PRoDuCt BRiEF
intel® Desktop Board DQ67EP
Executive Series
Mini-ITX Form Factor
Mini-size the High
Performance Business PC
Introducing the Intel® Desktop Board DQ67EP, supporting
the Intel® Core™ i5 vPro™
1
and Intel® Core™ i3 processors
Built for Business
Engineered in Mini-ITX small form factor
(SFF), the tiny Intel® Desktop Board
DQ67EP is amazingly loaded with the latest
expandability, remote manageability, and
data security features. Based on the new
Intel® Express Chipset Q67 with embedded
Intel® Active Management Technology, this
desktop board supports the 2nd generation
Intel® Core™ vPro™ processors in the latest
LGA1155 package and up to 16 GB
2
DDR3
1333/1066 memory, the gateway to
low-power and high-performance business
computing starts here. Enjoy hi-speed
connectivity with built-in SuperSpeed USB
3.0 and SATA 6.0 Gb/s ports, along with
premium features: DisplayPort*
3
+
dual-DVIs triple graphic ports, eSATA
ports, and Mini-PCI Express* slot.
Seamless PC Remote Manageability
The Intel® Desktop Board DQ67EP is
equipped with the improved KVM Remote
Control manageability, enabling you to
remotely access and control a PC, even
when the remote PC is in OOB (out of
band) state. Desk-side troubleshooting
is greatly reduced with the KVM Remote
Control feature.
Eco-Smart Computing
5
Intel® Desktop Board DQ67EP supports
phase-shedding technology, which allows
it to shut down unneeded phases to
enhance energy efficiency for significant
power savings. The board meets ENERGY
STAR*, ErP, and EPEAT compliance
standards and is RoHS-compliant for
hazardous material reduction.
Data Security Features
Protect sensitive office data with RAID
built into the Intel Q67 Express Chipset,
with multiple configurations to support
RAID 0, 1, 5, and 10. Encryption and
signature keys are protected from
software-based attacks with onboard
Trusted Platform Module
4
(TPM). Also
included with the Intel Desktop Board
DQ67EP is the award-winning antivirus
software ESET* Smart Security 4 with
a one-year license.
Intel® Desktop Board DQ67EP Executive Series
Technical Specifications
PRoCESSoR
Processor Support
• nd generation Intel® Core™ i5 vPro™ and
2
Intel® Core™ i3 processors in the LGA1155 package
• Intel® Hyper-Threading Technology
8
• Intel® Turbo Boost Technology
7
• ntegrated Memory Controller with support for up
I
to 32 GB of system memory using either DDR3
1333/1066 MHz
• Intel® Fast Memory Access
• Supports Intel® 64 architecture
10
CHiPSEt
Intel® Q67 Express Chipset
• Intel® 82Q67 Platform Controller Hub (PCH)
• Intel® Active Management Technology 7.0
• Intel® Rapid Storage Technology (RAID 0, 1, 5, 10)
Integrated Intel® PCH Controllers
• Four Hi-Speed USB 2.0 ports
• Six additional ports via internal headers
• wo SATA 6.0 Gb/s ports and four
T
SATA 3.0 Gb/s ports
System BIOS
• 2 Mb Flash EEPROM with Intel® Platform
3
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
• dvanced configuration and power interface
A
V1.0b, DMI 2.5
• Intel® Express BIOS update support
Hardware Management Features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 1.0b
Intel® 82579LM ENERGY STAR*-ready Intel® PRO
10/100/1000 Network Connection
• igh quality and reliability with Intel’s world-class
H
manufacturing and validation
• New low-power design
Expansion Capabilities
• One PCI Express* 2.0 x16 slot
• ne Mini-PCI Express Mini Card slot supporting
O
half-length configuration
Audio
• -channel Intel® High Definition Audio
9
with
8
multi-streaming
• One front panel audio header
• One S/PDIF output internal header
SYStEM MEMoRY
Memory Capacity
• wo 240-pin DIMM connectors supporting
T
up to two double-sided DIMMs
Memory Types
• DDR3 1333/1066 SDRAM memory support
• Non-ECC Memory
Memory Voltage
• Memory voltage control from 1.2 V to 1.8 V
• 1.5 V standard JEDEC voltage
JuMPERS AND FRoNt-PANEL CoNNECtoRS
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Three front-panel Hi-Speed USB 2.0 headers
• Front-panel audio header
MECHANiCAL
Board Style
• Mini-ITX form factor
Board Size
• 6.7¨ x 6.7¨ (12.7cm x 12.7cm)
Baseboard Power Requirements
• ATX 12 V
ENViRoNMENt
Operating Temperature
• 0° C to +55° C
Storage Temperature
• -20° C to +70° C
REGuLAtioNS AND SAFEtY StANDARDS
United States and Canada
SA/UL 60950-1, First Edition (Binational
C
Standard) UL 1950, Third edition—CAN/CSA C22.2
o. 950-95 with recognized U.S. and Canadian
N
component marks
64-bit computing on Intel
®
architecture requires a computer system with a
processor, chipset, BIOS, operating system, device drivers, and applications
enabled for Intel
®
64 architecture. Processors will not operate (including 32-
bit operation) without an Intel 64 architecture enabled BIOS. Performance
will vary depending on your hardware and software configurations. See
http://developer.intel.com/technology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANT-
ABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER
INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining
applications. Intel may make changes to specifications and product descrip-
tions at any time, without notice. All products, dates, and figures specified are
preliminary based on current expectations, and are subject to change without
notice. Availability in different channels may vary. Actual Intel
®
Desktop Board
may differ from the image shown.
10
Europe
Low Voltage Directive 2006/95/EC)
(
EN 60950-1:2006
Nemko certified to EN 60950 International
Nemko certified to IEC 60950
(CB report with CB certificate)
MC directive 89/336/EEC; EN 55022:1998
E
Class B; EN 55024:1998
EMC Regulations
(tested in representative chassis)
United States
FCC Part 15, Class B
CC Part 15, Class B open-chassis
F
(cover off) testing
Canada
ICES-003, Class B
Australia/New Zealand
AS/NZS 3548, Class B
Taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
For ordering information, visit:
www.intel.com
For the most current
product information, visit:
www.intel.com/go/idb
or
http://ark.intel.com
For specific CPU compatibility, visit:
http://processormatch.intel.com
Copyright © 2010 Intel Corporation. All rights reserved. Intel, the Intel logo,
Intel vPro, and Intel Core are trademarks of Intel Corporation in the U.S. and
other countries.
*Other names and brands may be claimed as the property of others.
Printed in USA 1210/TFC/HBD/PDF Please Recycle 324749-001US
Power requirements vary. Complies with US CRF via EN55022 +6 db in
system configurations with an open chassis and EU Directive 89/336/EEC
and use via EN55022 and EN50082-1 in a representative chassis.
1
Requires the use of a discrete graphics card.
2
System resources and hardware (such as PCI and PCI Express*) require
physical memory address locations that can reduce available addressable
system memory. This could result in a reduction of as much as 1 GB or more
of physical addressable memory being available to the operating system and
applications, depending on the system configuration and operating system.
3
DisplayPort (DP): The next generation in high-performance digital connectiv-
ity delivering high-resolution digital display and digital audio.
Lead-Free:
The symbol is used to identify
electrical and electronic assemblies and com-
ponents in which the lead (Pb) concentration
level in any of the raw materials and the end product
is not greater than 0.1% by weight (1000 ppm).
This symbol is also used to indicate conformance
to lead-free requirements and definitions adopted
under the European Union’s Restriction on Hazardous
Substances (RoHS) directive, 2002/95/EC.
The original equipment manufacturer must provide TPM functionality, which
requires a TPM-supported BIOS. TPM functionality must be initialized and
may not be available in all countries.
5
For Intel eco-smart technologies, visit www.intel.com/go/ecosmart.
6
The Intel
®
Core Utilities Bundle includes Intel
®
Integrator Assistant, Intel
®
Integrator Toolkit, Intel
®
Express Installer, and Intel
®
Express BIOS Update.
7
Intel
®
Turbo Boost Technology requires a PC with a processor with Intel Turbo
Boost Technology capability. Intel Turbo Boost Technology performance
varies depending on hardware, software, and overall system configuration.
Check with your PC manufacturer on whether your system delivers Intel Turbo
Boost Technology. See www.intel.com/technology/turboboost for
more information.
8
Intel
®
Hyper-Threading Technology requires a computer system with a
processor supporting HT Technology and an HT Technology-enabled
chipset, BIOS, and operating system. Performance will vary depending
on the specific hardware and software you use. For more information
including details on which processors support HT Technology, see
www.intel.com/info/hyperthreading.
9
Intel
®
High Definition Audio requires a system with an appropriate Intel
®
chip-
set and a motherboard with an appropriate codec and the necessary drivers
installed. System sound quality will vary depending on actual implementation,
controller, codec, drivers, and speakers. For more information about Intel
®
HD
Audio, refer to www.intel.com/design/chipsets/hdaudio.htm.
4
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