(1) Repetitive rating; pulse width limited by maximum junction temperature.
2
Motorola TMOS Power MOSFET Transistor Device Data
MMDF3207
ELECTRICAL CHARACTERISTICS
(TC = 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage(1)
(VGS = 0 Vdc, ID = 0.25 mAdc)
Temperature Coefficient (Positive)
Zero Gate Voltage Drain Current
(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 55°C)
Gate–Body Leakage Current (VGS =
±
12 Vdc, VDS = 0 Vdc)
ON CHARACTERISTICS(1)
Gate Threshold Voltage(1)
(VDS = VGS, ID = 0.25 mAdc)
Threshold Temperature Coefficient (Negative)
Static Drain–to–Source On–Resistance(1)
(VGS = 4.5 Vdc, ID = 7.8 Adc)
(VGS = 2.5 Vdc, ID = 6.2 Adc)
Forward Transconductance (VDS = 10 Vdc, ID = 7.8 Adc)(1)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Transfer Capacitance
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
Gate Charge
(
(VDS = 10 Vd , ID = 7 8 Ad ,
Vdc,
7.8 Adc,
VGS = 4.5 Vdc)(1)
Vdc,
1.0 Adc,
(VDD = 10 Vd ID = 1 0 Ad
VGS = 4.5 Vdc,
4 5 Vdc
RG = 6.0
Ω)
(1)
)
Vdc,
1.0 Adc,
(VDS = 10 Vd ID = 1 0 Ad
VGS = 10 Vdc
Vdc,
RG = 6.0
Ω)
(1)
)
td(on)
tr
td(off)
tf
td(on)
tr
td(off)
tf
QT
Q1
Q2
Q3
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
Reverse Recovery Time
(IS = 1 7 Ad , VGS = 0 Vdc,
1.7 Adc,
Vd ,
(
(1)
dIS/dt = 100 A/µs)
Reverse Recovery Stored Charge
(1) Pulse Test: Pulse Width
≤
300
µs,
Duty Cycle
≤
2%.
(2) Switching characteristics are independent of operating junction temperatures.
(3) Repetitive rating; pulse width limited by max. junction temperature.
(IS = 1.7 Adc, VGS = 0 Vdc)(1)
(IS = 1.7 Adc, VGS = 0 Vdc, TJ = 125°C)
VSD
trr
ta
tb
QRR
—
—
—
—
—
—
TBD
TBD
TBD
TBD
TBD
TBD
1.2
—
—
—
—
—
µC
Vdc
ns
—
—
—
—
—
—
—
—
—
—
—
—
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
—
—
—
nC
ns
(VDS = 15 Vdc, VGS = 0 V,
Vdc
V
f = 1.0 MHz)
Ciss
Coss
Crss
—
—
—
TBD
TBD
TBD
TBD
TBD
TBD
pF
V(BR)DSS
20
—
IDSS
—
—
IGSS
—
—
—
—
1.0
5.0
100
nAdc
—
TBD
—
—
Vdc
mV/°C
µAdc
Symbol
Min
Typ
Max
Unit
VGS(th)
0.6
—
RDS(on)
—
—
gFS
—
TBD
TBD
TBD
33
50
—
—
TBD
—
—
Vdc
mV/°C
mΩ
Mhos
Motorola TMOS Power MOSFET Transistor Device Data
3
MMDF3207
PACKAGE DIMENSIONS
A
8
D
5
C
E
1
4
H
0.25
M
B
M
h
B
C
e
A
SEATING
PLANE
X 45
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0
_
7
_
q
L
0.10
A1
B
0.25
M
C B
S
A
S
q
CASE 751–06
ISSUE T
STYLE 13:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
N.C.
SOURCE
SOURCE
GATE
DRAIN
DRAIN
DRAIN
DRAIN
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