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MPC8323ECVRADDC

Description
JTAG Debuggers
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,82 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MPC8323ECVRADDC Overview

JTAG Debuggers

MPC8323ECVRADDC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeBGA
package instructionHBGA, BGA516,26X26,40
Contacts516
Reach Compliance Codeunknown
ECCN code5A002
Address bus width
bit size32
boundary scanYES
maximum clock frequency66.67 MHz
External data bus width
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B516
JESD-609 codee2
length27 mm
low power modeYES
Humidity sensitivity level3
Number of terminals516
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHBGA
Encapsulate equivalent codeBGA516,26X26,40
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)260
power supply1,1.8/2.5,3.3 V
Certification statusNot Qualified
Maximum seat height2.55 mm
speed266 MHz
Maximum supply voltage1.05 V
Minimum supply voltage0.95 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver (Sn/Ag)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width27 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Freescale Semiconductor
Technical Data
Document Number: MPC8323EEC
Rev. 4, 09/2010
MPC8323E
PowerQUICC II Pro Integrated
Communications Processor
Family Hardware Specifications
This document provides an overview of the MPC8323E
PowerQUICC II Pro processor features. The MPC8323E is a
cost-effective, highly integrated communications processor
that addresses the requirements of several networking
applications, including ADSL SOHO and residential
gateways, modem/routers, industrial control, and test and
measurement applications. The MPC8323E extends current
PowerQUICC offerings, adding higher CPU performance,
additional functionality, and faster interfaces, while
addressing the requirements related to time-to-market, price,
power consumption, and board real estate. This document
describes the MPC8323E, and unless otherwise noted, the
information also applies to the MPC8323, MPC8321E, and
MPC8321.
To locate published errata or updates for this document, refer
to the MPC8323E product summary page on our website
listed on the back cover of this document or contact your
local Freescale sales office.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 9
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 10
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 11
DDR1 and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . 13
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Ethernet and MII Management . . . . . . . . . . . . . . . . . 19
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
UTOPIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
HDLC, BISYNC, Transparent, and Synchronous
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 49
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
System Design Information . . . . . . . . . . . . . . . . . . . 76
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 79
Document Revision History . . . . . . . . . . . . . . . . . . . 80
© 2010 Freescale Semiconductor, Inc. All rights reserved.

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