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5962-9559503HNX

Description
SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP-68
Categorystorage    storage   
File Size632KB,9 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9559503HNX Overview

SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP-68

5962-9559503HNX Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionQFP,
Contacts68
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time100 ns
Other featuresALSO CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length22.36 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height3.51 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width22.36 mm
Base Number Matches1
White Electronic Designs
128Kx32 SRAM MODULE, SMD 5962-93187
FEATURES
Access Times of 70, 85, 100, 120ns
MIL-STD-883 Compliant Devices Available
Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400).
• 68 lead, 40mm Low Profile CQFP, 3.56mm
(0.140")(Package 502).
• 68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 4.57mm (0.140 inch) high,
(Package 510)
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
Commercial, Industrial and Military Temperature
Ranges
5V Power Supply
Low Power CMOS
WS128K32-XXX
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS128K32-XG2UX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
Upgradeable to 512Kx32
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
4
A
5
A
6
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
66
8
OE#
A
0-16
128K x 8
WE
1
# CS
1
#
Pin Description
56
I/O
0-31
A
0-16
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
128K x 8
128K x 8
128K x 8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
June 2004
Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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