DIGI WIRELESS
CONNECTIVITY KIT
®
Starting with very simple examples, we provide step-by-
step guidance in assembling the kit components to create
reliable wireless communications, working control systems,
and sensing networks with incredible battery life and robust
security. The kit is designed for anyone getting started in the
world of Digi XBee: hardware/software engineers, product
managers, educators, students and even young inventors.
All examples are explained in-depth and include videos
showcasing wireless communication in action. Some examples
also incorporate the Digi XBee Java Library, which can be
used to integrate Digi XBees modules into Java-based devices
and applications. Each example is designed to be easy for
anyone to use, and those with some programming background
should find it simple to extend the examples to additional
applications or use-cases.
Provides a hands-on way to learn how to use Digi XBee®
RF modules for device connectivity and sensor networking
The Kit Includes:
3
2 Digi XBee Grove Development Boards
3
2 Digi XBee 802.15.4 Modules
3
2 Micro-USB Cables
3
2 Digi XBee Stickers
PART NUMBER
XKB2-AT-WWC
XKB2-A2T-WWC
DESCRIPTION
Wireless Connectivity Kit w/ Digi XBee S1 802.15.4
Wireless Connectivity Kit w/ Digi XBee S2C 802.15.4
Digi XBee 802.15.4 Modules Included in the Kit
Digi XBee and XBee-PRO 802.15.4 modules are embedded
solutions providing wireless connectivity to devices. These
modules use the IEEE 802.15.4 networking protocol for fast
point-to-multipoint or peer-to-peer networking. They are
designed for high-throughput applications requiring low
latency and predictable communication timing.
Digi XBee 802.15.4 modules are ideal for low-power, low-
cost applications. These modules are easy-to-use, share a
common footprint, and are fully interoperable with other
XBee products utilizing the same technology. Module users
have the ability to substitute one Digi XBee module for
another with minimal development time and risk.
www.digi.com
SPECIFICATIONS
PERFORMANCE
Digi XBee® S2C 802.15.4
| Digi XBee-PRO® S2C 802.15.4
TRANSCEIVER CHIPSET
DATA RATE
INDOOR/URBAN RANGE
OUTDOOR/RF LINE-OF-SIGHT
RANGE
TRANSMIT POWER
RECEIVER SENSITIVITY
(1% PER)
FEATURES
Silicon Labs EM357 SoC
RF 250 Kbps, Serial up to 1 Mbps
200 ft (60 m)
4000 ft (1200 m)
3.1 mW (+5 dBm) / 6.3 mW (+8 dBm)
boost mode
-100 dBm / -102 dBm boost mode
300 ft (90 m)
2 miles (3200 m)
63 mW (+18 dBm)
-101 dBm
SERIAL DATA INTERFACE
CONFIGURATION METHOD
FREQUENCY BAND
FORM FACTOR
HARDWARE
INTERFERENCE IMMUNITY
ADC INPUTS
DIGITAL I/O
ANTENNA OPTIONS
OPERATING TEMPERATURE
DIMENSIONS (L X W X H) AND
WEIGHT
NETWORKING AND SECURITY
UART, SPI
API or AT commands, local or over-the-air (OTA)
ISM 2.4 GHz
Through-Hole, Surface Mount
S2C
DSSS (Direct Sequence Spread Spectrum)
(4) 10-bit ADC inputs
15
Through-Hole: PCB Antenna, U.FL Connector, RPSMA Connector, or Integrated Wire
SMT: RF Pad, PCB Antenna, or U.FL Connector
-40º C to +85º C
Through-Hole: 0.960 x 1.087 in (2.438 x 2.761 cm)
SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm)
Through-Hole: 0.960 x 1.297 in (2.438 x 3.294 cm)
SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm)
PROTOCOL
UPDATABLE TO DIGIMESH
PROTOCOL
UPDATABLE TO ZIGBEE
PROTOCOL
ENCRYPTION
RELIABLE PACKET DELIVERY
IDS
CHANNELS
POWER REQUIREMENTS
ZigBee PRO 2007, HA-Ready with support for binding/multicasting
Yes
Yes
128-bit AES
Retries/Acknowledgements
PAN ID and addresses, cluster IDs and endpoints (optional)
16 channels
15 channels
SUPPLY VOLTAGE
TRANSMIT CURRENT
RECEIVE CURRENT
POWER-DOWN CURRENT
REGULATORY APPROVALS
2.1 to 3.6V
33 mA @ 3.3 VDC / 45 mA boost mode
28 mA @ 3.3 VDC / 31 mA boost mode
<1 μA @ 25º C
2.7 to 3.6V
120 mA @ 3.3 VDC
31 mA @ 3.3 VDC
<1 μA @ 25º C
FCC, IC (NORTH AMERICA)
ETSI (EUROPE)
RCM (AUSTRALIA AND
NEW ZEALAND)
TELEC (JAPAN)
Yes
Yes
No (Coming soon)
No (Coming soon)
Yes
No
No (Coming soon)
No
www.digi.com
SPECIFICATIONS
PERFORMANCE
Legacy Digi XBee® S1 802.15.4
| Legacy Digi XBee-PRO® S1 802.15.4
RF DATA RATE
INDOR/URBAN RANGE
OUTDOOR/RF LINE-OF-SIGHT RANGE
TRANSMIT POWER
RECEIVER SENSITIVITY (1% PER)
DIGI HARDWARE
TRANSCEIVER CHIPSET
FEATURES
250 kbps
100 ft (30 m)
300 ft (100 m)
1 mW (+0 dBm)
-92 dBm
S1
Freescale MC13212
250 kbps
300 ft (100 m)
1 mi (1.6 km)
60 mW (+18 dBm)*
-100 dBm
SERIAL DATA INTERFACE
CONFIGURATION METHOD
FREQUENCY BAND
INTERFERENCE IMMUNITY
SERIAL DATA RATE
ADC INPUTS
DIGITAL I/O
ANTENNA OPTIONS
NETWORKING & SECURITY
3.3V CMOS UART
API or AT Commands, local or over-the-air
2.4 GHz
DSSS (Direct Sequence Spread Spectrum)
1200 bps - 250 kbps
(6) 10-bit ADC inputs
8
Chip, Wire Whip, U.FL, & RPSMA
ENCRYPTION
RELIABLE PACKET DELIVERY
IDS AND CHANNELS
POWER REQUIREMENTS
128-bit AES
Retries/Acknowledgments
PAN ID, 64-bit IEEE MAC, 16 Channels
SUPPLY VOLTAGE
TRANSMIT CURRENT
RECEIVE CURRENT
POWER-DOWN CURRENT
REGULATORY APPROVALS
2.8 - 3.4VDC
45 mA @ 3.3VDC
50 mA @ 3.3VDC
<10 uA @ 25º C
2.8 - 3.4VDC
215 mA @ 3.3VDC
55 mA @ 3.3VDC
FCC (USA)
IC (CANADA)
ETSI (EUROPE)
C-TICK AUSTRALIA
TELEC (JAPAN)
OUR-XBEE
4214A-XBEE
Yes
Yes
Yes
OUR-XBEEPRO
4214A-XBEEPRO
Yes - Max TX 10 mW
It’s the easy and fast way to build a wireless sensor network using
Digi XBee modules. To learn more visit docs.digi.com.
877-912-3444
I
952-912-3444
© 1996-2017 Digi International Inc. All rights reserved. All other trademarks are the property of their respective owners.
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