EEWORLDEEWORLDEEWORLD

Part Number

Search

89882-424LF

Description
Board to Board u0026 Mezzanine Connectors 24P HRIZ TMT SR RCPT TIN W/O LOCATING PEG
CategoryThe connector   
File Size199KB,17 Pages
ManufacturerFCI [First Components International]
Download Datasheet Parametric View All

89882-424LF Online Shopping

Suppliers Part Number Price MOQ In stock  
89882-424LF - - View Buy Now

89882-424LF Overview

Board to Board u0026 Mezzanine Connectors 24P HRIZ TMT SR RCPT TIN W/O LOCATING PEG

89882-424LF Parametric

Parameter NameAttribute value
Product CategoryBoard to Board & Mezzanine Connectors
ManufacturerFCI [First Components International]
RoHSDetails
Number of Positions24 Position
Pitch2.54 mm
Number of Rows1 Row
Mounting AngleHorizontal
Current Rating3 A
Voltage Rating1 kV
PackagingTube
Contact MaterialPhosphor Bronze
Contact PlatingTin
Housing MaterialThermoplastic
Factory Pack Quantity9
NUMBER
TYPE
BUS-12-055
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
DU BOX™ Printed Wired Board Connector Gold Plated
1 of 17
AUTHORIZED BY
DATE
H
18 May 07
S.Fierro
CLASSIFICATION
UNRESTRICTED
1.0
GENERAL
This specification covers the gold plated contact DU BOXTM Printed Wiring Board Connectors designed for parallel
(vertical) interconnection of printed wiring boards in low power applications. The connectors provide only the
female half of the interconnection and are designed for mating with single or double rows of 0.025 inch square pins,
free-standing on 0.100 inch centers. This product is Lead Free and meets the requirements of the European Union
Directive of Restrictions for Hazardous Substances (Directive 2002/95/EC).The specification is composed of the
following sections:
Paragraph
1.0
2.0
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
4.0
4.1
4.2
4.3
4.4
5.0
5.1
5.2
5.3
5.4
2.0
APPLICABLE DOCUMENTS
The following documents, of the issue in effect on the date of the latest revision of this specification, shall
form a part of this specification to the extent specified herein.
SPECIFICATIONS
FEDERAL
QQ-N-290
QQ-S-571
QQ-B-750
Nickel Plating (Electrodeposited)
Solder: Lead Alloy, Tin-Lead Alloy, and Tin Alloy; Flux Cored Ribbon and Wire, and Solid
Form
Phosphor Bronze
Title
GENERAL
APPLICABLE DOCUMENTS
REQUIREMENTS
Qualification
Material
Finish
Design and Construction
Electrical Characteristics
Mechanical Characteristics
Environmental Conditions
QUALITY ASSURANCE PROVISIONS
Equipment Calibration
Inspection Conditions
Qualification Inspection
Requalification Testing
NOTES AND DEFINITIONS
Total Mating Force
Contact Resistance
Termination
Lubrication of Card Connectors
Page
1
1
2
2
2
3
3
3
7
8
13
13
13
13
14
15
15
15
15
16
Copyright
Form E-3334
Rev F
FCI
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 28, 2010
.
Single chip microcomputer and TCP/IP network (ISA bus interface definition)
[color=#ff3333]ISA[/color] ISA=Industry Standard Architecture (isa总线) [img=600,400]http://www.laogu.com/MY/isa.jpg[/img] Pin Name Description[color=#ff3333]引脚[/color] [color=#ff9900]名称[/color] [color=...
eeleader Industrial Control Electronics
430 Learning Experience
:)1. First you need to know the memory structure of msp430. There are two types of typical microprocessor structures: von Neumann structure - program memory and data memory are uniformly encoded; Harv...
zhyue Microcontroller MCU
How much power does a telecom fiber optic modem consume?
How much power does the fiber optic modem of China Telecom consume? The fiber optic modem of China Telecom has a VoIP phone, which is equivalent to the original landline phone. However, once the fiber...
wangfuchong Talking
Can I develop Linux drivers under Windows?
I am a beginner and don't want to install Linux. I don't know if there is any way to develop Linux drivers under Windows. Anyone who knows please give me some advice. Thank you....
liwenjie518 Linux and Android
DSP contains BIOS system engineering compilation error!
When compiling a project containing the BIOS system using CCSv4.0, the following error occurs: fatal error: file "D:/Program Files/TexasInstruments/bios_5_41_02_14/packages/ti/bios/lib/bios.a28FPclk.o...
lichengyuan11 DSP and ARM Processors
If I need to control about 3,000 lights in a room, is BLE MESH or zigbee more suitable?
In a room, will the BLE MESH Bluetooth network be paralyzed if there are 3,000 lights? Is Zigbee better? How do the costs of the two compare? Can anyone help me out? . ....
小飞虾3 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 246  961  1223  2837  1210  5  20  25  58  9 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号