EEWORLDEEWORLDEEWORLD

Part Number

Search

MLL14KESD6.0

Description
SURFACE MOUNT TVS
CategoryDiscrete semiconductor    diode   
File Size185KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MLL14KESD6.0 Overview

SURFACE MOUNT TVS

MLL14KESD6.0 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDO-213AB
package instructionO-LELF-R2
Contacts2
Reach Compliance Codeunknow
ECCN codeEAR99
Minimum breakdown voltage6.67 V
Shell connectionISOLATED
Maximum clamping voltage18.5 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-213AB
JESD-30 codeO-LELF-R2
JESD-609 codee0
Maximum non-repetitive peak reverse power dissipation4000 W
Number of components1
Number of terminals2
Maximum operating temperature200 °C
Minimum operating temperature-65 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation1.25 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage6 V
Maximum reverse current600 µA
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperatureNOT SPECIFIED
MLL14KESD5.0 thru MLL14KESD170A
SURFACE MOUNT TVS
SCOTTSDALE DIVISION
DESCRIPTION
These surface mount Transient Voltage Suppressor (TVS) devices feature
the ability to clamp dangerous high voltage short-term transients such as
produced by direct or radiated electro-static discharge phenomena before
entering sensitive component regions of a circuit design. They are small
economical TVSs targeted primarily for short term transients below a few
microseconds while still achieving significant peak-pulse-power capability
as seen in Figure 1.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
Excellent protection in clamping direct ESD level
transients in excess of 40,000 V per MIL-STD-750,
Method 1020 (approx. 150 ns exponential wave)
Absorbs ESD level transients of 14,000 Watts per
MIL-STD-750, Method 1020 (approximately 150 ns
exponential wave, or one microsecond transients
up to 4000 watts. See Figure #1 and #2 for overall
transient Peak Pulse Power.
Clamps Transients in less than 100 picoseconds
Working Stand-off Voltage range of 5V to 170V
Hermetic DO-213AB package. Also available in
axial-leaded DO-41package (see separate data
sheet for 14KESD5.0 series)
APPLICATIONS / BENEFITS
Protects Sensitive circuits from short duration fast
rise time transients such as Electrostatic Discharge
(ESD) or Electrical Fast Transients (EFT)
Minimal capacitance (See Figure #3)
Small surface-mount footprint for high density
mounting
Bidirectional features available by adding a “C” or
“CA” suffix to part number
MAXIMUM RATINGS
4000 Watts for One Microsecond Square Wave or
14,000 watts per ESD Wave form of MIL-STD-750,
method 1020.
See Surge Rating curve in Figures #1 and 2.
Operating and storage temperature –65
o
C to 175
o
C
Thermal Resistance: 40
º
C/W junction to end cap, or
120
º
C/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint (see
last page)
Steady-State Power: 1.50 watts at T
EC
< 115
o
C, or
1.25 watts at T
A
= 25
º
C when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
Derate at 22.8 W/
o
C above 25
o
C for P
PP
(1µs) and at
15 mW/
o
C above 75
o
C for dc power.
Forward Surge Current 500 amps for 1µs at T
L
=
o
25 C (rise time > 100 ns).
MECHANICAL AND PACKAGING
CASE: Hermetically sealed DO-213AB glass MELF
package
TERMINALS: End caps, tin-lead plated solderable
per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band.
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
MLL14KESD5.0 thru
MLL14KESD170A
Copyright
2002
10-03-2003 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
The matching problem between WINCE version and development tools
To develop software under wince, I found the following information that the version number of the development tool corresponds to the version number of Windows CE. The tools Microsoft provides to appl...
sauteed Embedded System
High performance, low cost, TI's TPS54318 solution for Altera Cyclone IV: 3.3-V
The Altera Stratix IV FPGA reference design showcases the TI TPS54318...
莫妮卡 Analogue and Mixed Signal
Electronics Contest Questions PDF
Specific topic requirements...
进击的生菜 Electronics Design Contest
Why are there different packages for resistors or capacitors in the circuit? Some are 0805, some are 0603.
In many circuits, there are many chips with different packages. Why don’t resistors use the same package? What’s the difference?...
dxn0622 Embedded System
Why does my CubeSuite+ not have a Code generator!!!!
The computer is 64-bit. Does anyone know how to solve this problem? ? ? ?...
xiao2030 Renesas Electronics MCUs
1
[i=s]This post was last edited by anrui-2021 on 2021-12-22 11:36[/i]1...
anrui-2021 FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1971  610  207  950  404  40  13  5  20  9 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号