DATA SHEET
MeshConnect™
EM357 Module
ZICM357P2
Ember EM357 Transceiver Based Module
Integrated Transceiver Modules for ZigBee
DESCRIPTION
CEL’s MeshConnect™ EM357 Module combines a high
performance RF solution with the market's premier ZigBee®
stack. The addition of on board memory enables Over-the-Air
(OTA) programming without the need for additional in system
memory. The integrated Power Amplifier (PA) maximizes
range and performance. The small module footprint makes
it suitable for a wide range of ZigBee applications. The
MeshConnect EM357 Module is certified and qualified,
enabling customers to accelerate time to market by greatly
reducing the design and certification phases of development.
CEL’s MeshConnect™ EM357 Module (ZICM357P2) is
based on the Ember EM357 Zigbee® compliant System
on Chip (SoC) IC. The IC is a single-chip solution compliant
with ZigBee specifications and IEEE 802.15.4, a complete
wireless solution for all ZigBee applications. The IC consists
of an RF transceiver with the baseband modem, a hardwired
MAC and an embedded 32-bit ARM® Cortex™-M3
microcontroller with internal RAM (12 kB) and Flash (192 kB)
memory. The device provides numerous general-purpose
I/O pins and peripheral functions such as timers and UARTs.
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FEATURES
• High RF Performance:
• Antenna Options:
Up to 120 dB RF Link Budget
RX Sensitivity: -100 dBm
RF TX Power: +20 dBm
MeshConnect
™
EM357 Module
• FLASH Memory:
192 kB (EM357 Internal)
1MB (on Module Board - Optional)
• 12 kB SRAM
• 32-bit ARM® Cortex™-M3
• Up to 23 GPIO Pins
• SPI (Master/Slave), TWI, UART
• Timers, Serial Wire/JTAG Interface
• 5-Channel 14-Bit ADC
• Transmit Power +20dBm
• 1MB Additional Flash for OTA Programming (Optional)
• +120 dB RF Link Budget
1) Integrated PCB Trace Antenna
or
2) U.FL Connector for External Antenna
• Data Rate: 250 kbps
• 16 RF Channels
• AES Encryption
• Small Footprint: 1” x 1.41”
(25.4 mm x 35.9 mm)
• FCC, CE and IC Certifications
• ROHS Compliant
The MeshConnect EM357 Module adds a PA to increase
range, provide more reliable transmission, and reduce the
number of nodes in a network. It is useful for open outdoor
applications where the nodes are physically far apart or
for indoor areas where the nodes have to operate in a
noisy RF environment. The module’s outstanding 120 dB
link budget ensures high quality connections even in such
harsh environments.
The MeshConnect EM357 module also integrates an
optional 1MB Flash memory for OTA program updates,
making this device ready for Smart Energy Applications.
• Advanced Power Management
Scheme with Deep Sleep Mode
APPLICATIONS
• Smart Energy/Grid Markets
Smart Meters
• Building Automation and Control
• General ZigBee Wireless
Sensor Networking
• Home Automation and Control
Thermostats
Displays
Energy Management
Security Devices
HVAC Control
Lighting Control
FLASH MEMORy
• 192 kB (EM357 Internal)
• 1MB Additional Flash for OTA Programming (Optional)
Note: The EM357 Module without additional Flash
memory is recommended for applications where the
module is used with an external host processor
(Network Co-Processor mode)
ORDERING INFORMATION
Part Number
Order Number
ZICM357P2-2
Description
+20 dBm Output Power, PCB Trace Antenna and 1MB Additional Flash
+20 dBm Output Power with U.FL Connector for External Antenna,
1MB Additional Flash
+20 dBm Output Power, PCB Trace Antenna (No Additional Flash Memory)
+20 dBm Output Power with U.FL Connector for External Antenna
(No Additional Flash Memory)
Min/Multiple
140/140
140/140
140/140
140/140
MeshConnect
EM357 Module
ZICM357P2-2C
ZICM357P2-1-NF
ZICM357P2-1C-NF
The information in this document is subject to change without notice, please confirm data is current
Document No: 0008-00-07-00-000 (Issue D)
Date Published: January 14, 2013
MeshConnect™
EM357 Module
MODULE BLOCK DIAGRAMS
EM357 Module (ZICM357P2-x)
PWR
Reg
Flash
1MB
24 MHz
XTAL
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SPI
Bus
ANT
Castellation Edge
Connector
Ember
EM357
Balun
PA
Micro
processor
Radio
Balun
EM357 Module (ZICM357P2-1-NF)
PWR
Reg
24 MHz
XTAL
ANT
Castellation Edge
Connector
Ember
EM357
Balun
PA
Micro
processor
Radio
Balun
Page 2
MeshConnect™
EM357 Module
TABLE OF CONTENTS
Introduction and Overview
Description..............................................................................................................................................................................................
Features..................................................................................................................................................................................................
Applications............................................................................................................................................................................................
Ordering Information.............................................................................................................................................................................
Module Block Diagrams.........................................................................................................................................................................
1
1
1
1
2
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System Level Function
Electrical Specification
Pin Signal and Interfaces
Transceiver IC.........................................................................................................................................................................................
Additional Flash Memory.......................................................................................................................................................................
Antenna...................................................................................................................................................................................................
Power Amplifier.......................................................................................................................................................................................
Software/Firmware.................................................................................................................................................................................
4
4
4
5
5
Absolute Maximum Ratings...................................................................................................................................................................
Recommended (Operating Condition)..................................................................................................................................................
DC Characteristics..................................................................................................................................................................................
RF Characteristics..................................................................................................................................................................................
6
6
6
6
Pin Signals I/O Configuration................................................................................................................................................................
I/O Pin Assignment.................................................................................................................................................................................
Module Dimensions................................................................................................................................................................................
Module Footprint....................................................................................................................................................................................
7
7
10
11
12
13
15
15
16
Processing
.........................................................................................................................................................................................
Agency Certifications
...................................................................................................................................................................
Shipment, Storage and Handling
.............................................................................................................................................
Quality
..................................................................................................................................................................................................
References and Revision History
............................................................................................................................................
Page 3
MeshConnect™
EM357 Module
TRANSCEIVER IC
The MeshConnect EM357 Module uses the Ember EM357 transceiver IC. This IC incorporates the RF transceiver
with the baseband modem, a hardwired MAC and an embedded ARM® Cortex™-M3 microcontroller, offering an
excellent low cost high performance solution for all IEEE 802.15.4/ZigBee applications.
For more information about the Silicon Laboratories EM357 IC, visit
http://www.silabs.com
ADDITIONAL FLASH MEMORy
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GPIO Name
Function
EM357 Module
Pin Number
PA0
PA1
PA2
PA3
WP
SC2MOSI
SC2MISO
3
4
5
6
2
SC2SCLK
SC2nSSEL
Flash memory Write Protect line (has internal pull-up
resistor, but not connected to the EM357)
The MeshConnect EM357 Modules (ZICM357P2-2 and ZICM357P2-2C) incorporates an optional additional 1MB
external Flash memory for OTA program updates. The Flash memory communicates over the EM357’s second
serial controller using SPI. The Flash memory is wired to the following castellation pins:
The instruction set for the Flash memory is similar to the Micron M25PE80.
Note: In order to achieve the specified
sleep current for the module, it is necessary to send a Deep Power-Down command to the Flash memory.
See
http://www.micron.com
for more information on the instruction set.
ANTENNA
The MeshConnect EM357 Module includes an integrated Printed Circuit Board (PCB) trace antenna. An optional
U.FL connector can be specified, providing connection to a 50-ohm external antenna of the user’s choice. However,
use of an external antenna is not covered by the module's certification; see Ordering Information on Page 1.
For optimum antenna performance,
the MeshConnect EM357 Module
should be mounted with the PCB trace
antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed
on the host board under the module up to the antenna. The installation of an uninterrupted ground plane on a
layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance
with your PCB layout.
The PCB antenna employs an Inverted F-Antenna topology that is compact and highly efficient. To maximize
range, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on
the host PCB will contribute significantly to the antenna performance; it should not be directly under the Inverted
F-Antenna. The position of the module on the host board and overall design of the product enclosure contribute
to antenna performance. Poor design affects radiation patterns and can result in reflection, diffraction and/or
scattering of the transmitted signal.
A few design guidelines to help ensure antenna performance:
•
•
•
•
•
Never place the ground plane or route copper traces directly underneath the antenna portion of the module
Never place the antenna close to metallic objects
In the overall design, ensure that wiring and other components are not placed near the antenna
Do not place the antenna in a metallic or metalized plastic enclosure
Keep plastic enclosures 1cm or more away from the antenna in any direction
Page 4
MeshConnect™
EM357 Module
POWER AMPLIFIER
The MeshConnect EM357 Module includes a PA. This PA delivers high efficiency, high gain and high output
power (Pout = +20.0 dBm TYP) to provide an extended range and reliable transmission for fewer nodes in a
network.
The PA is connected to the alternate EM357 IC TX output, so EM357 TX Power Modes 2 or 3 must be used to
achieve the specified output power.
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SOFTWARE/FIRMWARE
The MeshConnect EM357 Module is an ideal platform for the EmberZNet PRO™, the industry’s most deployed
and field proven ZigBee compliant stack supporting the ZigBee PRO feature set. EmberZNet PRO is a complete
ZigBee protocol software package containing all the elements required for mesh networking applications. For
more information regarding the software development for this IC, visit
http://www.silabs.com
CEL provides reference software that runs multiple functions and executes various commands. The firmware
allows the execution of IEEE 802.15.4 communication, validation and manufacturing tests. For example, users
can set up a simple ZigBee Point-to-Point Network to perform Range and Packet Error Rate (PER) tests. The
software can also place the module in various operating modes, which allows for setting and/or testing various
parameters.
Page 5
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