TMPR4956F-200 datasheet, PDF - EEWORLD Datasheet

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TMPR4956F-200: DescriptionIC 64-BIT, 200 MHz, RISC PROCESSOR, PQFP208, 28 X 28 MM, 0.50 MM PITCH, PLASTIC, QFP-208, Microprocessor; CategoryThe embedded processor and controller Microcontrollers and processors; File Size237KB，60 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TMPR4956F-200 Overview

IC 64-BIT, 200 MHz, RISC PROCESSOR, PQFP208, 28 X 28 MM, 0.50 MM PITCH, PLASTIC, QFP-208, Microprocessor

TMPR4956F-200 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	QFP
package instruction	FQFP,
Contacts	208
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Other features	ALSO REQUIRES 3.3V I/O SUPPLY
Address bus width	64
bit size	64
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PQFP-G208
JESD-609 code	e0
length	28 mm
low power mode	YES
Number of terminals	208
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	FQFP
Package shape	SQUARE
Package form	FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.45 mm
speed	200 MHz
Maximum supply voltage	2.625 V
Minimum supply voltage	2.375 V
Nominal supply voltage	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	28 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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TOSHIBA

TENTATIVE

TMPR4955/56

TOSHIBA RISC PROCESSOR

TMPR4955/TMPR4956F

(64-bit RISC MICROPROCESSOR)

•

The information contained herein is subject to change without notice.

•

TOSHIBA is continually working to improve the quality and the reliability of its products.

Nevertheless, semiconductor devices in

general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of

the buyer, when utilizing TOSHIBA products, to observe standards of safety, and to avoid situations in which a malfunction or failure

of a TOSHIBA product could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the

most recent products specifications. Also, please keep in mind the precautions and conditions set forth in the TOSHIBA

Semiconductor Reliability Handbook

The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by

TOSHIBA for any infringements of patents or other rights of the third parties, which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of TOSHIBA or others.

•

20-Oct.-1999

TMPR4956F-200 Related Products

	TMPR4956F-200	TMPR4955F-200
Description	IC 64-BIT, 200 MHz, RISC PROCESSOR, PQFP208, 28 X 28 MM, 0.50 MM PITCH, PLASTIC, QFP-208, Microprocessor	IC 64-BIT, 200 MHz, RISC PROCESSOR, PQFP160, QFP-160, Microprocessor
Is it Rohs certified?	incompatible	incompatible
Parts packaging code	QFP	QFP
package instruction	FQFP,	QFP,
Contacts	208	160
Reach Compliance Code	unknown	unknown
ECCN code	3A001.A.3	3A001.A.3
Other features	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY
Address bus width	64	32
bit size	64	64
boundary scan	YES	YES
maximum clock frequency	100 MHz	100 MHz
External data bus width	64	32
Format	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES
JESD-30 code	S-PQFP-G208	S-PQFP-G160
JESD-609 code	e0	e0
length	28 mm	28 mm
low power mode	YES	YES
Number of terminals	208	160
Maximum operating temperature	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FQFP	QFP
Package shape	SQUARE	SQUARE
Package form	FLATPACK, FINE PITCH	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified
Maximum seat height	4.45 mm	4.45 mm
speed	200 MHz	200 MHz
Maximum supply voltage	2.625 V	2.625 V
Minimum supply voltage	2.375 V	2.375 V
Nominal supply voltage	2.5 V	2.5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.65 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	28 mm	28 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1

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