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IR3101

Description
Motor / Motion / Ignition Controllers u0026 Drivers Half-Bridge FredFET iMotion 1.6A 500V
CategoryOther integrated circuit (IC)    The signal circuit   
File Size263KB,10 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Related ProductsFound1parts with similar functions to IR3101
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Motor / Motion / Ignition Controllers u0026 Drivers Half-Bridge FredFET iMotion 1.6A 500V

IR3101 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerInfineon
Reach Compliance Codeunknown
Analog Integrated Circuits - Other TypesBRUSH DC MOTOR CONTROLLER
JESD-30 codeR-PSIP-T9
JESD-609 codee3
length27.94 mm
Number of functions1
Number of terminals9
Maximum output current1.6 A
Package body materialPLASTIC/EPOXY
encapsulated codeSIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height12.19 mm
Maximum supply voltage (Vsup)20 V
Minimum supply voltage (Vsup)10 V
Nominal supply voltage (Vsup)15 V
surface mountNO
Terminal surfaceTin (Sn)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.43 mm
PD-95807 RevB
Half-Bridge FredFet
and Integrated Driver
Description
IR3101
Series
1.6A, 500V
IR3101 is a gate driver IC integrated half bridge FredFET designed for sub 250W (heat-sink-less) motor drive
applications. The sleek and compact single-in-line package is optimized for electronic motor control in
appliance applications such as fans and compressors for refrigerators. The IR3101 offers an extremely
compact, high performance half-bridge inverter, in a single isolated package for a very simple design for two-
phase and three-phase motor drivers.
Proprietary HVIC and latch immune CMOS technologies, along with the HEXFET
®
power FredFET
®
technology (HEXFET
®
with ultra-fast recovery body diode characteristics), enable efficient and rugged
single package construction. Propagation delays for the high and low side power FredFETs are matched
thanks to the advance IC technology.
Features
• Output power FredFets in half-bridge configuration
• High side gate drive designed for bootstrap operation
• Bootstrap diode integrated into package.
• Lower power level-shifting circuit
• Lower di/dt gate drive for better noise immunity
• Excellent latch immunity on all inputs and outputs
• ESD protection on all leads
• Isolation 1500 V
RMS
min
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation are measured under
board mounted and still air conditions.
Parameters Description
V
DD
V
B
P
D
Rth
JC
Rth
JA
V
ISO
T
J
T
S
T
L
I
O
I
O
High voltage supply
High side floating supply
Package power dissipation @ T
C
80 C (per die)
Thermal resistance, junction to case
Thermal resistance, junction to ambient (note 1)
Isolation Voltage (1 min)
Junction temperature (Power Mosfet)
Storage temperature
Lead temperature (soldering, 10 seconds)
Maximum current rating (note 2)
Continuous output current (V
IN
=5V, V
CC
=15V)
(T
C
= 100°C)
(T
C
= 25°C)
o
Max. Values
500
V
o
+ 25
5.8
12
85
1500
-40 to +150
-40 to +150
300
1.6
1.3
2
Units
V
V
W
°C/W
°C/W
V
RMS
°C
°C
°C
A
A
A
Note 1: under normal operational conditions: both power devices working, no heatsink
Note 2: see figure 4, f
PWM
=20kHz
www.irf.com
1

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