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DG611DJ-E3

Description
Analog Switch ICs High-Speed Switch
CategoryAnalog mixed-signal IC    The signal circuit   
File Size185KB,15 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
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DG611DJ-E3 Overview

Analog Switch ICs High-Speed Switch

DG611DJ-E3 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
MakerVishay
Parts packaging codeDIP
package instructionDIP, DIP16,.3
Contacts16
Reach Compliance Codeunknown
Other featuresVIDEO APPLICATION
Analog Integrated Circuits - Other TypesSPST
JESD-30 codeR-PDIP-T16
JESD-609 codee3
length19.305 mm
Humidity sensitivity level1
Maximum negative supply voltage (Vsup)-10 V
Negative supply voltage minimum (Vsup)
Nominal Negative Supply Voltage (Vsup)-3 V
normal positionNC
Number of channels1
Number of functions4
Number of terminals16
Nominal off-state isolation74 dB
On-state resistance matching specifications2 Ω
Maximum on-state resistance (Ron)45 Ω
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
outputSEPARATE OUTPUT
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5,15,-3 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)21 V
Minimum supply voltage (Vsup)5 V
Nominal supply voltage (Vsup)15 V
surface mountNO
Maximum disconnect time35 ns
Maximum connection time50 ns
switchBREAK-BEFORE-MAKE
technologyNMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1
DG611, DG612, DG613
Vishay Siliconix
High-Speed, Low-Glitch D/CMOS Analog Switches
DESCRIPTION
The DG611, DG612, DG613 feature high-speed low-
capacitance lateral DMOS switches. Charge injection has
been minimized to optimize performance in fast sample-and-
hold applications.
Each switch conducts equally well in both directions when on
and blocks up to 16 V
p-p
when off. Capacitances have been
minimized to ensure fast switching and low-glitch energy. To
achieve such fast and clean switching performance, the
DG611, DG612, DG613 are built on the Vishay Siliconix
proprietary D/CMOS process. This process combines
n-channel DMOS switching FETs with low-power CMOS
control logic and drivers. An epitaxial layer prevents latchup.
The DG611 and DG612 differ only in that they respond to
opposite logic levels. The versatile DG613 has two normally
open and two normally closed switches. It can be given
various configurations, including four SPST, two SPDT, one
DPDT.
For additional information see Applications Note AN207.
FEATURES
Fast switching - t
ON
: 12 ns
Low charge injection: ± 2 pC
Wide bandwidth: 500 MHz
5 V CMOS logic compatible
Low R
DS(on)
: 18
Low quiescent power : 1.2 nW
Single supply operation
BENEFITS
Improved data throughput
Minimal switching transients
Improved system performance
Easily interfaced
Low insertion loss
Minimal power consumption
APPLICATIONS
Fast sample-and-holds
Synchronous demodulators
Pixel-rate video switching
Disk/tape drives
DAC deglitching
Switched capacitor filters
GaAs FET drivers
Satellite receivers
FUNCTIONAL BLOCK DIAGRAM AND PIN CONFIGURATION
DG611
IN
1
D
1
S
1
V-
GND
S
4
D
4
IN
4
1
2
3
4
5
6
7
8
16
15
14
IN
2
D
2
S
2
V+
V
L
S
3
D
3
IN
3
9
10
11
12 13
D
4
IN
4
NC IN
3
D
3
Key
S
1
V-
NC
GND
S
4
4
5
6
7
8
3
2
DG611
D
1
IN
1
NC IN
2
D
2
1
20
19
18
17
S
2
V+
NC
V
L
S
3
Four SPST Switches per Package
TRUTH TABLE
Logic
0
1
Logic “0”
1 V
Logic “1”
4
V
DG611
ON
OFF
DG612
OFF
ON
Dual-In-Line
13
and SOIC
Top View
12
11
10
9
LCC
Top View
16
15
14
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 70057
S11-0154-Rev. I, 31-Jan-11
www.vishay.com
1

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Description Analog Switch ICs High-Speed Switch Analog Switch ICs High-Speed Switch MEMS Microphones MIC MEMS ANALOG OMNI -22DB
Is it lead-free? Lead free Contains lead Contains lead Lead free
Maker Vishay Vishay Vishay Vishay
Parts packaging code DIP SOIC SOIC SOIC
package instruction DIP, DIP16,.3 SOP, SOP16,.25 SOP, SOP16,.25 SOP, SOP16,.25
Contacts 16 16 16 16
Reach Compliance Code unknown unknown unknown unknown
Analog Integrated Circuits - Other Types SPST - SPST SPST
JESD-30 code R-PDIP-T16 - R-PDSO-G16 R-PDSO-G16
JESD-609 code e3 - e0 e3
normal position NC - NC NO
Number of functions 4 - 4 4
Number of terminals 16 - 16 16
Maximum on-state resistance (Ron) 45 Ω - 60 Ω 45 Ω
Maximum operating temperature 85 °C - 85 °C 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C
output SEPARATE OUTPUT - SEPARATE OUTPUT SEPARATE OUTPUT
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP - SOP SOP
Encapsulate equivalent code DIP16,.3 - SOP16,.25 SOP16,.25
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form IN-LINE - SMALL OUTLINE SMALL OUTLINE
power supply 5,15,-3 V - 5,15,-3 V 5,15,-3 V
Certification status Not Qualified - Not Qualified Not Qualified
surface mount NO - YES YES
Maximum connection time 50 ns - 35 ns 50 ns
switch BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Temperature level INDUSTRIAL - INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) - Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal form THROUGH-HOLE - GULL WING GULL WING
Terminal pitch 2.54 mm - 1.27 mm 1.27 mm
Terminal location DUAL - DUAL DUAL

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