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ENW-89842A2JF

Description
Thick Film Resistors - SMD 24.9K OHM 1%
CategoryModule/solution   
File Size1MB,2 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
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Thick Film Resistors - SMD 24.9K OHM 1%

ENW-89842A2JF Parametric

Parameter NameAttribute value
Product CategoryBluetooth / 802.15.1 Modules
ManufacturerPanasonic
RoHSDetails
ClassClass 1, Class 2, Bluetooth Smart
VersionVersion 4.0
Frequency2.402 GHz to 2.48 GHz
Sensitivity- 93 dBm
Data Rate2178 kb/s
Operating Supply Voltage1.7 V to 4.8 V
Output Power10 dBm
Interface TypeHCI
Maximum Operating Temperature+ 85 C
Antenna Connector TypeChip
Dimensions9 mm x 9.5 mm x 1.8 mm
Minimum Operating Temperature- 40 C
Moisture SensitiveYes
PackagingReel
Factory Pack Quantity500
Product
Introduction
New
Product
New
Introduction
NEW!
PAN1323
SERIES
BLUETOOTH
®
TRIPLE MODE RF MODULES
Three Standards, One Small Module!
One highly flexible RF Module, three popular standards: Bluetooth Classic,
Bluetooth Low Energy and ANT™. Panasonic introduces the
NEW PAN1323
Series Triple Mode RF Module
with embedded antenna. The
PAN1323 Series
provides easily integrated Bluetooth Version 4.0 and ANT connectivity into new
and current designs by removing RF design and certification barriers from the
development of the application.
Gain unprecedented access using this three
mode gateway module that can connect 14 Million ANT nodes to over 3 Billion
P
i
Bluetooth nodes.
Use Bluetooth EDR to manage large data requirements while
Cut the Cable
taking advantage of extraordinary battery life using ultra lower network technology
found in Bluetooth Low Energy and ANT for small data loads.
Bluetooth-Module PAN1450
Designers can reduce the size and cost of applications using Panasonic’s unique,
OUTLINES - ENW89803J
tiny footprint technology. Just 85.5 mm
2
, this family of modules are designed to
accommodate PCBs with pad pitch of 1.3mm with as little as two layers for easy
implementation and manufacturing.
PAN1323 Series
Modules have a Bluetooth
subsystem, FCC, CE, (ETSI) and IC certifications.
TM
M
BLUET
Product Performance:
• A Single Module for Three Standards: Bluetooth Classic,
Bluetooth Low Energy and ANT™.
o Bluetooth Version 4.0
o ANT™ is a wireless sensor network protocol
designed for ultra-low power applications
o Bluetooth Low Energy average power consumption
is about 1 uA.
• Cost Effective and Flexible HCI Interface
• Extraordinary Range with10 dbm of Tx Power
ODULES
The NEW
PAN1323 Series
is based upon Texas Instrument’s CC256x integrated circuits and uses a host controlled interface
FEATURES
(HCI), a cost effective and flexible means to implement a Bluetooth network. HCI reduces BOM cost by eliminating redundant
processing capacity and giving designers the flexibility to work with a controller of their choosing, as the stacks reside
and execute on the application’s host processor. The
PAN1323 Series
is pad compatible with Panasonic’s PAN1325A,
PAN1326 and PAN1327 Series. A single PCB layout allows the flexibility of different protocol functionality implemented with
only firmware.
Overview
- Inquiry results with RSSI (1.2)
- Adaptive frequency hopping (AFH) enabled (1.2)
- High throughput (>600 kbps)
- Hold-, Park- and Sniffmode
- Up to 128 bit encryption
- Audio capability on an SCO channel
- Support for very low power modes - sleep and deep sleep
- All bluetooth data rates (up to 57,6/723,2Kbps)
User Interfaces
- Full-speed USB version 2.0 compliant
- Programmable baud rate UART (9,6 Kbps - 921,6 Kbps)
- Debug UART (DUART)
- 16 General Purpose I/O‘s (interruptible)
- PCM audio (1 channel)
- SPI and JTAG interface
Radio Features
- High sensitivity design (-86 dBm typ.)
- Integrated RF shield
- Class 2 module (0dBm typ. output power)
- One antenna port
The PAN1450 provides wireless interface per the BT 1.2
specification. Interoperability and BT compliance testing have
been completed for the BT Chip ZV4301 from Zeevo, Inc. to
facilate rapid time-to-market.
TM
The BT Chip incorporates a widely popular 32-bit ARM7TDMI
CPU core with sufficient bandwidth to support a wide range of
embedded µController applications and the module provides
full ARM7 software development access.
The PAN1450 is manufactured in a 13,4 x 18,7 x 2,2 mm³
SMD package and the only external component needed is an
50 ohm antenna.
Any customizations for the software can be handled
with our recommended partners.
W
IRELESS
TH
QUAL
OO
IF
I
ED
B01839
Design and Specifications are subject to change without notice. Ask the factory for technical specifications before purchase and/or use. If there is any doubt
regarding the safety of this product, kindly inform us immediately for technical consultation.
PAN1450 Rev. A
Easily Integrates to Texas Instruments’ MSP430
and Stellaris ARM7 Controllers
Small Footprint: 9mm x 9.5mm x 1.8mm
Fully Certified, Bluetooth v4.0, FCC, CE and IC
Complete Development Environment
100% Footprint Compatible with PAN13xx Series
Optional Industrial Temperature Rating -40ºC to +85
ºC
Supports All Bluetooth Profiles
Compatible with 14 Million Deployed ANT Nodes
P
R
O
D
U
C
T
PAN1323 Part Numbers:
Part Numbers
ENW–89842A2JF
EVAL_PAN1323
EVAL_PAN1323ETU
Description
Bluetooth,
PAN1323 , Triple Mode with Antenna
Bluetooth,
PAN1323, Eval Kit, Includes MSP430 Experimenter Board
Bluetooth,
PAN1323, Development Module
The
Bluetooth®
word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by
Panasonic Corporation of North America is under license. Other trademarks and trade names are those of their respective owners.
Website:
www.panasonic.com/rfmodules
industrial@us.panasonic.com
1-800-344-2112
Copyright © 2012 Panasonic Corporation of North America.
All Rights Reserved. Specifications are subject to change without notice.
PAN1323 NPI, FY12-063-XXX

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