REVISIONS
LTR
A
DESCRIPTION
Add device type 02 and RHA designator “R” requirements.
Make changes to 1.2.2, 1.4, and Table I. Make a change to case outline X
pin 32 under Figure 2. Add paragraphs 1.5, 4.4.4.1, and Table IIB.
Delete AV
CC
, DV
CC
, and t
CMIN
tests as specified under Table I. - ro
Add device type 03 tested at low dose rate. Make change to paragraphs 1.2.2,
1.4, and 1.5. Make changes to footnotes 1/, 2/, and 3/ as specified under
Table I. Make change to Table IIB and paragraph 4.4.4.1. -rrp
Add single event latchup (SEL) testing information for device types 02 and 03.
Add paragraph 1.4.1. Delete device class M references. - ro
Add note under Figure 2 terminal connections. - ro
DATE (YR-MO-DA)
08-10-31
APPROVED
R. HEBER
B
C
D
11-06-14
13-06-18
15-12-10
C. SAFFLE
C. SAFFLE
C. SAFFLE
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
REV
SHEET
PREPARED BY
DAN WONNELL
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
RAYMOND MONNIN
APPROVED BY
RAYMOND MONNIN
DRAWING APPROVAL DATE
04-10-25
REVISION LEVEL
D
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL-LINEAR, A/D
CONVERTER, 14-BIT, 80 MSPS, MONOLITHIC
SILICON
SIZE
A
CAGE CODE
67268
SHEET
1 OF 16
5962-04230
DSCC FORM 2233
APR 97
5962-E110-16
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and
space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
R
04230
02
V
X
C
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
AD6645
AD6645
AD6645
Operating temperature
-35C
T
C
+85C
-55C
T
A
+125C
-55C
T
A
+125C
Circuit function
A/D converter, 14-bit, 80 MSPS
Radiation hardened A/D converter,
14-bit, 80 MSPS
Radiation hardened A/D converter,
14-bit, 80 MSPS
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Q or V
Device requirements documentation
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
See figure 1
Terminals
52
Package style
Quad flat pack with non-conductive tie bars
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-04230
SHEET
D
2
1.3 Absolute maximum ratings. 1/
Analog supply voltage (AV
CC
) .................................................................................................. 0 V dc to 7 V dc
Digital supply voltage (DV
CC
) ...................................................................................................
Analog input voltage .................................................................................................................
Analog input current .................................................................................................................
Digital input voltage ..................................................................................................................
Digital output current ................................................................................................................
Junction temperature (T
J
) .........................................................................................................
Lead temperature (soldering, 10 seconds) ...............................................................................
Storage temperature range ......................................................................................................
Thermal resistance, junction-to-case (θ
JC
) ...............................................................................
1.4 Recommended operating conditions.
Analog supply voltage (AV
CC
) .................................................................................................. 4.75 V dc to 5.25 V dc
Digital supply voltage (DV
CC
) ................................................................................................... 3.0 V dc to 3.6 V dc
Case operating temperature range (T
C
) for device type 01 ...................................................... -35C to +85C
Ambient operating temperature range (T
A
) for device types 02 and 03 ................................... -55C to +125C
1.4.1 Operating performance characteristics.
AC performance: T
A
= +25C, AV
CC
= 5 V, DV
CC
= 3.3 V, f
C
= 82 MSPS, f
IN
= 175 MHz.
Signal to noise ratio (SNR) at -1 dBFS .................................................................................
Signal to noise and distortion (SINAD) at -1 dBFS ...............................................................
Worst case second or third harmonic (2nd to 3rd) at -1 dBFS ..............................................
Worst case fourth or higher harmonic (4th plus) at -1 dBFS .................................................
1.5 Radiation features:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s):
Device type 02 ...................................................................................................................... 100 krads(Si) 2/
Maximum total dose available (dose rate
10 mrads(Si)/s):
Device type 03 ...................................................................................................................... 50 krads(Si) 3/
Single event phenomenon (SEP):
No single event latchup (SEL) occurs at effective linear energy transfer (LET) (see 4.4.4.2):
2
Device types 02 and 03: .......................................................................................................
80 MeV-cm /mg 4/
0 V dc to 7 V dc
0 V dc to AV
CC
25 mA
0 V dc to AV
CC
4 mA
+175C
+300C
-65C to +150C
7.2C/W
71 dB
70 dB
-78 dBc
-91 dBc
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A.
3/ For device type 03, radiation end point limits for the noted parameters are guaranteed for the conditions specified in
MIL-STD-883, method 1019, condition D.
4/ Limits are characterized at initial qualification and after any design or process changes that may affect the SEP
characteristics, but are not production lot tested unless specified by the customer through the purchase order or contract.
For more information on single event effect (SEE) test results, customers are requested to contact the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-04230
SHEET
D
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
ASTM INTERNATIONAL (ASTM)
ASTM F1192
-
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion
Irradiation of semiconductor Devices.
(Copies of these documents are available online at
http://www.astm.org
or from ASTM International, 100 Barr Harbor Drive,
P.O. Box C700, West Conshohocken, PA, 19428-2959).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-04230
SHEET
D
4
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Timing waveforms. The timing waveforms shall be as specified on figure 3.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the
full case operating temperature range for device type 01 and ambient operating temperature range for device types 02 and 03.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance
submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the
manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall
be provided with each lot of microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-04230
SHEET
D
5
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