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FX429AL2

Description
1200/2400 Baud FFSK Modem for Trunked Radio Systems
CategoryWireless rf/communication    Telecom circuit   
File Size390KB,16 Pages
ManufacturerCML Microcircuits
Websitehttp://www.cmlmicro.com/
Download Datasheet Parametric Compare View All

FX429AL2 Overview

1200/2400 Baud FFSK Modem for Trunked Radio Systems

FX429AL2 Parametric

Parameter NameAttribute value
MakerCML Microcircuits
Parts packaging codeLCC
package instructionQCCJ, LDCC24,.44SQ
Contacts24
Reach Compliance Codecompliant
Other featuresFULL DUPLEX
data rate2.4 Mbps
JESD-30 codeS-PQCC-J24
length10.16 mm
Number of functions1
Number of terminals24
Maximum operating temperature70 °C
Minimum operating temperature-30 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC24,.44SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply5 V
Certification statusNot Qualified
Maximum seat height3.7 mm
Maximum slew rate7 mA
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesMODEM
Temperature levelOTHER
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width10.16 mm
Base Number Matches1

FX429AL2 Related Products

FX429AL2 FX429AJ4 FX429A FX429AL1
Description 1200/2400 Baud FFSK Modem for Trunked Radio Systems 1200/2400 Baud FFSK Modem for Trunked Radio Systems 1200/2400 Baud FFSK Modem for Trunked Radio Systems 1200/2400 Baud FFSK Modem for Trunked Radio Systems
Maker CML Microcircuits CML Microcircuits - CML Microcircuits
Parts packaging code LCC DIP - QFP
package instruction QCCJ, LDCC24,.44SQ DIP, DIP24,.6 - QFP, QFP24,.6SQ,50
Contacts 24 24 - 24
Reach Compliance Code compliant unknown - unknown
Other features FULL DUPLEX FULL DUPLEX - FULL DUPLEX
data rate 2.4 Mbps 2.4 Mbps - 2.4 Mbps
JESD-30 code S-PQCC-J24 R-GDIP-T24 - S-PQFP-G24
length 10.16 mm 31.75 mm - 10.125 mm
Number of functions 1 1 - 1
Number of terminals 24 24 - 24
Maximum operating temperature 70 °C 85 °C - 70 °C
Minimum operating temperature -30 °C -30 °C - -30 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED - PLASTIC/EPOXY
encapsulated code QCCJ DIP - QFP
Encapsulate equivalent code LDCC24,.44SQ DIP24,.6 - QFP24,.6SQ,50
Package shape SQUARE RECTANGULAR - SQUARE
Package form CHIP CARRIER IN-LINE - FLATPACK
power supply 5 V 5 V - 5 V
Certification status Not Qualified Not Qualified - Not Qualified
Maximum seat height 3.7 mm 5.49 mm - 2.5 mm
Maximum slew rate 7 mA 7 mA - 7 mA
Nominal supply voltage 5 V 5 V - 5 V
surface mount YES NO - YES
technology CMOS CMOS - CMOS
Telecom integrated circuit types MODEM MODEM - MODEM
Temperature level OTHER OTHER - OTHER
Terminal form J BEND THROUGH-HOLE - GULL WING
Terminal pitch 1.27 mm 2.54 mm - 1.27 mm
Terminal location QUAD DUAL - QUAD
width 10.16 mm 15.24 mm - 10.125 mm
Base Number Matches 1 1 - 1
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