MeshConnect
™
EM35x Mini Modules
TM
ZICM35xSP0 and ZICM35xSP2
Ember EM35x Transceiver-Based Modules
Integrated Transceiver Modules for ZigBee
®
/ Thread / IEEE 802.15.4
Development Kit Available: ZICM-EM35X-DEV-KIT-3
DESCRIPTION
The MeshConnect
™
EM35x Mini Modules from
California Eastern Laboratories (CEL) combine high
performance RF solutions with the market's premier
ZigBee
®
and Thread stacks. Available in low and
high output power options (+8 dBm and +20 dBm),
these modules can accommodate variable range
and performance requirements. The tiny module
footprint makes them suitable for a wide range of
ZigBee and Thread applications. The MeshConnect
EM35x Mini Modules are certified and qualified,
enabling customers to accelerate time to market by
greatly reducing the design and certification phases
of development.
CEL’s
MeshConnect
EM35x
Mini
Modules
(ZICM35xSP0 and ZICM35xSP2) are based on the
Ember EM35x (EM357 and EM358x) System on Chip
(SoC) radio ICs. Each IC is a complete single-chip
solution, compliant with ZigBee, Thread, and IEEE
802.15.4. specifications.
CEL’s EM358x-based Mini Modules (ZICM358xSP0
and ZICM358xSP2) are ideal for customers requiring
Over-the-Air (OTA) programming without an external
Flash memory (such as Smart Energy or Home
Automation), a larger memory footprint for complex
application control, or the additional resources to run
an IPv6-based networking stack like Thread. They
also feature an optional on-board Universal Serial
Bus (USB) 2.0 full-speed peripheral.
EM35x Mini Modules
Powered by
Ember
®
ZigBee
®
& Thread Solutions
KEY FEATURES:
• Up to 23 GPIO Pins
• SPI (Master /Slave),
TWI and UART
• Timers and Serial
EM357
• 32-bit ARM
®
Cortex
™
-M3
• 12 kB SRAM
• 192 kB Flash
or
EM358x
• Up to 64kB SRAM
• Up to 512kB Flash
(Supports OTA)
• Optional USB
Controller
Wire /JTAG Interface
• 5-Channel 14-bit ADC
ZICM35xSP0
Tx: +8 dBm
Rx: -100 dBm
Link Budget: +108 dB
ZICM35xSP2
+20 dBm
-103 dBm
+123 dB
•
•
•
•
Data Rate: 250kbps
Advanced Power Management
16 RF Channels
Industry's Premier Wireless
Networking Stacks: EmbeZNet
PRO
™
(ZigBee) and Silicon
Labs Thread
• Mini Footprint:
-
0.940" x 0.655"
(23.9 mm x 16.6 mm)
ADDITIONAL FEATURES
• Antenna Options:
1) Integrated PCB Trace Antenna
2) RF Port for External Antenna
• Supports Mesh Networks
• AES Encryption
• FCC, CE and IC Certifications
• RoHS Compliant
APPLICATIONS
• Smart Energy /Grid Markets
• Commercial and Residential
- Thermostats
Lighting
- In-Home Displays
-
Fixtures and Control
- Smart Plugs
• Solar Inverters and Control
• Home Automation and Control • General ZigBee and Thread
- Energy Management
Wireless Sensor Networking
- Security Devices
- HVAC Control
• Building Automation and Control
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
Date Published: October 11, 2016
Page 1
Contributor Member
EM35x Mini Modules
TABLE OF CONTENTS
Introduction and Overview
Description..............................................................................................................................................................................................
Features...................................................................................................................................................................................................
Applications............................................................................................................................................................................................
Ordering Information..............................................................................................................................................................................
ZICM35xSPx Product Comparison Table..............................................................................................................................................
Module Block Diagram...........................................................................................................................................................................
Development Tools..................................................................................................................................................................................
1
1
1
3
4
4
5
System Level Function
Transceiver IC..........................................................................................................................................................................................
Antenna....................................................................................................................................................................................................
Power Amplifier.......................................................................................................................................................................................
USB...........................................................................................................................................................................................................
Software /Firmware.................................................................................................................................................................................
6
6
6
7
7
Electrical Specification
Absolute Maximum Ratings...................................................................................................................................................................
Recommended Operating Condition.....................................................................................................................................................
DC Characteristics..................................................................................................................................................................................
RF Characteristics..................................................................................................................................................................................
8
8
8
9
Pin Signal and Interfaces
Pin Signals I/O Configuration...............................................................................................................................................................
I/O Pin Assignment................................................................................................................................................................................
Module Dimensions................................................................................................................................................................................
Module Land Footprint...........................................................................................................................................................................
10
10
11
12
13
15
16
18
18
19
19
Processing
..........................................................................................................................................................................................
Agency Certifications
....................................................................................................................................................................
Software Compliance
....................................................................................................................................................................
Shipment, Storage and Handling
.............................................................................................................................................
Quality
...................................................................................................................................................................................................
References
..........................................................................................................................................................................................
Revision History
...............................................................................................................................................................................
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
Page 2
Contributor Member
EM35x Mini Modules
ORDERING INFORMATION
Part Number
Order Number
ZICM357SP0-1-R
ZICM357SP0-1C-R
ZICM357SP2-1-R *
ZICM357SP2-1C-R *
ZICM357SP2-2-R
Description
EM357 IC, +8 dBm output power, PCB trace antenna; Tape and Reel Package
EM357 IC, +8dBm output power with castellation pin for external antenna; Tape and Reel Package
EM357 IC, +20 dBm output power, PCB trace antenna; Tape and Reel Package
EM357 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package
EM357 IC, +20 dBm output power, PCB trace antenna; Tape and Reel Package
EM357 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package
EM3588 IC, +8 dBm output power, PCB trace antenna; Tape and Reel Package
EM3588 IC, +8dBm output power with castellation pin for external antenna; Tape and Reel Package
EM3588 IC, +20 dBm output power, PCB trace antenna; Tape and Reel Package
EM3588 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package
EM3588 IC, +20 dBm output power, PCB trace antenna; Tape and Reel Package
EM3588 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package
Min/
Multiple
600 /600
600 /600
600 /600
600 /600
600 /600
600 /600
600 /600
600 /600
600 /600
600 /600
600 /600
600 /600
1/1
MeshConnect
EM35x Mini Modules
ZICM357SP2-2C-R
ZICM3588SP0-1-R
ZICM3588SP0-1C-R
ZICM3588SP2-1-R *
ZICM3588SP2-1C-R *
ZICM3588SP2-2-R *
ZICM3588SP2-2C-R *
MeshConnect
EM35x
ZICM-EM35X-DEV-KIT-3
MeshConnect EM35x Ember Companion Kit for Ember EM35x Development Kit
Development Kit
*Note: ZICM35xSP2-1(C) modules are not recommended for new designs, although there are no plans to stop production. Use ZICM35xSP2-2(C)
instead. The -2 part numbers allow for faster 'time to sleep' state at the expense of one less GPIO (PC6).
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
Page 3
Contributor Member
EM35x Mini Modules
ZICM35xSPx PRODUCT COMPARISON TABLE
MCU
Order Number
Flash
Memory
SRAM
Memory
USB
I/O
Tx
Power
Output
dBm
23
192 kB
12 kB
–
22
21
23
22
512 kB
ZICM3588SP2-2
ZICM3588SP2-2C
64 kB
+8
Performance
Rx
Sensitivity
dBm
-100
Rx
Current
mA
30
Tx
Current
mA
44
1
Reduced GPIO allows for
faster 'time to sleep' state
2.4 µA with entire RAM
retained. Lower sleep
current can be achieved
by retaining less RAM
2.4
1) 2.4 µA with entire RAM
retained. Lower sleep
current can be achieved
by retaining less RAM
2) Reduced GPIO allows
for faster 'time to sleep'
state
Sleep /
Suspend
Current
µA
Comments
ZICM357SP0-1
ZICM357SP0-1C
ZICM357SP2-1
ZICM357SP2-1C
ZICM357SP2-2
ZICM357SP2-2C
ZICM3588SP0-1
ZICM3588SP0-1C
ZICM3588SP2-1
ZICM3588SP2-1C
+20
-103
34
150
+8
-100
30
44
ü
21
+20
-103
34
150
MODULE BLOCK DIAGRAMS
EM35x Mini Module (ZICM35xSP0)
24 MHz
XTAL
Castellation
Edge Connector
Ember EM35x
Micro
Balun
LPF
Radio
EM35x Mini Module (ZICM35xSP2)
24 MHz
XTAL
Castellation
Edge Connector
Ember EM35x
PA
Micro
Radio
LNA
TX/RX
Switch
LPF
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
Page 4
Contributor Member
EM35x Mini Modules
DEVELOPMENT TOOLS
EM35x Ember Companion Kit
Kit Contents:
• ZICM357SP0-1C-SL
• ZICM357SP2-1-SL
• ZICM357SP2-1C-SL
• ZICM3588SP0-1C-SL
• ZICM3588SP2-1-SL
• ZICM3588SP2-1C-SL
Ember Companion Kit
CEL’s MeshConnect EM35x Ember Companion Kit is
designed to work with the Silicon Laboratories / Ember
Development Kits (EM35X-DEV and EM35X-DEV-IAR).
Each module in the CEL Development Kit is soldered on
a carrier board making it pin-for-pin compatible with the
Ember Development Board.
Mini Modules Programming Fixture
CEL's MeshConnect EM35x Mini Modules Programming
Fixture is a programming assembly designed to be used
with the CEL ZICM35xSPx MeshConnect Mini Modules. It
is useful for production programming or during application
development when multiple firmware images are required
to be loaded into a CEL Mini Module for testing and
debugging. The programming assembly must be used in
conjunction with an Ember Debug/InSight Adapter (ISA3)
from Silicon Labs.
For more information regarding the MeshConnect
Development Tools, refer to the respective documents, or
visit
www.cel.com/MeshConnect.
EM35x Programming Fixture
DEVELOPMENT TOOLS ORDERING INFORMATION
Part Number
MeshConnect
EM35x Ember Companion Kit
MeshConnect
EM35x Programming Fixture
Order Number
ZICM-EM35X-DEV-KIT-3
ZICM35xSPx-PF-1
Description
MeshConnect EM35x Ember Companion Kit for Silicon Laboratories/
Ember EM35x Development Kit
MeshConnect EM35x Mini Modules (ZICM35xSPx) Programming Fixture
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
Page 5
Contributor Member
京公网安备 11010802033920号
EEWORLD
