AP-CF512MR9NS-ETNDNRB datasheet, PDF

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AP-CF512MR9NS-ETNDNRB: DescriptionMemory Cards Industrial CF5 SLC Non-DMA Non-Removable Ext Temp 512MB; Categorystorage; File Size1MB，45 Pages; ManufacturerApacer

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Memory Cards Industrial CF5 SLC Non-DMA Non-Removable Ext Temp 512MB

AP-CF512MR9NS-ETNDNRB Parametric

Parameter Name	Attribute value
Product Category	Memory Cards
Manufacturer	Apacer
RoHS	Details
Product	Compact Flash Cards
Configuration	SLC
Memory Size	512 MB
Packaging	Tray
Factory Pack Quantity	1

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Halogen-free

CompactFlash Series 5

Specifications for Industrial CompactFlash Card

March 14, 2016

Version 1.4

Apacer Technology Inc.

1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C

Tel: +886-2-2267-8000

www.apacer.com

Fax: +886-2-2267-2261

Compact Flash 5 Series

AP-CFxxxXRxXS-XXXXXXB

Table of Contents

1. GENERAL DESCRIPTION .................................................................................................... 4

1.1 I

NTELLIGENT

OMPACT

LASH

ODULE

..............................................................................................................4

1.1.1 Wear-leveling algorithms ............................................................................................................................. 4

1.1.2 S.M.A.R.T. Technology .................................................................................................................................4

1.1.3 Built-in Hardware ECC ................................................................................................................................ 4

1.1.4 Flash Block Management ............................................................................................................................. 4

1.1.5 Power Failure Management .........................................................................................................................5

2. FUNCTIONAL BLOCK .......................................................................................................... 5

3. PIN ASSIGNMENTS ............................................................................................................... 6

4. PRODUCT SPECIFICATIONS .............................................................................................. 8

4.1 C

APACITY

............................................................................................................................................................. 8

4.2 P

ERFORMANCE

.....................................................................................................................................................8

4.3 E

NVIRONMENTAL

PECIFICATIONS

.......................................................................................................................9

4.4 C

ERTIFICATION

& C

OMPLIANCE

........................................................................................................................... 9

4.5 E

NDURANCE

.........................................................................................................................................................9

5. SOFTWARE INTERFACE ................................................................................................... 10

5.1 CF-ATA C

OMMAND

.................................................................................................................................... 10

6. ELECTRICAL SPECIFICATIONS ..................................................................................... 12

6.1 AC/DC C

HARACTERISTICS

................................................................................................................................. 12

6.1.1 General DC Characteristics ....................................................................................................................... 12

CompactFlash Interface I/O at 5.0V ..................................................................................................................... 13

CompactFlash Interface I/O at 3.3V ..................................................................................................................... 13

Non-CF Interface I/O Pins.................................................................................................................................... 13

6.1.2 General AC Characteristics........................................................................................................................ 14

Attribute Memory Read Timing ........................................................................................................................... 14

Attribute Memory Write Timing .......................................................................................................................... 15

Common Memory Read Timing ........................................................................................................................... 16

Common Memory Write Timing .......................................................................................................................... 17

I/O Read Timing ................................................................................................................................................... 18

I/O Write Timing .................................................................................................................................................. 19

True IDE PIO Mode Read/Write Timing ............................................................................................................. 20

True IDE Multiword DMA Mode Read/Write Timing ......................................................................................... 22

Ultra DMA Signal Usage in Each Interface Mode ............................................................................................... 23

Ultra DMA Data Burst Timing Requirements ...................................................................................................... 23

Ultra DMA Data Burst Timing Descriptions ........................................................................................................ 24

Ultra DMA Sender & Recipient IC Timing Requirements ................................................................................... 26

Ultra DMA AC Signal Requirements ................................................................................................................... 26

Ultra DMA Data-in Burst Initiation Timing ......................................................................................................... 27

Sustained Ultra DMA Data-in Burst Timing ........................................................................................................ 28

Ultra DMA Data-in Burst Host Pause Timing ...................................................................................................... 28

Ultra DMA Data-in Burst Device Termination Timing ........................................................................................ 29

Ultra DMA Data-in Burst Host Termination Timing ........................................................................................... 30

Ultra DMA Data-out Burst Initiation Timing ....................................................................................................... 31

Sustained Ultra DMA Data-out Burst Timing ...................................................................................................... 32

Rev. 1.4

Compact Flash 5 Series

AP-CFxxxXRxXS-XXXXXXB

1. General Description

Apacer’s value-added Industrial CompactFlash Card offers high performance, high reliability and power-

efficient storage. Regarding standard compliance, this CompactFlash Card complies with CompactFlash

specification revision 4.1, supporting transfer modes up to Programmed Input Output (PIO) Mode 6, Multi-

word Direct Memory Access (DMA) Mode 4, Ultra DMA Mode 5, and PCMCIA Ultra DMA Mode 5.

Apacer’s value-added CFC provides complete PCMCIA – ATA functionality and compatibility. Apacer ‘s

CompactFlash technology is designed for applications in Point of Sale (POS) terminals, telecom, IP-STB,

medical instruments, surveillance systems, industrial PCs and handheld applications such as the new

generation of Digital Single Lens Reflex (DSLR) cameras.

1.1 Intelligent CompactFlash Module

1.1.1 Wear-leveling algorithms

Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For HDDs,

when a change is made to stored data, like erase or update, the controller mechanism on HDDs will

perform overwrites on blocks. On the other hand, NAND flash storage adopts flash as their primary media.

Unlike HDDs, flash blocks cannot be overwritten and each P/E cycle wears down the lifespan of blocks

gradually. Repeatedly program/erase cycles performed on the same memory cells will eventually cause

some blocks to age faster than others. This would bring flash storages to their end of service term earlier.

Wear leveling is an important mechanism that level out the wearing of blocks so that the wearing-down of

blocks can be almost evenly distributed. This will increase the lifespan of SSDs. Commonly used wear

leveling types are Static and Dynamic.

1.1.2 S.M.A.R.T. Technology

S.M.A.R.T. is an acronym for Self-Monitoring, Analysis and Reporting Technology, an open standard

allowing disk drives to automatically monitor their own health and report potential problems. It protects the

user from unscheduled downtime by monitoring and storing critical drive performance and calibration

parameters. Ideally, this should allow taking proactive actions to prevent impending drive failure. Apacer

SMART feature adopts the standard SMART command B0h to read data from the drive. When the Apacer

SMART Utility running on the host, it analyzes and reports the disk status to the host before the device is

in critical condition.

1.1.3 Built-in Hardware ECC

This CompactFlash card employs BCH Error Correction Code (ECC) algorithms. This on-chip hardware

BCH-ECC engines is 13/24 bit programmed that can correct up to 24-bit errors per 1,024 byte data. This

built-in hardware ECC performs parity generation and error detection/correction for data integrity.

1.1.4 Flash Block Management

Contemporary process technology is unable to guarantee total reliability of NAND flash memory array.

When a flash memory device leaves factory, it comes with a highly minimal number of initial bad block

during production or out-of-factory as there is no currently known technology that produce flash chips free

of bad blocks. On the other hand, bad blocks may develop during program/erase cycles. When host

performs program/erase command on a block, bad block may appear in Status Register. Since bad

blocks are inevitable, the solution is to keep them in control. Apacer flash devices are programmed with

ECC, block mapping technique and S.M.A.R.T to reduce invalidity or error. Once bad blocks are detected,

data in those blocks will be transferred to free blocks and error will be corrected by designated algorithms.

Rev. 1.4

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