MKE38P600TLB datasheet, PDF - EEWORLD Datasheet

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MKE38P600TLB: DescriptionMOSFET SMPD MOSFET; Categorysemiconductor Discrete semiconductor; File Size1018KB，4 Pages; ManufacturerIXYS ( Littelfuse ); Websitehttp://www.ixys.com/

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MKE38P600TLB Overview

MOSFET SMPD MOSFET

MKE38P600TLB Parametric

Parameter Name	Attribute value
Product Category	MOSFET
Manufacturer	IXYS ( Littelfuse )
RoHS	Details
Technology	Si

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IXYS

POWER

P R O D U C T

B R I E F

Surface Mount Power Device(SMPD) and Mini SMPD Packages

Lighter weight, more power(ultra-low proﬁle, energy eﬃcient, and rugged)

January 2013

SMPD OVERVIEW

IXYS introduces a new packaging technology – the Surface Mount Power Device (SMPD)

package. It is an expansion of the ISOPLUS™ package portfolio, which has been providing

isolated-package solutions to the power electronics industry for more than a decade.

Compared to copper-based lead-frame packages, these devices exhibit better thermal perfor-

mance, lower weight, and better power cycling capability.

The SMPD package can be easily surface-mounted on a Printed Circuit Board (PCB) using a

standard pick-and-place and reﬂow soldering process. No costly screws, cables, bus-bars or

hand soldered contacts are needed. Weighing only 8g, it is much lighter (typically by 50%)

than comparable conventional power modules, thereby enabling lower weight power

systems for IXYS customers. This is one of the key “Green” initiatives of IXYS Corporation in

developing new products for the Cleantech industry that are lighter in weight. Moreover, due

to its compact and ultra-low proﬁle package, it is possible to use the same heat sink for

multiple devices, saving PCB space. Another added beneﬁt of being smaller and lighter is that

it provides a better protection against vibrations and g-forces, especially if used in portable

appliances, increasing the life expectancy and reliability of these devices. IXYS is virtually the

ﬁrst power semiconductor company to oﬀer surface-mountable high-voltage Power MOSFETs

and IGBTs.

A ceramic isolation of up to 4.5kV is achieved with the Direct Copper Bond (DCB) substrate

technology – an electrically isolated tab is provided for heat sinking. The DCB provides low

thermal impedance and best-in-class power and temperature cycling capabilities. The

ISOPLUS™ advantage also facilitates having multiple die on the same single substrate – buck,

boost, phase-leg, full-bridge, half-bridge conﬁgurations are implementable.

“This unique device is part of our initiative of taking power systems on a diet, literally, with the

aim of reducing the weight of the power semiconductors in a typical power system. Weight

reduction is a key eﬀort in reducing greenhouse gas emissions in the production, shipment

and use of power products,” commented Dr. Nathan Zommer, Founder and CEO of IXYS

Corporation, regarding the recently released 1kV/30A Q3 HiperFET™ Power MOSFET in the

SMPD package. “Our lighter products use less material, require less energy to ship, and result

in lower weight products for our customers, a critical desired feature in a lot of applications,

including portable equipment, and for the automotive and transportation industry.”

The new surface-mountable SMPD package is an ideal replacement part for bulky traditional

power modules. IXYS is able to oﬀer various SMPD topologies – the MMIX1F44N100Q3 is a

single die 1000V/30A HiperFET™ Power MOSFET, the IXA68PF650LB a 1200V/68A dual IGBT

with anti-parallel diodes, the DMA90U1800LB a 1800V/99A three phase rectiﬁer diode. Upon

request, IXYS can manufacture other customer-speciﬁc conﬁgurations.

SMPD-X

SMPD-B

SMPD ADVANTAGES

Ultra-low and compact package proﬁle

(5.3mm height x 24.8mm length x 32.3mm width)

Surface mountable via standard reﬂow process

(Available in Tape & Reel packaging)

Low package weight (8g)

Up to 4500V ceramic isolation(DCB)

Low package inductance

Excellent thermal performance

High power cycling capability

CONFIGURATIONS

Buck

Boost

Full-bridge

Half-bridge

Phase leg

Single

APPLICATIONS

DC-DC converters

Battery chargers

Switching and resonant power supplies

DC choppers

Temperature and lighting controls

Motor drives

E-bikes and electric and hybrid vehicles

Solar inverters

Induction heaters

www.ixys.com

Mini SMPD Overview

To help make even lighter, more eﬃcient, and compact power conversion systems possible, IXYS

oﬀers a smaller version of the SMPD package – the Mini SMPD, which is illustrated in Figure 2

below. Just like in the SMPD, an electrical isolation of 4500V between the semiconductor chip and

base copper is achieved with the Direct Copper Bond (DCB) technology, which is a well-known

technique for high-voltage isolation and provides excellent thermal conductivity and high-current

carrying capability. The structure consists of three layers (Copper, Alumina substrate, and

Copper); the Alumina substrate is a ceramic layer situated between the two copper layers and

supports the necessary voltage isolation. The expansion coeﬃcient of the DCB is close to that of

Silicon, resulting in reliable high-temperature cycling. Compared to standard packages, the Mini

SMPD exhibits better electromagnetic interference (EMI) performance due to its lower parasitic

capacitances and inductances and reduced current loops.

The IXYS Mini SMPD package can be utilized in a wide variety of industrial, consumer, medical,

and green-energy applications, including inverters, battery chargers, switch-mode and resonant

power supplies, temperature and lighting controls, high-frequency plasma generators, motor

drives, E-bikes, and electric and hybrid vehicles.

Figure 2: Mini SMPD package

Mini SMPD ADVANTAGES

• High-voltage electrical isolation (4500V)

• Lower thermal resistance compared to standard packages (TO-247, TO-264, SOT-227B)

• High component density/ﬂexible conﬁgurations (H-bridge, half-bridge, boost, buck, phase-leg)

• High current carrying capability

• Low parasitic capacitances and inductances

• Low package weight (5g)

• Better protection against vibrations and g-forces

Light and compact Mini SMPD package

Mini-SMPD

Height=5.3mm

SMPD

Height=5.3mm

SOT-227

Height=8.92mm

TO-264

Height=4.8mm

PLUS247

Height=4.8mm

The ﬁgure above illustrates a comparison of the Mini-SMPD with other industry standard packages. The volume of it (3cm

) is only at 60% of that of the

SMPD (1.8cm

). But the Mini SMPD is able to maintain a high voltage isolation of 4.5kV and weighs just 5g.

Mini SMPD Package Outlines

January 2013

www.ixys.com

PBNSMPD_1_0

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