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73783-6201

Description
Board Stacking Connector, 72 Contact(s), 6 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Guide Pin, Black Insulator, Receptacle
CategoryThe connector    The connector   
File Size188KB,3 Pages
ManufacturerMolex
Websitehttps://www.molex.com/molex/home
Download Datasheet Parametric View All

73783-6201 Overview

Board Stacking Connector, 72 Contact(s), 6 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Guide Pin, Black Insulator, Receptacle

73783-6201 Parametric

Parameter NameAttribute value
MakerMolex
Reach Compliance Codeunknown
Other featuresHDM
body width0.614 inch
subject depth0.238 inch
body length1.244 inch
Body/casing typeRECEPTACLE
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationAU ON NI
Contact completed and terminatedTIN/LEAD OVER NICKEL
Contact point genderMALE
Contact materialPHOSPHOR BRONZE
contact modeRECTANGULAR
Contact resistance32 mΩ
Contact styleSQ PIN-SKT
DIN complianceNO
Dielectric withstand voltage1000VAC V
Durability250 Cycles
Filter functionNO
IEC complianceNO
maximum insertion force.3058 N
Insulation resistance1000000000 Ω
Insulator colorBLACK
insulator materialGLASS FILLED LIQUID CRYSTAL POLYMER
MIL complianceNO
Manufacturer's serial number73783
Plug contact pitch0.079 inch
Match contact row spacing0.079 inch
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation option 1GUIDE PIN
Installation option 2LOCKING
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number6
Number of rows loaded6
Maximum operating temperature105 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
PCB contact row spacing2.0066 mm
Plating thickness30u inch
polarization keyPOLARIZED HOUSING
Rated current (signal)1 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal length0.138 inch
Terminal pitch2 mm
Termination typeSOLDER
Total number of contacts72
UL Flammability Code94V-0
Evacuation force-minimum value.139 N
Base Number Matches1
FEATURES AND SPECIFICATIONS
s
s
s
s
s
Features and Benefits
For parallel board packaging
Available in press-fit or solder tail
Up to 32mm board-to-board stack heights
Mezzanine card to facilitate blind mate
Surface Mount Compatible
Electrical
Current: 1.0A
Contact Resistance:
Row
m
max.
A
13
B
18
C
20
D
25
E
30
F
32
2.00mm (.079") Pitch
HDM*
Board-to-Board
Stacking Header
73783
High Rise Vertical
Solder Tail Guide Pin Option
Reference Information
Product Specification: PS-73670-9999
Packaging: Tube
UL File No.: E29179
Mates With:
73632/73780
Designed In: Millimeters
Dielectric Withstanding Voltage: 1000V
Insulation Resistance: 1000 M
min.
Mechanical
Mating Force: 0.35N typical per contact
Unmating Force: 0.15N min.
Signal Normal Force: 0.75N nom./0.60N min.
Durability: 250 cycles
Physical
Housing: Liquid crystal polymer
Contact: Phosphor Bronze
Plating: 30
µ
" Gold
Operating Temperature: -55 to +105˚C
Backplane Connector Systems
CATALOG DRAWING (FOR REFERENCE ONLY)
J
ORDERING INFORMATION AND DIMENSIONS
Circuits
Order No.
P = 2.00 (.079)
73783-0100
73783-0101
73783-0102
73783-0200
73783-0201
73783-0202
73783-0300
73783-0301
73783-0302
73783-1100
73783-1101
73783-1102
73783-1200
73783-1201
73783-1202
73783-1300
73783-1301
73783-1302
P = 2.50 (.098)
73783-2100
73783-2101
73783-2102
73783-2200
73783-2201
73783-2202
73783-2300
73783-2301
73783-2302
73783-3100
73783-3101
73783-3102
73783-3200
73783-3201
73783-3202
73783-3300
73783-3301
73783-3302
P = 3.00 (.118)
73783-4100
73783-4101
73783-4102
73783-4200
73783-4201
73783-4202
73783-4300
73783-4301
73783-4302
73783-5100
73783-5101
73783-5102
73783-5200
73783-5201
73783-5202
73783-5300
73783-5301
73783-5302
P = 3.50 (.138)
73783-6100
73783-6101
73783-6102
73783-6200
73783-6201
73783-6202
73783-6300
73783-6301
73783-6302
73783-7100
73783-7101
73783-7102
73783-7200
73783-7201
73783-7202
73783-7300
73783-7301
73783-7302
Guide Post
Location
A
B
N/A
A
B
N/A
A
B
N/A
A
B
N/A
A
B
N/A
A
B
N/A
A
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
Dimension
B
C
22.00 (.866)
15.05 (.593)
22.00 (.866)
15.05 (.593)
22.00 (.866)
15.05 (.593)
22.00 (.866)
6.05 (.238)
22.00 (.866)
6.05 (.238)
22.00 (.866)
6.05 (.238)
22.00 (.866)
10.05 (.396)
22.00 (.866)
10.05 (.396)
22.00 (.866)
10.05 (.396)
46.00 (1.811)
15.05 (.593)
46.00 (1.811)
15.05 (.593)
46.00 (1.811)
15.05 (.593)
46.00 (1.811)
6.05 (.238)
46.00 (1.811)
6.05 (.238)
46.00 (1.811)
6.05 (.238)
46.00 (1.811)
10.05 (.396)
46.00 (1.811)
10.05 (.396)
46.00 (1.811)
10.05 (.396)
M
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
72
144
* High Density Metric and HDM
PLUS
are trademarks of Teradyne, Inc.
Note: Additional key combinations and locations are available, please contact Molex
Note: The guide pin must mate with the top position on the mating receptacle to clear the board edge.
Therefore, if guidepin headers are used on each end of a header array, you should select one with the
pin in location B and the second with the guidepin in location A.
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