Digital Signal Processor, 32-Bit Size, CMOS, CPGA132
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | LSC/CSI |
| package instruction | PGA, PGA132,13X13 |
| Reach Compliance Code | unknown |
| bit size | 32 |
| Format | FLOATING POINT |
| JESD-30 code | S-XPGA-P132 |
| JESD-609 code | e0 |
| Number of terminals | 132 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA132,13X13 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 1536 |
| Maximum slew rate | 255 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Base Number Matches | 1 |
| DSP32C-R35-060-I | DSP32C-R35-050-I | DSP32C-F35-050 | DSP32C-R35-080-I | DSP32C-F35-060 | DSP32C-R35-050 | DSP32C-R35-060 | DSP32C-F35-080 | DSP32C-F35-080-I | DSP32C-R35-080 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Digital Signal Processor, 32-Bit Size, CMOS, CPGA132 | Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 80MHz, CMOS, CPGA133 | Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 80MHz, CMOS, PQFP164 | Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 50MHz, CMOS, CPGA133 | Digital Signal Processor, 32-Bit Size, CMOS, PQFP164 | Digital Signal Processor, 32-Bit Size, CMOS, CPGA132 | Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 66.666MHz, CMOS, CPGA133 | Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 50MHz, CMOS, PQFP164 | Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 50MHz, CMOS, PQFP164 | Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 50MHz, CMOS, CPGA133 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Format | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| JESD-30 code | S-XPGA-P132 | S-XPGA-P132 | S-PQFP-G164 | S-CPGA-P133 | S-PQFP-G164 | S-CPGA-P133 | S-CPGA-P133 | S-PQFP-G164 | S-PQFP-G164 | S-XPGA-P132 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 132 | 132 | 164 | 133 | 164 | 133 | 133 | 164 | 164 | 132 |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | PGA | PGA | BQFP | PGA | BQFP | PGA | PGA | BQFP | BQFP | PGA |
| Encapsulate equivalent code | PGA132,13X13 | PGA132,13X13 | SPQFP164,1.3SQ | PGA132,13X13 | SPQFP164,1.3SQ | PGA132,13X13 | PGA132,13X13 | SPQFP164,1.3SQ | SPQFP164,1.3SQ | PGA132,13X13 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY | GRID ARRAY | FLATPACK | GRID ARRAY | FLATPACK | GRID ARRAY | GRID ARRAY | FLATPACK | FLATPACK | GRID ARRAY |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (number of words) | 1536 | 1536 | 1536 | 1536 | 1536 | 1536 | 1536 | 1536 | 1536 | 1536 |
| Maximum slew rate | 255 mA | 306 mA | 306 mA | 225 mA | 255 mA | 306 mA | 255 mA | 225 mA | 225 mA | 225 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | YES | NO | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG | PIN/PEG | GULL WING | PIN/PEG | GULL WING | PIN/PEG | PIN/PEG | GULL WING | GULL WING | PIN/PEG |
| Terminal pitch | 2.54 mm | 2.54 mm | 0.635 mm | 2.54 mm | 0.635 mm | 2.54 mm | 2.54 mm | 0.635 mm | 0.635 mm | 2.54 mm |
| Terminal location | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | PERPENDICULAR |
| Maker | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | - | - | - | LSC/CSI | LSC/CSI | LSC/CSI |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
| ECCN code | - | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | - | - | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |