03

100

1.00E+03

EMI Performance without Ground Spring

1.00E+04

1.00E+05

1.00E+06

1.00E+07

1.00E+08

1.00E+09

1.00E+04

1.00E+05

1.00E+06

1.00E+07

1.00E+08

1.00E+09

FREQUENCY (Hz)

CAGE Code 06324/0CA77

Printed in U.S.A.

GLENAIR, INC. • 1211 AIR WAY • GLENDALE, CA 91201-2497 • 818-247-6000 • FAX 818-500-9912

www.glenair.com

B-8

E-Mail: sales@glenair.com

Recommended Resources

Typical super regenerative radio receiver circuit diagram

Internal structure of MC1411 series Darlington current driver b

Automatic help alarm medicine box control circuit

SG-30C type pulse power supply circuit

Using SSR to control the forward and reverse circuit of a single-phase induction motor

High power neon light electronic transformer circuit

Electromagnetic compatibility design and testing-printed board design: When designing a printed circuit board, the impact of interference on the system should be taken into consideration. The analog and digital parts of the circuit should be strictly separated. The core ...; xiaoxin1 Test/Measurement

Statistics on the number of IPTV users in China: [i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:58[/i]Statistics on the number of IPTV users in China 2006-7-13After the hustle and bustle of 2005, IPTV has smoothly transitioned to t...; hkn Mobile and portable

SARAM and FLASH size of 28335: [align=left][color=#000]The data sheet of TI's 28335 says 34K SARAM and 256K on-chip FLASH, but the official website says double that, 68K SARAM and 512K FLASH. What's wrong? Which one is correct? TI ...; YJZhang Microcontroller MCU

Raspberry Pi Learning - Accessories: [i=s]This post was last edited by mzb2012 on 2017-2-22 22:57[/i] [font=新宋体][size=5] I got my hands on a raspberry 3 a while ago, and I have been doing some small experiments here and there. I find it ...; mzb2012 Integrated technical exchanges

The first batch of LaunchPads received, thanks to TI and EEWORD: I went to attend TI's seminar yesterday, but I didn't win any prizes, which made me very upset (the first prize was ITouch), but today I received this. Hehe, I'm still very excited....; longdregon Microcontroller MCU

Introduction to semiconductor packaging: [b]Abstract[/b]: There are many types of semiconductor packaging, from DIP, SOP, QFP, PGA, BGA to CSP and then SIP, with technical indicators more advanced than the previous generation. These are all ...; songbo PCB Design

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components