Intel® Desktop Board DH61WW Classic Series
Technical Specifications
ProCeSSor
Processor Support
• Intel® Core™ i7 and Intel® Core™ i5 processors and
other Intel® processors in the LGA1155 package
• Supports Intel® 64 architecture
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CHIPSet
Intel® H61 express Chipset
• Intel® 82H61 Platform Controller Hub (PCH)
Peripheral Connectivity
• Four SATA (3.0 Gb/s) ports
• Six Hi-Speed USB 2.0 ports (four back panel ports
and two additional ports via internal headers)
• Parallel port
System bIoS
• 32 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play
• Advanced configuration and power interface
V3.0b, SMBIOS2.5
• Intel® Express BIOS update support
Hardware Management features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• ACPI-compliant power management control
Intel® Pro 10/100/1000 Network Connection
• Low-power design
expansion Capabilities
• One PCI Express* 2.0 x16 graphics connector
• One PCI Express 2.0 x1 connector
• One PCI connector
Headers
• One serial port header
• S/PDIF audio header
Audio
• Six-channel Intel® High Definition Audio
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codec
SYSteM MeMorY
Memory Capacity
• Two 240-pin DIMM connectors supporting up to
four double-sided DIMMs (8 GB
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max)
Memory types
• DDR3 1333 / 1066 / 800 SDRAM memory support
• Non-ECC Memory
Memory Modes
• Dual- or single-channel operation support
Memory Voltage
• 1.2 V to 1.8 V
JuMPerS ANd froNt-PANeL CoNNeCtorS
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
For ordering information, visit www.intel.com
For the most current product information, visit
http://developer.intel.com/products/desktop/motherboard/
front-Panel Connectors
• Reset, HDD LED, Power LEDs, power on / off
• Front-panel Hi-Speed USB 2.0 headers
• Front-panel audio header
MeCHANICAL
board Style
• MicroATX 2.2-compliant
board Size
• 9.6” x 7.75” (24.38cm x 19.7cm)
baseboard Power requirements
• ATX 12 V
eNVIroNMeNt
operating temperature
• 0° C to +55° C
Storage temperature
• -20° C to +70° C
reGuLAtIoNS ANd SAfetY StANdArdS
united States and Canada
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
europe
Nemko certified to EN 60950 International
Nemko certified to IEC 60950
(CB report with CB certificate)
eMC regulations (tested in representative chassis)
united States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis (cover off) testing
Canada
ICES-003, Class B
europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via
EN55022 +6 db in system configurations with an
open chassis and EU Directive 89/336/EEC and use via
EN55022 and EN50082-1 in a representative chassis.
Lead-free:
The symbol is used to identify
electrical and electronic assemblies and
components in which the lead (Pb) concen-
tration level in any of the raw materials and the end
product is not greater than 0.1% by weight (1000 ppm).
This symbol is also used to indicate conformance
to lead-free requirements and definitions adopted
under the European Union’s Restriction on Hazardous
Substances (RoHS) directive, 2002/95/EC.
1
Intel® Turbo Boost Technology 2.0 requires a PC with a processor
with Intel Turbo Boost Technology 2.0 capability. Intel Turbo
Boost Technology 2.0 performance varies depending on
hardware, software, and overall system configuration. Check
with your PC manufacturer on whether your system delivers
Intel Turbo Boost Technology. See www.intel.com/technology/
turboboost for more information.
Intel® Hyper-Threading Technology requires a computer system
with a processor supporting HT Technology and an HT Technology-
enabled chipset, BIOS, and operating system. Performance will
vary depending on the specific hardware and software you use.
See www.intel.com/info/hyperthreading for more information.
Intel® High Definition Audio requires a system with an appropriate
Intel® chipset and a motherboard with an appropriate codec and
the necessary drivers installed. System sound quality will vary
depending on actual implementation, controller, codec, drivers,
and speakers. For more information about Intel® HD Audio, refer
to www.intel.com/design/chipsets/hdaudio.htm
The Intel® Core Utilities bundle includes Intel® Integrator Assistant,
Intel® Integrator Toolkit, Intel® Express Installer and Intel®
Express Bios Update.
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System resources and hardware (such as PCI and PCI Express*)
require physical memory address locations that can reduce avail-
able addressable system memory. This could result in a reduction
of as much as 1 GB or more of physical addressable memory being
available to the operating system and applications, depending on
the system configuration and operating system.
64-bit computing on Intel® architecture requires a computer
system with a processor, chipset, BIOS, operating system, device
drivers, and applications enabled for Intel® 64 architecture.
Processors will not operate (including 32-bit operation) without
an Intel 64 architecture-enabled BIOS. Performance will vary
depending on your hardware and software configurations. See
http://developer.intel.com/technology/intel64/index.htm for
more information.
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-
ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving,
or life-sustaining applications. Intel may make changes to speci-
fications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based
on current expectations, and are subject to change without
notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, and Intel Core are trademarks of Intel
Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2011 Intel Corporation. All rights reserved.
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INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-
CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
ADI Reference Circuit
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